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45 条记录 (耗时 0.018 秒)

    Cooler and semiconductor module
    41.
    发明授权
    Cooler and semiconductor module 有权

    公开(公告)号：US11075144B2

    公开(公告)日：2021-07-27

    申请号：US16944345

    申请日：2020-07-31

    申请人： FUJI ELECTRIC CO., LTD. ,  WASEDA UNIVERSITY

    发明人： Ryoichi Kato ,  Hiromichi Gohara ,  Yoshinari Ikeda ,  Tomoyuki Miyashita ,  Yoshihiro Tateishi ,  Shunsuke Numata

    IPC分类号： H01L23/473 ,  H01L23/498

    摘要： Provided is a cooler having high cooling efficiency and low pressure loss of fluid. A cooler includes: a flow-channel part at least including a plate-like fin (top plate) and a plate-like fin (bottom plate); and a continuous groove-like flow channel defined between the top plate and the bottom plate to flow fluid, the cooler being configured to cool semiconductor elements. When the flow-channel part is viewed from the direction parallel to the top plate and intersecting the flow channel, the flow channel has a corrugated shape so that a face of the flow channel closer to the top plate and a face of the flow channel closer to the bottom plate bend in a synchronized manner toward the top plate and the bottom plate.

    Semiconductor device, cooling module, power converting device, and electric vehicle
    42.
    发明授权
    Semiconductor device, cooling module, power converting device, and electric vehicle 有权

    公开(公告)号：US10971431B2

    公开(公告)日：2021-04-06

    申请号：US16361979

    申请日：2019-03-22

    申请人： FUJI ELECTRIC CO., LTD.

    发明人： Kohei Yamauchi ,  Hiromichi Gohara ,  Katsumi Taniguchi

    IPC分类号： H01L23/473 ,  H01L23/467 ,  H01L23/367 ,  H01L23/50 ,  H02M7/00 ,  H02P27/06 ,  H02M7/537

    摘要： A semiconductor device includes: a first cooling device including a plurality of first flow channels through which a fluid flows, between a first main surface and a second main surface opposed to each other; a second cooling device including a plurality of second flow channels through which a fluid flows, between a third main surface and a fourth main surface parallel to the first main surface; a semiconductor element interposed between the first main surface and the third main surface facing each other; and a control terminal penetrating from the third main surface to the fourth main surface in a terminal-penetrating region defined at a predetermined position between the plurality of second flow channels, and electrically connected to a control electrode of the semiconductor element.

    Semiconductor module with reinforcing board
    44.
    发明授权
    Semiconductor module with reinforcing board 有权

    公开(公告)号：US10461012B2

    公开(公告)日：2019-10-29

    申请号：US15066458

    申请日：2016-03-10

    申请人： FUJI ELECTRIC CO., LTD.

    发明人： Akira Morozumi ,  Hiromichi Gohara ,  Takafumi Yamada

    IPC分类号： H01L23/367 ,  H01L23/498 ,  H01L23/31 ,  H01L23/29 ,  H01L23/373 ,  H01L23/473 ,  B23K1/00 ,  H01L23/433 ,  H01L23/00 ,  B23K101/14 ,  B23K101/40 ,  H01L23/16

    摘要： A semiconductor module includes a semiconductor chip; an insulating circuit board that has on one of principal surfaces of an insulating substrate a circuit member electrically connected to the semiconductor chip, and a first metal member disposed in the other principal surface of the insulating substrate; a second metal member that is disposed on a side of an outer edge of the first metal member and is at least partially disposed further toward an outer side than the insulating substrate; a molding resin portion that seals the semiconductor chip, the insulating circuit board, and the second metal member such that a portion of the first metal member and a portion of the second metal member are exposed; a cooler; a first bonding member that bonds the cooler and the first metal member; and a second bonding member that bonds the cooler and the second metal member.