摘要:
The invention relates to an LED lamp for warm white light having an LED module consisting of at least one color-converted blue or UV LED, and at least one monochromatic LED, preferably a red LED, in the case of which the mixed spectrum produces white light with a color temperature CCT of between 1500K and 2400K, preferably 1700K and 2100K at room temperature, and between 1800K and 2400K, preferably 2100K and 2300K at a stationary operating temperature of, for example, between 70° C. and 80° C. of the LED lamp.
摘要:
An LED light, including: a red (R) light, a green (G) light, and a blue (B) light. Each light includes a light-emitting surface. The surface curvatures of light-emitting surfaces of three lights are not equal to one another. Each curvature radius of the light-emitting surfaces of the three lights satisfies the following optical formula: sin i/sin γ=n, where i represents an incident angle on the light-emitting surface, γ represents a refraction angle of the incident angle on the light-emitting surface, and n represents a refractive index of a medium. As a result, the refraction angles of the three lights on corresponding light-emitting surface are coincident.
摘要翻译:LED灯,包括:红色(R)光,绿色(G)光和蓝色(B)光。 每个光包括发光表面。 三个光的发光面的表面曲率彼此不相等。 三个光的发光面的每个曲率半径满足以下光学公式:sin i / sinγ= n,其中,i表示发光面上的入射角,γ表示入射角的折射角 发光面,n表示介质的折射率。 结果,相应的发光表面上的三个光的折射角一致。
摘要:
A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.
摘要:
The present disclosure is to provide an optoelectronic device. The optoelectronic device comprises a heat dispersion substrate; an insulative protection layer on the heat dispersion substrate, wherein the insulative protection layer comprises AlInGaN series material; and an optoelectronic unit comprising an epitaxial structure comprising multiple layers on the insulative protection layer, wherein at least one layer of the epitaxial structure comprises III-V group material devoid of nitride.
摘要:
The light emitting device package of the present invention has a longitudinal direction (as viewed from above) and a transverse direction perpendicular to the longitudinal direction, and is provided with a first and second lead-frame lined-up in the longitudinal direction and molded resin holds the first and second lead-frames integrally. The package is characterized in that the first lead-frame has a main body and an extension that extends from the main body with a narrowed width towards the second lead-frame. Further, a recess is established in the bottom surface of the first lead-frame, and at least part of the exposed region of the bottom surface of the extension is separated from the exposed region of the bottom surface of the main body by the molded resin that fills the recess.
摘要:
A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.
摘要:
A light emitting unit includes a light source device and a reflector. The light source device extends in parallel with an extension direction, and is capable of providing a light beam. The reflector is configured under the light source device and extends in parallel with the extension direction. The reflector has a first protrusion and a pair of second protrusions located on two sides of the first protrusion, the first protrusion has a peak portion and two trough portions, the second protrusion has a peak portion and a trough portion, and the two trough portions of the first protrusion are respectively connected to the trough portions of the two second protrusions to provide a fluctuant reflection surface, and a height of a cross section contour of the pair of the second protrusions in parallel with the extension direction is decreased from a center to two ends of the reflector.
摘要:
Lead frames for light emitting device packages, light emitting device packages, and illumination apparatuses employing the light emitting device packages. The lead frame including a plurality of mounting portions on which a plurality of light emitting device chips are mounted; a plurality of connection portions for circuit connecting the plurality of light emitting device chips; a terminal portion extended from the plurality of connection portions. The light emitting device package is formed by directly mounting the plurality of light emitting device chips on the lead frame and packaging the mounted light emitting device chips on the lead frame. The lead frame includes a plurality of connection portions for circuit connecting the plurality of light emitting device chips and a terminal portion in which a part of a circuit thereof is exposed.
摘要:
A lighting device using an electroluminescent material, in which color mixing and dimming can be performed by a simple method, is provided. A lighting device including a first light-emitting element and a second light-emitting element which emits light having a wavelength longer than that of light emitted from the first light-emitting element and starts to emit light at a lower voltage than the first light-emitting element, is provided. The first light-emitting element and the second light-emitting element are connected in parallel, whereby a mixed color of emission colors of the first light-emitting element and the second light-emitting element is controlled by a voltage applied to the first light-emitting element and the second light-emitting element.
摘要:
An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.