PACKAGE METHOD OF SUBSTRATE
    32.
    发明申请

    公开(公告)号:US20180102504A1

    公开(公告)日:2018-04-12

    申请号:US15105570

    申请日:2016-04-26

    发明人: Yawei Liu

    摘要: The present invention provides a package method of a substrate. By forming a plurality of support parts which are separately located at the border position of the package cover plate, the gap of the package cover plate and the substrate is limited after para bonding the package cover plate and the substrate. Thus, the seal height of the seal which does not contain the spacers can be ensured, and under circumstance of certain seal coating volume, the seal width of the seal also can be ensured. Furthermore, by cutting off the plurality of support parts, and border parts of the substrate and the package cover plate contacting with the support parts, the substrate packaged with the seal which does not contain the spacers can be obtained, and it is ensured that the seal has the consistent height and width.

    RESIN COMPOSITION, OPTICAL FIBER, AND METHOD FOR PRODUCING OPTICAL FIBER

    公开(公告)号:US20230071877A1

    公开(公告)日:2023-03-09

    申请号:US17790181

    申请日:2020-12-08

    发明人: Yuya HOMMA

    摘要: A resin composition for secondary coating of an optical fiber is a resin composition comprising: a non-reactive urethane compound having a number average molecular weight of 10000 or more and 40000 or less, a photopolymerizable compound, and a photopolymerization initiator, wherein the content of the non-reactive urethane compound is 0.05 parts by mass or more and 10 parts by mass or less based on the total amount of the resin composition of 100 parts by mass, and the non-reactive urethane compound is a reaction product of a polyol having a number average molecular weight of 1800 or more and 4500 or less, a diisocyanate, and a compound having active hydrogen.

    RESIN COMPOSITION, OPTICAL FIBER, AND METHOD FOR PRODUCING OPTICAL FIBER

    公开(公告)号:US20230046664A1

    公开(公告)日:2023-02-16

    申请号:US17790166

    申请日:2020-12-08

    发明人: Yuya HOMMA

    摘要: A resin composition for secondary coating of an optical fiber is a resin composition comprising: a photopolymerizable compound comprising a urethane (meth)acrylate having a number average molecular weight of 10000 or more and 40000 or less; and a photopolymerization initiator, the content of the urethane (meth)acrylate is 0.05 parts by mass or more and 15 parts by mass or less based on the total amount of the resin composition of 100 parts by mass, and the urethane (meth)acrylate is a reaction product of a polyol having a number average molecular weight of 1800 or more and 4500 or less, a diisocyanate, and a hydroxyl group-containing (meth)acrylate.