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公开(公告)号:US11362031B2
公开(公告)日:2022-06-14
申请号:US16809629
申请日:2020-03-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Choonghyun Lee , Joonyong Choe , Youngju Lee
IPC: H01L23/522 , H01L27/108 , H01L21/768
Abstract: An integrated circuit device includes a conductive line including a metal layer and an insulation capping structure covering the conductive line. The first insulation capping structure includes a first insulation capping pattern that is adjacent to the metal layer in the insulation capping structure and has a first density, and a second insulation capping pattern spaced apart from the metal layer with the first insulation capping pattern therebetween and having a second density that is greater than the first density. In order to manufacture the integrated circuit device, the conductive line having a metal layer is formed on a substrate, a first insulation capping layer having the first density is formed directly on the metal layer, and a second insulation capping layer having the second density that is greater than the first density is formed on the first insulation capping layer.
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公开(公告)号:US11322818B2
公开(公告)日:2022-05-03
申请号:US16631008
申请日:2018-07-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junsig Kum , Yoongeon Kim , Seungtae Ko , Hyunjin Kim , Youngju Lee
Abstract: The present invention relates to a communication technique which fuses a 5G communication system with IoT technology to support higher data transmission rates after a 4G system, and system thereof. In addition, the present invention provides an antenna assembly which comprises: an antenna array which includes at least one antenna; a film layer which is made of at least one insulating material, spaced apart from the antenna array by a predetermined first distance and joined to one side of a window; and an installation aid which has a surface fixed and attached to the window and the other surface on which an antenna array seating portion is formed.
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公开(公告)号:US11233323B2
公开(公告)日:2022-01-25
申请号:US16739469
申请日:2020-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Youngsub Kim , Jungmin Park , Dongsik Shin , Youngju Lee , Jongwook Zeong
Abstract: An antenna module is provided to reduce the radio waves radiated toward a back lobe of the antenna module, and includes a printed circuit board (PCB) including at least one insulating layer, at least one antenna array disposed on an upper surface of the PCB, and at least one metal structure disposed on the upper surface of the PCB configured to shift a phase of radio waves radiated by the at least one antenna array and flowing along the upper surface of the PCB. The radio wave whose phase is shifted by passing through the metal structure is in a destructive interference relationship with a radio wave which is not affected by the metal structure thereby reducing the radio waves radiated toward a back lobe of the antenna module.
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公开(公告)号:US11145949B2
公开(公告)日:2021-10-12
申请号:US16319963
申请日:2017-08-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Kwanghyun Baek , Hyunjin Kim , Byungchul Kim , Jungmin Park , Youngju Lee , Jinsu Heo
Abstract: The present invention relates to an antenna apparatus and an electronic device comprising the same. The antenna apparatus according to one embodiment of the present invention comprises an array antenna formed on a metal case of an electronic device, wherein the array antenna comprises at least two antenna elements, the at least two antenna elements may operate in the same frequency band. According to one embodiment of the present invention, it is possible to provide an antenna apparatus capable of reducing heat generation and increasing the radiation efficiency of an antenna.
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45.
公开(公告)号:US10938116B2
公开(公告)日:2021-03-02
申请号:US15975155
申请日:2018-05-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungyub Lee , Junsig Kum , Yoongeon Kim , Byungchul Kim , Youngju Lee
Abstract: Techniques related to a 5th generation (5G) or pre-5G communication system to support higher data rates after a 4th generation (4G) communication system such as long term evolution (LTE) ae provided. A reflector is provided that is configured to change a direction of a beam incident in a first direction to a second direction different from the first direction, so that a receiving entity positioned in a shadow area caused by an object can receive the beam. Therefore, the reflector removes the shadow area at which the beam does not arrive in a 5G wireless communication system.
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公开(公告)号:US10381749B2
公开(公告)日:2019-08-13
申请号:US15671623
申请日:2017-08-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jungmin Park , Byungchul Kim , Hyunjin Kim , Kwanghyun Baek , Youngju Lee , Jinsu Heo
Abstract: An antenna device for providing a higher data transmission rate in a wireless communication system is provided. The antenna device includes a first radiating body mounted to a side surface of a multiple layer circuit board to transmit and receive a wireless signal and a second radiating body mounted to a top surface of the multiple layer circuit board and electrically connected to the first radiating body to transmit and receive the wireless signal together with the first radiating body.
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公开(公告)号:US12160047B2
公开(公告)日:2024-12-03
申请号:US18152311
申请日:2023-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sanghoon Park , Jungho Park , Kwanghyun Baek , Youngju Lee , Jungyub Lee , Juneseok Lee , Dohyuk Ha , Jinsu Heo
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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公开(公告)号:US20240321732A1
公开(公告)日:2024-09-26
申请号:US18736075
申请日:2024-06-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Choonghyun Lee , Joonyong Choe , Youngju Lee
IPC: H01L23/522 , H01L21/768 , H10B12/00
CPC classification number: H01L23/5228 , H01L21/76805 , H01L23/5226 , H10B12/482
Abstract: An integrated circuit device includes a conductive line including a metal layer and an insulation capping structure covering the conductive line. The first insulation capping structure includes a first insulation capping pattern that is adjacent to the metal layer in the insulation capping structure and has a first density, and a second insulation capping pattern spaced apart from the metal layer with the first insulation capping pattern therebetween and having a second density that is greater than the first density. In order to manufacture the integrated circuit device, the conductive line having a metal layer is formed on a substrate, a first insulation capping layer having the first density is formed directly on the metal layer, and a second insulation capping layer having the second density that is greater than the first density is formed on the first insulation capping layer.
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49.
公开(公告)号:US12051860B2
公开(公告)日:2024-07-30
申请号:US18323809
申请日:2023-05-25
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yoongeon Kim , Seungtae Ko , Hyunjin Kim , Jungmin Park , Junsig Kum , Youngju Lee
CPC classification number: H01Q9/0485 , H01Q1/241 , H01Q21/0006
Abstract: An antenna module of a wireless communication system is provided. The antenna module includes a radiator comprising a top face to which a radio wave is radiated, a dielectric material disposed on a bottom face of the radiator, the bottom face of the radiator being opposite to the top face of the radiator, a feeding unit disposed on a bottom face of the dielectric material, the feeding unit being configured to supply an electric signal to the radiator through the dielectric material, and a support unit disposed on the bottom face of the dielectric material, the support unit comprising a metallic material.
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公开(公告)号:US11848715B2
公开(公告)日:2023-12-19
申请号:US17415385
申请日:2019-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byungchul Kim , Sanghoon Park , Seungtae Ko , Seungku Han , Youngju Lee
CPC classification number: H04B17/29 , G01R29/105 , H01Q21/00
Abstract: The present invention relates to a communication technique for converging IoT technology with a 5G communication system for supporting a higher data transmission rate beyond a 4G system, and a system therefor. The present disclosure may be applied to an intelligent service (for example, a smart home, a smart building, a smart city, a smart car or connected car, health care, digital education, retail business, a security and safety-related service, etc.) on the basis of 5G communication technology and IoT-related technology. The present invention provides a device for testing an antenna module, the device comprising: a seating unit which has seated thereon a first antenna module comprising a plurality of antenna elements; a second antenna module which comprises a plurality of antenna elements and is disposed so as to face the seating unit so as to be capable of emitting a radio wave toward the first antenna module; and a control unit which is electrically connected to the second antenna module and tests the performance of the first antenna module by controlling the second antenna module by grouping each antenna element of the second antenna module into at least one antenna element group.
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