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41.发明申请公开(公告)号：US20200219919A1
公开(公告)日：2020-07-09
申请号：US16637895
申请日：2018-08-08
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Takehiko TANAKA , Zhenyu CHEN , Zhewen MEI
IPC: H01L27/146 , B29C45/14 , B29C45/00 , B29C45/37 , H04N5/225
Abstract: Disclosed a photosensitive assembly, an imaging module, a smart terminal, and a method and a mould for manufacturing the photosensitive assembly. The photosensitive assembly comprises: a circuit board having a rectangular-shaped rigid board region and comprising a flexible board extension portion extending from the rigid board region, wherein the rigid board region has a lamination side and a non-lamination side, and the rigid board region has a lamination region on the lamination side; a photosensitive element mounted in the rigid board region of the circuit board; and a molded portion formed on the rigid board region, surrounding the photosensitive element, and extending towards the photosensitive element and coming into contact with the photosensitive element, the molded portion having an inner side surface, an outer side surface and a top surface, the molded portion not covering the lamination region of the rigid board region, and the top surface having a flat portion, wherein the top surface of a part of the molded portion on the lamination side has a descending portion, the descending portion is located between the flat portion and the outer side surface of the molded portion and is lower than the flat portion, and the outer side surface of a part of the molded portion on the non-lamination side is perpendicular to the flat portion.
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42.发明申请公开(公告)号：US20200007726A1
公开(公告)日：2020-01-02
申请号：US16484292
申请日：2018-02-08
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Mingzhu WANG , Zhongyu LUAN , Liefeng CHEN , Duanliang CHENG , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG
IPC: H04N5/225
Abstract: The present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.
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43.发明申请公开(公告)号：US20190134866A1
公开(公告)日：2019-05-09
申请号：US16307151
申请日：2017-06-06
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Zhen HUANG
IPC: B29C45/14
Abstract: A manufacturing equipment, for manufacturing a molded circuit board assembly of a camera module, includes an upper mould, a lower mould, a mould fixing arrangement, and a temperature controlling arrangement, wherein the mould fixing arrangement controls opening and closing of the upper mould and the lower mound. When a substrate board is placed between the upper mould and the lower mound, a molding cavity is further formed between the upper mould and the lower mound, wherein in the molding cavity, a supporting frame forming groove is formed for forming the module support, and a light window forming element is used for forming a light window. The temperature controlling arrangement provides a molding temperature, the module supporting frame is integrally molded on the substrate board to form the molded circuit board assembly.
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44.发明申请公开(公告)号：US20180091713A1
公开(公告)日：2018-03-29
申请号：US15679151
申请日：2017-08-16
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Zhenyu CHEN , Nan GUO , Takehiko TANAKA , Bojie ZHAO , Zilong DENG
CPC classification number: H04N5/2257 , B29C33/44 , B29C43/18 , B29C43/36 , B29C43/52 , B29C45/0025 , B29C45/14336 , B29C45/14467 , B29C45/14655 , B29C45/14819 , B29C45/40 , B29C70/72 , B29C70/88 , B29D11/00807 , B29K2101/12 , B29K2995/0003 , B29K2995/0018 , B29L2031/3425 , B29L2031/3437 , B29L2031/764 , G02B7/022 , G02B7/10 , G02B13/0085 , H04N5/2253 , H04N5/2254 , H05K1/0274 , H05K1/181 , H05K1/185 , H05K3/284 , H05K2201/10121 , H05K2203/0195 , H05K2203/1316 , H05K2203/1327
Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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45.发明申请公开(公告)号：US20180035030A1
公开(公告)日：2018-02-01
申请号：US15461409
申请日：2017-03-16
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Zhenyu CHEN , Nan GUO , Takehiko TANAKA , Bojie ZHAO , Zilong DENG
CPC classification number: H04N5/2257 , B29C33/44 , B29C43/18 , B29C43/36 , B29C43/52 , B29C45/0025 , B29C45/14336 , B29C45/14467 , B29C45/14655 , B29C45/14819 , B29C45/40 , B29C70/72 , B29C70/88 , B29D11/00807 , B29K2101/12 , B29K2995/0003 , B29K2995/0018 , B29L2031/3425 , B29L2031/3437 , B29L2031/764 , G02B7/022 , G02B7/10 , G02B13/0085 , G02B19/0014 , G02B19/0076 , H04N5/2253 , H04N5/2254 , H05K1/0274 , H05K1/181 , H05K1/185 , H05K3/284 , H05K2201/10121 , H05K2203/0195 , H05K2203/1316 , H05K2203/1327 , Y02P70/611
Abstract: A camera module, a molded circuit board assembly, a molded photosensitive assembly and manufacturing method thereof are disclosed. The camera module includes a molded base which is integrally formed with a circuit board through a molding process, wherein a photosensitive element may be electrically connected on the circuit board and at least a portion of a non-photosensitive area portion of the photosensitive element is also connected by the molded base through the molding process. A light window is formed in a central portion of the molded base to provide a light path for the photosensitive element, wherein a cross section of the light window is configured to have a trapezoidal or multi-step trapezoidal shape which has a size increasing from bottom to top to facilitate demoulding and avoiding stray lights.
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Patent Agency Ranking
公开(公告)号：US20180035029A1
公开(公告)日：2018-02-01
申请号：US15460294
申请日：2017-03-16
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Zhenyu CHEN , Nan GUO , Takehiko TANAKA , Bojie ZHAO , Zilong DENG
CPC classification number: H04N5/2253 , H04N5/2254 , H04N5/2257 , H05K1/0274 , H05K1/181 , H05K1/185 , H05K3/0014 , H05K3/284 , H05K3/301 , H05K3/32 , H05K5/0073 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316
Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.
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47.发明申请公开(公告)号：US20170264802A1
公开(公告)日：2017-09-14
申请号：US15473605
申请日：2017-03-30
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Nan GUO , Zhenyu CHEN , Heng JIANG , Zhongyu LUAN , Fengsheng XI , Feifan CHEN , Liang DING
CPC classification number: H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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公开(公告)号：US20170264801A1
公开(公告)日：2017-09-14
申请号：US15473573
申请日：2017-03-29
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie ZHAO , Takehiko TANAKA , Nan GUO , Zhenyu CHEN , Heng JIANG , Zhongyu LUAN , Fengsheng XI , Feifan CHEN , Liang DING
CPC classification number: H04N5/2257 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , H01L27/14625 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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49.发明公开公开(公告)号：US20230317747A1
公开(公告)日：2023-10-05
申请号：US18207357
申请日：2023-06-08
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Nan GUO , Zhenyu CHEN , Takehiko TANAKA , Jingfei HE , Zhen HUANG , Zhongyu LUAN , Feifan CHEN
CPC classification number: H01L27/14618 , H01L27/14627 , H01L27/14683 , H04M1/0264 , H05K1/181 , H04N23/51 , H04N23/54 , H04N23/57 , H05K2201/10121
Abstract: A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.
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公开(公告)号：US20230253423A1
公开(公告)日：2023-08-10
申请号：US18136604
申请日：2023-04-19
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Takehiko TANAKA , Bojie ZHAO , Zhewen MEI , Nan GUO
IPC: H01L27/146 , H04N23/54 , H04N23/55 , H04N23/57
CPC classification number: H01L27/1461 , H01L27/14623 , H01L27/14625 , H04N23/54 , H04N23/55 , H04N23/57
Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the photosensitive element and a fourth partial surface connected to said third portion surface; a third angle between the third partial surface and the optical axis is greater than a fourth angle between the fourth partial surface and the optical axis.
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