- 专利标题： Method of attaching a light emitting device to a support substrate
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申请号： US14869625申请日： 2015-09-29
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公开(公告)号： US09431581B2公开(公告)日： 2016-08-30
- 发明人: Daniel Alexander Steigerwald , Jerome Chandra Bhat , Salman Akram
- 申请人： KONINKLIJKE PHILIPS N.V.
- 申请人地址： NL Eindhoven
- 专利权人： Koninklijke Philips N.V.
- 当前专利权人： Koninklijke Philips N.V.
- 当前专利权人地址： NL Eindhoven
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L33/48 ; H01L33/62 ; H01L33/50 ; H01L25/075 ; H01L25/00 ; H01L33/46 ; H01L33/58 ; H01L33/00
摘要：
A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.
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