Abstract:
An oscillator includes a compensated current source that adjusts an output current based on process, supply voltage, and temperature (“PVT”) variations of an integrated circuit device. The oscillator generates an output signal having a frequency based, in part, on the output current of the compensated current source. Accordingly, the output signal has a relatively low sensitivity to PVT variations.
Abstract:
A method of controlling an integrated circuit chip including first and second clock sources, the first clock source being more thermally stable and having a higher power consumption, the integrated circuit chip being operable in a first mode in which the first clock source is inactive and the second clock source active and in a second mode in which the first and second clock sources are active, the method including operating the integrated circuit chip in the first mode; taking a measurement indicative of temperature; if the measurement indicates that the temperature is outside of a temperature band: activating the first clock source so as to operate the integrated circuit chip in the second mode; recalibrating the second clock source against the first clock source; and following the recalibration, deactivating the first clock source so as to return the integrated circuit chip to the first mode.
Abstract:
An oscillating device includes an atomic oscillator, an oven controlled crystal oscillator, a correcting unit configured to correct an output signal of the oven controlled crystal oscillator on the basis of an output signal of the atomic oscillator, a housing configured to house the atomic oscillator and the oven controlled crystal oscillator, and a temperature adjusting unit configured to adjust the temperature in the housing to a predetermined temperature.
Abstract:
A technique decouples a MEMS device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation. An apparatus includes a MEMS device including a first electrode and a second electrode, and a body suspended from a substrate of the MEMS device. The body and the first electrode form a first electrostatic transducer. The body and the second electrode form a second electrostatic transducer. The apparatus includes a suspended passive element mechanically coupled to the body and electrically isolated from the body.
Abstract:
An oscillator that includes a first source current leg and first sink current leg to source current and sink current, respectively, during a startup mode of oscillator operation. The oscillator includes a second source current leg and a second sink current leg to source current and sink current, respectively, during a second mode of oscillator operation.
Abstract:
One embodiment relates to a method of compensating for crystal frequency variation over temperature. An example method includes obtaining an indication of temperature, computing a temperature compensation value based on the indication of temperature and a piecewise linear temperature compensation approximation, and compensating for a temperature offset in a crystal reference signal by adjusting a division ratio of a fractional divider in a phase-locked loop. The piecewise linear temperature compensation approximation can represent an approximation of frequency error in a crystal reference signal originating from a crystal over temperature. The piecewise linear temperature compensation approximation can be, for example, a linear approximation, a quadratic approximation, or a cubic approximation.
Abstract:
An oscillation circuit includes a threshold voltage extraction module, a positive temperature coefficient voltage generation module, an addition module, a common-source amplifier module, a charge and discharge module, and a clock output terminal. The common-source amplifier module includes a first field effect transistor (FET) and a second FET. The addition module includes a first operational amplifier, a second operational amplifier, a third FET, a fourth FET, a fifth FET, a sixth FET, a first resistor, a second resistor, and a third resistor. The charge and discharge module includes a seventh FET, an eighth FET, a charge and discharge FET, a first switch, a second switch, a first comparator, a second comparator, a first nor gate and a second nor gate. An oscillation system is further provided. The oscillation circuit and the oscillation system of the present invention have simple structures and are easy to implement.
Abstract:
An integrated circuit device includes at least one controllable oscillator including a first control port and at least one further control port, at least one frequency control module including an output arranged to provide a frequency control signal. The at least one controllable oscillator further includes at least one compensation module including an output arranged to provide at least one compensation signal. The at least one compensation module includes an integrator component arranged to receive at an input thereof a signal that is representative of a difference between the indication of the frequency control signal and a reference signal, and to output an integrated difference signal. The at least one compensation module is arranged to generate the at least one compensation signal based at least partly on the integrated difference signal output by the integrator component.
Abstract:
A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
Abstract:
Described herein are apparatus, system, and method for controlling temperature drift and/or voltage supply drift in a digital phase locked loop (DPLL). The apparatus comprises a DPLL including a digital filter to generate a fine code for controlling a frequency of an output signal of a digital controlled oscillator (DCO) of the DPLL; a logic unit to monitor the fine code and to generate a compensation signal based on the fine code; and a voltage adjustment unit to update a power supply level to the DCO based on the compensation signal, wherein the updated power supply level to cause the digital filter to generate the fine code near the middle of an entire range of the fine code across various temperatures, and wherein the digital filter to generate the fine code near the middle of the entire range across power supply drift.