公开(公告)号：US06818837B2

公开(公告)日：2004-11-16

申请号：US10263185

申请日：2002-10-03

Applicant: Mitsutoshi Okami

Inventor： Mitsutoshi Okami

IPC: H05K116

CPC classification number: H05K3/445 ,  H05K1/0219 ,  H05K1/144 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/368 ,  H05K3/4046 ,  H05K2201/043 ,  H05K2201/09809 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10371

Abstract: A transmitter includes an RF board having a circuit for processing high frequency signals, an IF board having a circuit for processing intermediate frequency signals, a shield plate formed of a conductive material arranged between the boards for shielding electromagnetic waves generated from the circuits, a board-to-board connecting wire inserted to a through hole based by a gap sufficient to avoid electric influence from an inner wall surface of the through hole provided in the shield plate, to be connected to through hole lands provided on the RF board and a IF board, respectively, and connectors formed of an insulating material and attached near opposite ends of the board-to-board connecting wire and sandwiching the shield plate, for fixing the board-to-board connecting wire to the shield plate. This provides a wiring connection structure that facilitates connection between circuit boards with each other and stably realizes normal signal transmission.

Abstract translation: 发射机包括具有用于处理高频信号的电路的RF板，具有用于处理中频信号的电路的IF板，由布置在板之间的导电材料形成的屏蔽板，用于屏蔽从电路产生的电磁波;板 基板连接线以足够的间隙插入到通孔中，该间隙足以避免来自设在屏蔽板上的通孔的内壁表面的电力影响，以连接到设置在RF板上的通孔焊盘和IF 以及由绝缘材料形成并且连接在板对板连接线的相对端并夹持屏蔽板的连接器，用于将板对板连接线固定到屏蔽板。 这提供了一种有助于电路板彼此连接并且稳定地实现正常信号传输的布线连接结构。

公开(公告)号：US20040218367A1

公开(公告)日：2004-11-04

申请号：US10824090

申请日：2004-04-14

Inventor： Wen-Yen Lin ,  Tsan-Nan Chien ,  Chun-Wen Pai

IPC: H05K007/20

CPC classification number: H05K7/20509 ,  H05K1/0203 ,  H05K1/144 ,  H05K1/148 ,  H05K2201/043

Abstract: A function module with a built-in heat dissipation fin. The function module includes a first circuit board, a second circuit board, and a heat dissipation fin. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The heat dissipation fin is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.

Abstract translation: 具有内置散热片的功能模块。 功能模块包括第一电路板，第二电路板和散热片。 第一电路板包括其上形成有第一接地层的第一表面。 第二电路板耦合到第一电路板，并且包括面向第一表面的第二表面。 在第二表面上形成第二接地层。 散热翅片设置在第一电路板和第二电路板之间，分别邻接第一接地层和第二接地层。

公开(公告)号：US3060076A

公开(公告)日：1962-10-23

申请号：US68729157

申请日：1957-09-30

Applicant: AUTOMATED CIRCUITS INC

Inventor： ROBINSON THOMAS L

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H05K1/036 ,  H05K3/005 ,  H05K3/007 ,  H05K3/205 ,  H05K3/28 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/043 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2203/0108 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/1572 ,  Y10S425/811 ,  Y10T29/49126 ,  Y10T156/1056 ,  Y10T156/108

公开(公告)号：US12058807B2

公开(公告)日：2024-08-06

申请号：US17799917

申请日：2021-11-16

Applicant: Chengdu BOE Optoelectronics Technology Co., Ltd. ,  BOE Technology Group Co., Ltd.

Inventor： Qianlin Pu ,  Fei Li ,  Zijian Wang ,  Xu Lu

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/0218 ,  H05K1/028 ,  H05K1/144 ,  H05K2201/043

Abstract: A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.

公开(公告)号：US09823703B2

公开(公告)日：2017-11-21

申请号：US14626723

申请日：2015-02-19

Applicant: Google Inc.

Inventor： Paul Eremenko ,  Ara Knaian ,  Seth Newburg ,  David Fishman

IPC: H05K7/00 ,  G06F1/16 ,  H04W88/02 ,  H04M1/02 ,  H05K1/11 ,  H05K1/14 ,  H01L23/48

CPC classification number: G06F1/1658 ,  G06F1/1684 ,  H04M1/0254 ,  H04M1/0274 ,  H04W88/02 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/044

Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.

公开(公告)号：US20150245501A1

公开(公告)日：2015-08-27

申请号：US14188855

申请日：2014-02-25

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd

Inventor： Nikolaus W. Schunk

IPC: H05K3/36 ,  H01R43/24 ,  H01R43/16

CPC classification number: H05K3/366 ,  H01L2224/48091 ,  H01R12/52 ,  H01R12/707 ,  H01R12/714 ,  H01R12/737 ,  H01R13/405 ,  H01R13/639 ,  H01R43/16 ,  H01R43/24 ,  H05K1/0218 ,  H05K1/117 ,  H05K1/144 ,  H05K1/186 ,  H05K3/3426 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/043 ,  H05K2201/09618 ,  H05K2201/09709 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/10757 ,  Y10T29/49126 ,  Y10T29/4922 ,  H01L2924/00014

Abstract: A method for making a leadframe includes removing a group of parallel, strip-shaped electrical conductors from a metal sheet, embedding end portions of the conductors in molding compound defining a leadframe body, and separating the conductors from each other, such that portions of the conductors remain encapsulated in the molding compound while other portions remain exterior to the molding compound and define leads of the resulting leadframe.

Abstract translation: 一种制造引线框架的方法包括从金属板移除一组平行的带状电导体，将导体的端部嵌入限定引线框体的模塑料中，并将导体彼此分离，使得 导体保持封装在模制化合物中，而其它部分保留在模制化合物的外部并限定所得引线框的引线。

公开(公告)号：US08345431B2

公开(公告)日：2013-01-01

申请号：US12317754

申请日：2008-12-29

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

Abstract: A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.

公开(公告)号：US08191244B2

公开(公告)日：2012-06-05

申请号：US12878586

申请日：2010-09-09

Applicant: Shang-Lin Sung ,  Shih-Chiehmr Chang ,  Chao-Sheng Chiu ,  Chin-Cheng Lee

Inventor： Shang-Lin Sung ,  Shih-Chiehmr Chang ,  Chao-Sheng Chiu ,  Chin-Cheng Lee

IPC: H05K3/34

CPC classification number: B32B37/02 ,  B32B38/06 ,  B32B2457/08 ,  H05K3/0097 ,  H05K3/427 ,  H05K2201/043 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A fabricating method of a circuit board including the following steps. First, a liquid material is adhered between a first substrate and a second substrate by using an atmospheric pressure difference. Then, a plurality of conductive columns are formed in the first substrate and the second substrate. Next, a patterning process is performed, so as to form two circuit layers. Next, two lamination structures are formed respectively on the circuit layers. Then, the first substrate and the second substrate are separated. Finally, another patterning process is performed, so as to finish the fabrication of the circuit board.

Abstract translation: 一种电路板的制造方法，包括以下步骤。 首先，通过使用大气压力差，将液体材料粘附在第一基板和第二基板之间。 然后，在第一基板和第二基板中形成多个导电柱。 接下来，进行图案化处理，以形成两个电路层。 接下来，在电路层上分别形成两层叠结构。 然后，分离第一基板和第二基板。 最后，进行另一图案化处理，以完成电路板的制造。

公开(公告)号：US20110317383A1

公开(公告)日：2011-12-29

申请号：US12821847

申请日：2010-06-23

Applicant: John S. Guzek

Inventor： John S. Guzek

IPC: H05K1/18 ,  B23P11/00

CPC classification number: H05K1/186 ,  H01L21/561 ,  H01L21/568 ,  H01L23/16 ,  H01L23/3135 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H05K3/0097 ,  H05K2201/043 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49826 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus include an at least one stiffener layer that is integral to the coreless substrate and the stiffener layer is made of overmold material, underfill material, or prepreg material.

Abstract translation: 一种装置包括具有与无芯基板一体的嵌入式管芯的无芯基板，以及组装在与设置在无芯基板上的球栅阵列相对的表面上的至少一个装置。 该装置包括至少一个与无芯基底成一体的加强层，并且加强层由包覆成型材料，底部填充材料或预浸料材料制成。

公开(公告)号：US08085547B2

公开(公告)日：2011-12-27

申请号：US11948526

申请日：2007-11-30

Applicant: Ying-Cheng Wu ,  Kun-Hsiao Liu

Inventor： Ying-Cheng Wu ,  Kun-Hsiao Liu

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/043 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element.

Abstract translation: 电子元件载体包括主体，至少电子元件和填充物。 主体包括具有板和形成在板的周边上的坝的基板，安装在坝的表面上的导电层和至少由板和基板的坝限定的空腔。 电子元件设置在身体的空腔中。 填料被接收在衬底的空腔中，用于封装，密封和保护电子元件。