公开(公告)号：US20230373042A1

公开(公告)日：2023-11-23

申请号：US18104592

申请日：2023-02-01

Applicant: KCTECH CO., LTD.

Inventor： Jun Ho SON

IPC: B23Q3/08

CPC classification number: B23Q3/088 ,  B23Q2703/04 ,  B23Q2717/00

Abstract: Disclosed is a substrate chuck. More particularly, a substrate chuck including a chucking film made of a flexible material capable of elastic deformation to cover a mounting region of an upper surface of a surface plate on which a substrate is to be mounted; and a substrate chuck for gripping the substrate by applying suction pressure to a lower part of the chucking film to form a vacuum between the chucking film and the substrate; and a substrate scrubbing apparatus including the substrate chuck are provided.