知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

88 records (took 0.046 seconds)

    Electronic device with reworkable midplate attachment structures
    45.
    发明授权
    Electronic device with reworkable midplate attachment structures 有权

    公开(公告)号：US09680975B2

    公开(公告)日：2017-06-13

    申请号：US14029330

    申请日：2013-09-17

    Applicant: Apple Inc.

    Inventor： Sinan Filiz ,  Richard M. Comer ,  Romain A. Teil ,  Sawyer I. Cohen ,  Steven J. Martisauskas

    IPC: G06F1/16 ,  H04M1/02

    CPC classification number: H04M1/0266 ,  G06F1/16 ,  G06F1/1626 ,  G06F1/1637 ,  Y10T29/49718 ,  Y10T29/49826

    Abstract: An electronic device may be provided with a display mounted in a display frame assembly that includes a plastic structure overmolded over a display frame. A housing midplate may be used to provide the electronic device with mechanical rigidity and strength, and may also be used as a sensor plane. For sensor plane applications, accurate placement and assembly of the midplate in the housing can be critical. The housing midplate may be accurately assembled to the display frame using connections formed using welded tabs, welded and screwed nuts, overmolded plastic heat stake structures, or overmolded plastic structures and adhesive. Rework and repair operations may be performed by disconnecting connections such as welds using cutting equipment, by using solvent to dissolve adhesive, by unscrewing welded nuts, or by removing heat stake structures. Following rework or repair, a fresh midplate and associated components may be attached to the display frame.

    Thermal gap pad
    46.
    发明授权
    Thermal gap pad 有权
    热间隙垫

    公开(公告)号：US09445528B2

    公开(公告)日：2016-09-13

    申请号：US14323874

    申请日：2014-07-03

    Applicant: Apple Inc.

    Inventor： Sawyer I. Cohen ,  David A. Pakula ,  Tseng-Mau Yang ,  Tyler B. Cater ,  Ashutosh Y. Shukla

    IPC: H05K7/20 ,  F28F21/02 ,  G06F1/20 ,  F28F21/06

    CPC classification number: H05K7/20454 ,  F28F21/02 ,  F28F2013/006 ,  F28F2255/02 ,  G06F1/20 ,  H05K7/20481

    Abstract: This application relates to efficiently distributing heat within a portable computing device. More specifically an apparatus for conducting heat between internal components of the portable computing device is disclosed. The apparatus, referred to as a thermal gap pad, is configured to bridge a variably sized gap between internal components. This is accomplished by wrapping a resilient core in a layer of highly thermally conductive material. The resilient core allows a shape of the thermal gap pad to vary in accordance with a size of the gap. A resilience of the thermal gap pad can be adjusted to account for an amount of variance in the gap. In some embodiments, an electrically conductive layer can be added to facilitate the passage of electrical current through the thermal gap pad.

    Abstract translation: 本申请涉及在便携式计算设备内有效地分配热量。 更具体地，公开了一种用于在便携式计算设备的内部部件之间传导热量的装置。 被称为热间隙垫的装置构造成在内部部件之间桥接可变尺寸的间隙。 这通过将弹性芯包裹在高导热材料层中来实现。 弹性芯允许热间隙垫的形状根据间隙的大小而变化。 可以调节热间隙垫的弹性以考虑间隙中的变化量。 在一些实施例中，可以添加导电层以促进电流通过热间隙垫。

    Structures for forming conductive paths in antennas and other electronic device structures
    47.
    发明授权
    Structures for forming conductive paths in antennas and other electronic device structures 有权
    用于在天线和其他电子设备结构中形成导电路径的结构

    公开(公告)号：US09431699B2

    公开(公告)日：2016-08-30

    申请号：US14300704

    申请日：2014-06-10

    Applicant: Apple Inc.

    Inventor： Nicholas G. L. Merz ,  Daniel W. Jarvis ,  Sawyer I. Cohen

    IPC: H05K7/20 ,  H01Q1/50 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q9/42 ,  H01Q13/10

    CPC classification number: H01Q1/50 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H01Q13/10

    Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.

    Abstract translation: 可以提供包含导电路径的电子设备。 导电路径可以由延伸穿过天线中的电介质间隙的细长金属构件形成。 天线可以由形成天线接地的导电结构和作为电子设备中的外围导电外壳构件的一部分的导电结构形成。 间隙可以将外围导电壳体构件与导电结构分离。 也可以使用一个或多个弹簧形成导电路径。 弹簧可以焊接到导电构件上，并且当弹簧被压缩时可以具有压靠附加的导电构件的插脚。 尖头可能具有变窄的尖端，弯曲形状和毛刺，这有助于在弹簧插脚和附加导电构件之间形成令人满意的电接触。

    Component Protection Structures for Electronic Devices
    48.
    发明申请
    Component Protection Structures for Electronic Devices 有权
    电子元器件保护结构

    公开(公告)号：US20160066438A1

    公开(公告)日：2016-03-03

    申请号：US14801686

    申请日：2015-07-16

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  David A. Pakula ,  Gregory N. Stephens ,  Sawyer I. Cohen ,  Scott A. Myers ,  Tyler B. Cater ,  Eric W. Bates

    IPC: H05K5/00 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H05K1/181 ,  G06F1/1658 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10598 ,  Y02P70/611

    Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

    Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 电气部件可以包括热传感器和压力传感器。 印刷电路中的通孔可以接收支架的轴。支座可以焊接到通孔侧面的电镀金属。 螺钉或其他紧固件可将印刷电路固定到电子设备的外壳。 可以将环形金属构件焊接到印刷电路。 环形金属构件可以形成围绕螺钉或其他紧固件和热传感器的保险杠。 压力传感器可以具有通过其进行环境压力测量的端口。 诸如织物或其它多孔层的防尘罩可以覆盖端口。

    Structures for Forming Conductive Paths in Antennas and Other Electronic Device Structures
    49.
    发明申请
    Structures for Forming Conductive Paths in Antennas and Other Electronic Device Structures 审中-公开
    在天线和其他电子设备结构中形成导电路径的结构

    公开(公告)号：US20140285386A1

    公开(公告)日：2014-09-25

    申请号：US14300704

    申请日：2014-06-10

    Applicant: Apple Inc.

    Inventor： Nicholas G. L. Merz ,  Daniel W. Jarvis ,  Sawyer I. Cohen

    IPC: H01Q1/50 ,  H01Q1/48

    CPC classification number: H01Q1/50 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q9/42 ,  H01Q13/10

    Abstract: Electronic devices may be provided that contain conductive paths. A conductive path may be formed from an elongated metal member that extends across a dielectric gap in an antenna. The antenna may be formed from conductive structures that form an antenna ground and conductive structures that are part of a peripheral conductive housing member in the electronic device. The gap may separate the peripheral conductive housing member from the conductive structures. A conductive path may also be formed using one or more springs. A spring may be welded to a conductive member and may have prongs that press against an additional conductive member when the spring is compressed. The prongs may have narrowed tips, curved shapes, and burrs that help form a satisfactory electrical contact between the spring prongs and the additional conductive member.

    Abstract translation: 可以提供包含导电路径的电子设备。 导电路径可以由延伸穿过天线中的电介质间隙的细长金属构件形成。 天线可以由形成天线接地的导电结构和作为电子设备中的外围导电外壳构件的一部分的导电结构形成。 间隙可以将外围导电壳体构件与导电结构分离。 也可以使用一个或多个弹簧形成导电路径。 弹簧可以焊接到导电构件上，并且当弹簧被压缩时可以具有压靠附加的导电构件的插脚。 尖头可能具有变窄的尖端，弯曲形状和毛刺，这有助于在弹簧插脚和附加导电构件之间形成令人满意的电接触。

    Switches and Switch Mounting Structures
    50.
    发明申请
    Switches and Switch Mounting Structures 有权
    开关和开关安装结构

    公开(公告)号：US20140216903A1

    公开(公告)日：2014-08-07

    申请号：US13759729

    申请日：2013-02-05

    Applicant: APPLE INC.

    Inventor： Shayan Malek ,  Sawyer I. Cohen ,  Michael B. Wittenberg

    IPC: H01H9/02 ,  H05K13/00

    CPC classification number: H04M1/236 ,  H01H15/24 ,  H01H2207/004 ,  H01H2221/014 ,  H01H2223/014 ,  H01H2231/022 ,  Y10T29/49124

    Abstract: An electronic device has circuitry mounted within an electronic device housing. The electronic device housing may have housing walls such as metal sidewalls. Openings are formed in an electronic device housing wall to accommodate buttons. A button may have a switch with a switch housing mounted to the housing wall. A movable button member that extends from the switch housing may protrude through a housing opening. Switch terminals are coupled to signal lines on structures such as flexible printed circuits. The switch terminals may be formed from portions of elongated switch leads supported by support structure that are mounted to the housing wall or may be formed on an inner surface of the switch housing. Support structures may be molded into engagement with features on a housing wall or may be mounted to a housing wall using a fastener such as a screw.

    Abstract translation: 电子设备具有安装在电子设备外壳内的电路。 电子设备外壳可以具有诸如金属侧壁的壳体壁。 开口形成在电子设备壳体壁中以容纳按钮。 按钮可以具有安装到壳体壁上的开关壳体的开关。 从开关壳体延伸的可移动按钮构件可以突出穿过壳体开口。 开关端子耦合到诸如柔性印刷电路的结构上的信号线。 开关端子可以由安装到壳体壁上的或者可以形成在开关壳体的内表面上的由支撑结构支撑的细长开关引线的部分形成。 支撑结构可以模制成与壳体壁上的特征接合，或者可以使用诸如螺钉的紧固件来安装到壳体壁。

Patent Agency Ranking