公开(公告)号：US10099336B2

公开(公告)日：2018-10-16

申请号：US15805890

申请日：2017-11-07

Applicant: Darex, LLC

Inventor： Daniel T. Dovel

IPC: B24B3/54 ,  B24B49/10 ,  B24B51/00 ,  B24B21/00

Abstract: A tool sharpener has a guide assembly to support a cutting tool adjacent an abrasive medium. A drive assembly advances the abrasive medium with respect to the guide assembly. A control mechanism provides a first control input value to move the medium and achieve a first material take off (MTO) rate during a coarse sharpening operation upon the tool. A second control input value from the control circuit moves the medium to achieve a lower, second MTO rate during a fine sharpening operation. The control mechanism transitions the medium from the first MTO rate to the second MTO rate responsive to a timer mechanism indicating a conclusion of a predetermined elapsed time interval.

公开(公告)号：US20180250788A1

公开(公告)日：2018-09-06

申请号：US15891722

申请日：2018-02-08

Applicant: Applied Materials, Inc.

Inventor： Eric LAU ,  Chih Chung CHOU ,  Charles C. GARRETSON ,  Jeonghoon OH ,  King Yi HEUNG

IPC: B24B7/22 ,  B24B13/005 ,  B24B49/10 ,  B24B37/07

CPC classification number: B24B7/228 ,  B24B13/005 ,  B24B37/07 ,  B24B49/10 ,  H01L21/304 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/3212 ,  H01L22/20

Abstract: A method is provided to minimize travel distance and time between correction locations on a substrate when polishing a local area of a substrate, such as a semiconductor wafer, using a location specific polishing module. A correction profile is determined and a recipe based on the correction profile is used to polish a substrate. A polishing pad assembly traverses between a first correction location and a second correction location using the combined motion of a substrate support chuck and a support arm coupled at a first end thereof to the polishing pad assembly. The chuck rotates about a center axis thereof. The positioning arm may sweep about a vertical axis disposed through a second end of the support arm. The combined motion of the chuck and the positioning arm causes the polishing pad assembly to form a spiral shaped polishing path on the substrate.

公开(公告)号：US09839983B2

公开(公告)日：2017-12-12

申请号：US14934433

申请日：2015-11-06

Applicant: Tongtai Machine & Tool Co., Ltd.

Inventor： Hsin-Pao Chen ,  Chung-Kuang Lin ,  Jian-Tzung Ou ,  Jui-Hsiung Yen

IPC: B24B1/00 ,  B24B1/04 ,  B24B49/14 ,  B24B51/00 ,  B24B49/10 ,  B23B37/00 ,  B23Q1/00 ,  B23Q1/48 ,  B23Q5/10 ,  B06B3/00 ,  B23B31/02

CPC classification number: B24B1/04 ,  B06B3/00 ,  B23B31/02 ,  B23B37/00 ,  B23B2260/108 ,  B23Q1/0009 ,  B23Q1/4828 ,  B23Q5/10 ,  B23Q2230/004 ,  B24B49/10 ,  B24B49/14 ,  B24B51/00

Abstract: A machine tool of high-frequency vibration is provided. A main shaft structure of the machine tool comprises a rotating shaft, the end of which is provided with a tool holder chuck for fixing a tool holder; the upper portion of which is provided with a rotating coil portion; the main shaft structure is correspondingly provided with a stationary coil portion; and the tool holder is provided with a high-frequency vibration module. By non-contact coils, an external electric power/signal can be transmitted into the high-frequency vibration module to avoid a wear phenomenon in a contact-rotating electrode. Because the inductive coil is arranged outside of the tool holder, the manufacturing cost of the tool holder is reduced, and the convenience of changing the tool holder is increased. Moreover, the machining stability and efficiency of the tool holder are improved by a control method of sensing/feedback signals with wireless transmission.

公开(公告)号：US09724800B2

公开(公告)日：2017-08-08

申请号：US14753367

申请日：2015-06-29

Applicant: LG SILTRON INCORPORATED

Inventor： Kee Yun Han ,  Eun Suck Choi

IPC: B24B37/08 ,  B24B49/10 ,  B24B37/26 ,  B24B7/22

CPC classification number: B24B49/10 ,  B24B7/228 ,  B24B37/08 ,  B24B37/26

Abstract: Disclosed is a wafer polishing apparatus including a base, a lower surface plate disposed on the upper surface of the base, an upper surface plate disposed on the lower surface plate and a first shape adjustment unit configured to deform the shape of the lower surface of the upper surface plate so that the lower surface of the upper surface plate has one of a concave shape, a flat shape and a convex shape in a first direction, and the first direction is a direction from the lower surface plate to the upper surface plate.

公开(公告)号：US09669514B2

公开(公告)日：2017-06-06

申请号：US14725367

申请日：2015-05-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd

Inventor： Jiun-Yu Lai ,  Ying-Hsiu Tsai ,  Wei-Chen Chang ,  Yi-Ching Chiou

IPC: B24B49/10 ,  B24B37/005 ,  B24B37/04 ,  B24B53/017 ,  H01L21/306 ,  H01L21/67

CPC classification number: B24B49/105 ,  B24B37/005 ,  B24B37/042 ,  B24B53/017

Abstract: Polishing systems and methods for polishing a substrate are provided. The polishing system includes a polishing assembly having a platen and a polishing pad over the platen. The polishing system also includes a substrate carrying assembly configured to engage a substrate to the polishing pad. The polishing system further includes a thickness sensing assembly configured to monitor a thickness of the polishing pad.

公开(公告)号：US20170136614A1

公开(公告)日：2017-05-18

申请号：US15322451

申请日：2015-06-19

Applicant: HITACHI KOKI CO., LTD.

Inventor： Yuuki TAKEDA

IPC: B25F5/00 ,  B24B49/10 ,  B24B23/02

CPC classification number: B25F5/008 ,  B24B23/02 ,  B24B23/028 ,  B24B49/10 ,  B25F5/00

Abstract: An electric tool is provided. The electric tool prevents anomalies in motor rotation due to dust and moisture sucked in together with a cooling wind, and is configured such that rotational position detection operations and switch operations are not affected. In the electric tool which drives a brushless DC motor using a controller, a magnetic body for rotational position detection is provided on a rotation shaft which can rotate integrally with a rotor, Hall ICs are provided to detect the rotational position of the magnetic body and output a position signal to the controller, and the magnetic body and the Hall ICs mounted on a substrate are arranged in a region isolated from the wind path of the cooling wind generated by rotation of a cooling fan. The Hall ICs are accommodated in a housing filled with resin.

公开(公告)号：US20170095901A1

公开(公告)日：2017-04-06

申请号：US15283212

申请日：2016-09-30

Applicant: EBARA CORPORATION

Inventor： Akira NAKAMURA

IPC: B24B37/013 ,  B24B49/10 ,  B24B37/22 ,  B24B37/20

CPC classification number: B24B37/013 ,  B24B37/205 ,  B24B37/22 ,  B24B37/26 ,  B24B49/04 ,  B24B49/105

Abstract: The polishing apparatus has: a polishing pad that has a polishing surface to polish a semiconductor wafer; a polishing table to which a back surface of the polishing pad on an opposite side of the polishing surface can be attached; a top ring that is opposed to the polishing surface, and can hold the semiconductor wafer; and an eddy current sensor that is arranged in the polishing table, and detects an end point of polishing. The polishing table has on an attachment surface a projection member projecting from the attachment surface to which the polishing pad is attached. The back surface of the polishing pad has a concave portion in a portion opposed to the projection member, and at least a part of the eddy current sensor is arranged inside the projection member.

公开(公告)号：US20160284615A1

公开(公告)日：2016-09-29

申请号：US15173584

申请日：2016-06-03

Applicant: Applied Materials, Inc.

Inventor： Tomohiko Kitajima ,  Jeffrey Drue David ,  Jun Qian ,  Taketo Sekine ,  Garlen C. Leung ,  Sidney P. Huey

IPC: H01L21/66 ,  H01L21/321 ,  B24B49/10 ,  H01L21/311 ,  B24B37/013 ,  H01L21/3105 ,  H01L21/67

CPC classification number: H01L22/26 ,  B24B37/013 ,  B24B49/105 ,  H01L21/31053 ,  H01L21/3212 ,  H01L21/67075 ,  H01L21/67092 ,  H01L21/67253 ,  H01L22/14 ,  H01L22/20 ,  H01L22/34

Abstract: A method of controlling polishing includes storing a base measurement, the base measurement being a measurement of a substrate after deposition of at least one layer overlying a semiconductor wafer and before deposition of an outer layer over the at least one layer, after deposition of the outer layer over the at least one layer and during polishing of the outer layer on substrate, receiving a sequence of raw measurements of the substrate from an in-situ monitoring system, normalizing each raw measurement in the sequence of raw measurement to generate a sequence of normalized measurements using the raw measurement and the base measurement, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least the sequence of normalized measurements.

Abstract translation: 控制抛光的方法包括存储基底测量，所述基底测量是沉积覆盖在半导体晶片上的至少一个层之后并且在外层沉积外层之后在所述至少一个层上沉积之后的衬底的测量值 层，并且在衬底上的外层的抛光期间，从原位监测系统接收衬底的原始测量序列，对原始测量序列中的每个原始测量进行归一化，以生成标准化的序列 使用原始测量和基础测量的测量，以及至少基于归一化测量的顺序来确定抛光终点或抛光速率的调整中的至少一个。

公开(公告)号：US20160229021A1

公开(公告)日：2016-08-11

申请号：US14797854

申请日：2015-07-13

Applicant: Glebar Acquisition, LLC

Inventor： John Bannayan ,  Robert C. Gleason

IPC: B24B5/307 ,  B24B49/10

CPC classification number: B24B5/307 ,  B24B5/04 ,  B24B5/18 ,  B24B5/22 ,  B24B5/32 ,  B24B5/37 ,  B24B5/38 ,  B24B49/10

Abstract: A motorized blade rest apparatus for a grinding system includes a carriage, a ram assembly, a work rest assembly, a motor, and a computer processor. The carriage moves a regulating wheel along a first axis towards and away from a work wheel. The ram assembly, which moves along a second axis parallel to the first axis, supports the carriage and the work rest assembly. The work rest assembly includes first and second slide portions and a work rest blade. The first slide portion is mounted on the ram assembly. The second slide portion, which is movable relative to the first slide portion, moves along a third axis perpendicular to the first axis. The work rest blade is mounted on the second slide portion. The motor is coupled to the second slide portion, and the computer processor controls the motor to move the second slide portion along the third axis.

Abstract translation: 一种用于磨削系统的电动刀片固定装置，包括滑架，柱塞组件，工作台组件，马达和计算机处理器。 滑架沿着第一轴线将调节轮移动到工作轮和远离工作轮。 沿着平行于第一轴线的第二轴线移动的柱塞组件支撑滑架和工作台组件。 工作台组件包括第一和第二滑动部分和工作台面。 第一滑动部分安装在压头组件上。 可相对于第一滑动部分移动的第二滑动部分沿着垂直于第一轴线的第三轴线移动。 工作叶片安装在第二滑动部分上。 电动机联接到第二滑动部分，并且计算机处理器控制电动机沿着第三轴线移动第二滑动部分。

公开(公告)号：US09321146B1

公开(公告)日：2016-04-26

申请号：US13631802

申请日：2012-09-28

Applicant: Western Digital (Fremont), LLC

Inventor： Steven C. Rudy ,  Mahendra Pakala ,  Prakash Mani ,  Eric R. McKie

IPC: B24B49/10

CPC classification number: B24B49/10

Abstract: Systems and methods for shaping leads of electronic lapping guides to reduce calibration error are provided. One such system includes a device configured to generate predictable resistance for leads of an electronic lapping guide, the device including a lapping surface, and an ELG configured to provide information indicative of a degree of lapping performed on the lapping surface, the ELG including a first electrical lead, a second electrical lead spaced apart from the first electrical lead, and a resistive element between the first electrical lead and the second electrical lead, the resistive element including a right segment, a left segment, and a middle segment that abuts each of the right segment and the left segment, where the right segment is spaced apart from the left segment and the middle segment is adjacent to the lapping surface, where the first and second electrical leads are recessed from the middle segment.

Abstract translation: 提供了用于使电子研磨导轨成形引线减少校准误差的系统和方法。 一种这样的系统包括被配置为为电子研磨导向器的引线产生可预测电阻的装置，该装置包括研磨表面，以及被配置为提供指示在研磨表面上进行的研磨程度的信息的ELG，所述ELG包括第一 电引线，与第一电引线间隔开的第二电引线，以及在第一电引线和第二电引线之间的电阻元件，电阻元件包括右段，左段和中间段， 右段和左段，其中右段与左段和中间段间隔开，与研磨表面相邻，其中第一和第二电引线从中间段凹陷。