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    Chemical mechanical polishing apparatus
    43.
    发明授权
    Chemical mechanical polishing apparatus 有权

    公开(公告)号：US10784113B2

    公开(公告)日：2020-09-22

    申请号：US15773904

    申请日：2016-08-08

    Applicant: KCTECH CO., LTD.

    Inventor： Kyunam Park

    IPC: H01L21/304 ,  H01L21/306 ,  H01L21/67 ,  H01L21/02 ,  C09G1/02 ,  B24B37/12 ,  B24B37/20

    Abstract: Provided are a chemical mechanical polishing apparatus and a control method thereof. The chemical mechanical polishing apparatus includes a plurality of polishing platens provided with a polishing pad on an upper surface thereof, and a polishing platen transferring unit for transferring the plurality of polishing platens to different process positions according to a predetermined process sequence. Here, different processes are performed at different process positions.

    APPARATUS FOR PROCESSING SUBSTRATE
    44.
    发明申请
    APPARATUS FOR PROCESSING SUBSTRATE 审中-公开

    公开(公告)号：US20200294832A1

    公开(公告)日：2020-09-17

    申请号：US16748834

    申请日：2020-01-22

    Applicant: KCTECH CO., LTD.

    Inventor： DONG MIN KIM

    IPC: H01L21/677 ,  B24B57/02

    Abstract: The present disclosure relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of blocking the introduction of external air and external particles into a chamber by forming an air curtain at a loading/unloading part when the chamber is open.The substrate processing apparatus of the present disclosure includes a chamber in which a space is formed, and a fluid injection part configured to inject a fluid from an outer side of a substrate loading/unloading part of the chamber through which a substrate is loaded and unloaded.

    OPENING AND SHUTTING DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
    45.
    发明申请
    OPENING AND SHUTTING DEVICE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200243306A1

    公开(公告)日：2020-07-30

    申请号：US16750317

    申请日：2020-01-23

    Applicant: KCTECH CO.,LTD.

    Inventor： Yong Ki HAN

    IPC: H01J37/32 ,  H01L21/67 ,  E05F15/00

    Abstract: Disclosed are an opening and shutting device and a substrate processing apparatus including the same. A device for opening and closing an entrance through which a substrate is carried into and out of a processing chamber includes an opening and shutting part that is disposed between the entrance and the processing chamber and that opens and closes the entrance while rotating so as to be brought into close contact with the entrance.

    SUBSTRATE CLEANING APPARATUS
    48.
    发明公开
    SUBSTRATE CLEANING APPARATUS 审中-公开

    公开(公告)号：US20240286176A1

    公开(公告)日：2024-08-29

    申请号：US18469540

    申请日：2023-09-18

    Applicant: KCTECH CO., LTD.

    Inventor： Keun Woo LEE ,  Dae Jung KANG ,  Byeong Jo PARK

    IPC: B08B5/04 ,  B08B3/02 ,  B08B5/02 ,  H01L21/67

    CPC classification number: B08B5/043 ,  B08B3/022 ,  B08B5/023 ,  H01L21/67051 ,  B08B2203/0211

    Abstract: A substrate cleaning apparatus includes a stage on which a substrate is placed, a support unit configured to support the substrate and to rotate the substrate, and a cleaning unit configured to spray a dual fluid to clean the substrate, wherein the cleaning unit may include a spray nozzle including a spray hole opened toward the stage and configured to spray a dual fluid through the spray hole, a cover that may include an inlet surrounding at least a partial area of an outer circumferential surface of the spray hole, that may surround at least a partial area of an outer circumferential surface of the spray nozzle, and that may be spaced apart from the spray nozzle by a predetermined distance, and an air flow passage formed in a space between the cover and the spray nozzle and through which air sucked from the inlet flows.

    SUBSTRATE CHUCK USED IN SCRUBBING PROCESS
    49.
    发明公开
    SUBSTRATE CHUCK USED IN SCRUBBING PROCESS 审中-公开

    公开(公告)号：US20230373042A1

    公开(公告)日：2023-11-23

    申请号：US18104592

    申请日：2023-02-01

    Applicant: KCTECH CO., LTD.

    Inventor： Jun Ho SON

    IPC: B23Q3/08

    CPC classification number: B23Q3/088 ,  B23Q2703/04 ,  B23Q2717/00

    Abstract: Disclosed is a substrate chuck. More particularly, a substrate chuck including a chucking film made of a flexible material capable of elastic deformation to cover a mounting region of an upper surface of a surface plate on which a substrate is to be mounted; and a substrate chuck for gripping the substrate by applying suction pressure to a lower part of the chucking film to form a vacuum between the chucking film and the substrate; and a substrate scrubbing apparatus including the substrate chuck are provided.

    HIGH-PRECISION SUBSTRATE POLISHING SYSTEM
    50.
    发明公开
    HIGH-PRECISION SUBSTRATE POLISHING SYSTEM 审中-公开

    公开(公告)号：US20230339070A1

    公开(公告)日：2023-10-26

    申请号：US18136834

    申请日：2023-04-19

    Applicant: KCTECH CO., LTD.

    Inventor： Ki Hyuk YANG ,  Sang Jeong WOO

    IPC: B24B49/14 ,  B24B49/04 ,  B24B7/04

    CPC classification number: B24B49/14 ,  B24B49/045 ,  B24B7/04

    Abstract: Provided is a high-precision substrate polishing system. An apparatus for polishing a substrate includes a platen on which a polishing pad is seated and which is rotatable, a substrate carrier configured to grip a substrate and rotatable on an upper side of the platen, an infrared sensor located inside the platen and configured to measure a temperature of the substrate, and a controller configured to determine a polishing state of the substrate using a value measured by the infrared sensor.

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