公开(公告)号：US06120885A

公开(公告)日：2000-09-19

申请号：US106779

申请日：1998-06-30

Applicant: Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

Inventor： Anson J. Call ,  Stephen Anthony DeLaurentis ,  Shaji Farooq ,  Sung Kwon Kang ,  Sampath Purushothaman ,  Kathleen Ann Stalter

IPC: H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  B32B7/00 ,  B32B15/16 ,  H01L23/48 ,  H01L29/12

CPC classification number: H05K3/3436 ,  H01L23/49816 ,  H05K3/4015 ,  H01L2924/0002 ,  H05K2201/10234 ,  H05K2201/10333 ,  H05K2201/10962 ,  H05K3/321 ,  H05K3/3447 ,  Y02P70/613 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/24917 ,  Y10T428/256

Abstract: A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of the nature of the filler that includes conducting particles with a fusible coating and the appropriate selection of the polymer resin used in the adhesive, the balls are attached to the module in a compliant and resilient manner while leaving the majority of the bottom surface of the balls pristine. The array of balls can therefore be plugged into mating sockets in a printed circuit board forming a demountable contact. This facilitates easy removal of the socketable BGA from a board for repair or upgrade purposes as well as allows ease of plugging and unplugging of these BGA's into test and burn-in boards.

Abstract translation: 公开了一种可插座的球栅阵列结构，其包括通过新颖的导电粘合剂机械地刚性（与焊料合金相比）涂覆有接合到芯片载体端子的贵金属接触金属的球。 由于包括具有可熔涂层的导电颗粒和粘合剂中使用的聚合物树脂的适当选择的填料的性质，球以顺应性和弹性方式附着到模块上，同时留下了大部分的底表面 球原始。 因此，球阵可以插入形成可拆卸接触的印刷电路板中的配合插座中。 这样便于从板上轻松取出可插拔的BGA，以进行修理或升级，同时也可以方便地将这些BGA插入测试和老化板。

公开(公告)号：US5985128A

公开(公告)日：1999-11-16

申请号：US305433

申请日：1999-05-05

Applicant: Shaji Farooq ,  Suryanarayana Kaja ,  Hsichang Liu ,  Karen P. McLaughlin ,  Gregg B. Monjeau ,  Kim Hulett Ruffing

Inventor： Shaji Farooq ,  Suryanarayana Kaja ,  Hsichang Liu ,  Karen P. McLaughlin ,  Gregg B. Monjeau ,  Kim Hulett Ruffing

IPC: H01L21/48 ,  C25F3/14

CPC classification number: H01L21/4885

Abstract: A method for preforming electrochemical processes requiring the application of electricity on features of a substrate includes shorting out the features using a shorting layer across connectors to which the features a in electrical communication. Electricity is then applied and the process is performed.

Abstract translation: 用于预处理需要在衬底的特征上施加电力的电化学方法的方法包括使用电气通信中的特征的连接器上的短路层来简化特征。 然后施加电力并执行该过程。

公开(公告)号：US5964396A

公开(公告)日：1999-10-12

申请号：US909801

申请日：1997-08-12

Applicant: Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

Inventor： Peter J. Brofman ,  Patrick A. Coico ,  Mark G. Courtney ,  Shaji Farooq ,  Lewis S. Goldmann ,  Raymond A. Jackson ,  David C. Linnell ,  Gregory B. Martin ,  Frank L. Pompeo ,  Kathleen A. Stalter ,  Hilton T. Toy

IPC: H01L23/12 ,  B23K3/06 ,  H01L21/60 ,  H05K3/34 ,  B23K31/02 ,  B23K37/04

CPC classification number: B23K3/0638 ,  H05K3/3436 ,  B23K2201/36 ,  H01L2924/00013 ,  H01L2924/0002 ,  H05K2203/0195 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613

Abstract: A device is provided for stretching solder interconnection joints between two substrates of an electronic module. The device employs an expandable metal to exert a separating (stretching) force to the two substrates whereby a lifting rod attached to a clamping bridge is cause to move upwards by expansion of the expandable metal raising a first substrate clamped thereto. A lifting bridge in connection with the clamping bridge is caused to move downward to maintain the lifting bridge in contact with the second substrate being interconnected to the first substrate.

Abstract translation: 提供一种用于在电子模块的两个基板之间拉伸焊料互连接头的装置。 该装置使用可膨胀金属对两个基板施加分离（拉伸）力，借此通过膨胀可膨胀金属的方式使附接到夹紧桥的提升杆向上移动，从而提升夹持在其上的第一基板。 引起与夹紧桥连接的升降桥向下运动，以使升降桥与第二基板相互接触而与第一基板互连。

公开(公告)号：US5961032A

公开(公告)日：1999-10-05

申请号：US884977

申请日：1997-06-30

Applicant: James H. Covell, II ,  Shaji Farooq ,  Peter A. Gruber ,  Sudipta K. Ray

Inventor： James H. Covell, II ,  Shaji Farooq ,  Peter A. Gruber ,  Sudipta K. Ray

IPC: B22C9/22 ,  B23K3/06 ,  B23K35/02 ,  H01L21/60 ,  H01L23/12 ,  H01L23/50 ,  H05K3/34 ,  B23K35/012 ,  B23K31/002 ,  B22C9/020

CPC classification number: H05K3/3468 ,  B22C9/22 ,  B23K3/0607 ,  B23K35/0222 ,  B23K2201/40 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K2201/0379 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/128 ,  H05K3/3463

Abstract: A method is described for forming solder mounds for attachment to electronic devices. The solder mounds are preferably in the form of columns and comprise a first solder portion and a second solder portion with the two solder portions having different melting points. The solder columns are preferably formed using an injection molding device. The method is directed to the use of a single column mold to form the multi-solder column. In one embodiment, deformable material is used to partially block a portion of the through opening of the mold during a first solder injection process. The deformable material is then removed and the remainder of the through openings of the mold filled with a second molten solder. The multi-solder column is then electrically connected to a substrate by reflowing.

Abstract translation: 描述了用于形成用于附接到电子设备的焊接凸块的方法。 焊料块优选为柱状，并且包括第一焊料部分和第二焊料部分，其中两个焊料部分具有不同的熔点。 焊料柱优选使用注射成型装置形成。 该方法涉及使用单柱模具来形成多焊料柱。 在一个实施例中，可变形材料用于在第一次焊接注入过程期间部分地阻挡模具的通孔的一部分。 然后去除可变形材料，并且模具的通孔的其余部分填充有第二熔融焊料。 然后通过回流将多焊料柱电连接到衬底。

公开(公告)号：US5912044A

公开(公告)日：1999-06-15

申请号：US782205

申请日：1997-01-10

Applicant: Mukta Shaji Farooq ,  Ajay P. Giri ,  Rajesh Shankerial Patel

Inventor： Mukta Shaji Farooq ,  Ajay P. Giri ,  Rajesh Shankerial Patel

IPC: H01L21/02 ,  H05K1/03 ,  H05K1/16 ,  H05K3/00 ,  H05K3/46 ,  B05D5/12

CPC classification number: H01L28/40 ,  H01L28/55 ,  H05K1/162 ,  H05K1/0306 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K3/0029 ,  H05K3/4605 ,  Y10T29/435

Abstract: Thin film capacitors are formed by a multi-level dry processing method that includes simultaneous ablation of via openings through both the dielectric and the metal electrode layers of a capacitor. Preferably, the dielectric films are formed of barium strontium titanate and the metal electrode layers are formed of platinum. The present invention overcomes the problems associated with the use of strong etchants to sequentially form separate via openings through the electrode and dielectric layers, prevents the potential for delamination of the respective layers during wet etching and the possible undesirable effects of etching solutions on substrate materials.

Abstract translation: 薄膜电容器通过多级干法处理方法形成，其包括通过电容器的电介质和金属电极层的同时烧蚀通孔。 优选地，电介质膜由钛酸钡锶形成，并且金属电极层由铂形成。 本发明克服了与使用强蚀刻剂顺序地通过电极和电介质层形成单独的通路孔相关的问题，防止在湿蚀刻期间各层分层的可能性以及蚀刻溶液对衬底材料的可能不期望的影响。

公开(公告)号：US5337475A

公开(公告)日：1994-08-16

申请号：US992091

申请日：1992-12-17

Applicant: Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

Inventor： Farid Y. Aoude ,  Emanuel I. Cooper ,  Peter R. Duncombe ,  Shaji Farooq ,  Edward A. Giess ,  Young-Ho Kim ,  Sarah H. Knickerbocker ,  Friedel Muller-Landau ,  Mark O. Neisser ,  Jae M. Park ,  Robert R. Shaw ,  Robert A. Rita ,  Thomas M. Shaw ,  Rao Vallabhaneni ,  Jon A. Van Hise ,  George F. Walker ,  Jungihl Kim ,  James M. Brownlow, deceased

IPC: H01B1/16 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  H01K3/10

CPC classification number: H05K1/092 ,  H01B1/16 ,  H01L21/486 ,  H01L21/4867 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T428/12472 ,  Y10T428/12556 ,  Y10T428/12604 ,  Y10T428/12611 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/252 ,  Y10T428/2982 ,  Y10T428/2991

Abstract: Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Abstract translation: 用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的充填组合物，而不会破裂和/或损失气密密封。 通孔填充组合物包含含有（a）在约0.5至6μm之间具有基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有约1至约6μm的最大尺寸或直径的导电金属颗粒或球体 / 3和1/4的陶瓷和/或玻璃球的直径，和（c）粘合剂载体。 形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体 陶瓷电路基板。

公开(公告)号：US5284286A

公开(公告)日：1994-02-08

申请号：US786201

申请日：1991-10-31

Applicant: Peter J. Brofman ,  Shaji Farooq ,  Kathleen A. Lidestri ,  Gregg B. Monjeau ,  Karl J. Puttlitz

Inventor： Peter J. Brofman ,  Shaji Farooq ,  Kathleen A. Lidestri ,  Gregg B. Monjeau ,  Karl J. Puttlitz

IPC: B22F3/11 ,  B23K3/08 ,  B23K1/018

CPC classification number: B23K3/08 ,  B22F3/11 ,  B22F2998/00 ,  B22F2999/00

Abstract: A porous metal block for selectively removing solder or braze from a substrate is disclosed. The block comprises a plurality of protrusions which absorb solder or braze through capillary action. The number and dimensions of the protrusions vary depending on the application. Also disclosed is a process for making such a block involving a unique two steps sintering process.

Abstract translation: 公开了一种用于从衬底选择性地去除焊料或钎焊的多孔金属块。 该块包括通过毛细管作用吸收焊料或钎焊的多个突起。 突起的数量和尺寸根据应用而变化。 还公开了一种制造这种涉及独特的两步烧结工艺的块的方法。