公开(公告)号：US20230253373A1

公开(公告)日：2023-08-10

申请号：US18134666

申请日：2023-04-14

申请人： Seoul Semiconductor Co., Ltd.

发明人： Motonobu Takeya

IPC分类号： H01L25/075

CPC分类号： H01L25/075 ,  H01L2933/005 ,  H01L2933/0033 ,  H01L2933/0066

摘要： A display apparatus including a substrate and having a first substrate electrode and a second substrate electrode, and light emitting sources disposed on the substrate and spaced apart from one another, the light emitting source including a light emitting structure having an n-type semiconductor layer, an active layer, and a p-type semiconductor layer, a p-type electrode electrically connected to the p-type semiconductor layer, an n-type electrode electrically connected to the n-type semiconductor layer, in which the first substrate electrode extends from an upper surface of the substrate facing the light emitting sources to a lower surface thereof and is electrically connected to the p-type electrode, the first substrate electrode including an upper portion having a substantially flat top surface and disposed on the upper surface of the substrate and a lower portion disposed on the lower surface of the substrate.

公开(公告)号：US20190139942A1

公开(公告)日：2019-05-09

申请号：US16195726

申请日：2018-11-19

申请人： Shih-Hsien Tseng

发明人： Shih-Hsien Tseng

IPC分类号： H01L25/07 ,  H01L23/48 ,  H01L27/32 ,  H01L29/786 ,  H01L25/00 ,  H01L25/18 ,  H01L25/065 ,  H01L23/498 ,  G02F1/136 ,  H01L25/16

CPC分类号： H01L25/072 ,  G02F1/136 ,  G02F2001/13613 ,  H01L23/481 ,  H01L23/49838 ,  H01L25/0655 ,  H01L25/075 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/18 ,  H01L25/50 ,  H01L27/1218 ,  H01L27/156 ,  H01L27/32 ,  H01L27/3262 ,  H01L29/786

摘要： A pixel unit structure, as well as a manufacturing method thereof, is provided. The pixel unit structure includes a display medium module and an active switching element. The display medium module includes a first electrode, a second electrode and a display medium. The first electrode and the second electrode are separated from each other, and the display medium is disposed between the first electrode and the second electrode. The active switching element is electrically connected to the first electrode, for allowing the first electrode and the second electrode to change the state of the display medium. The active switching element includes a wafer portion and a transistor portion, which is formed on the wafer portion. Therefore, the active switching element can be manufactured independently without the restriction from the display medium module.

公开(公告)号：US20190081202A1

公开(公告)日：2019-03-14

申请号：US16127657

申请日：2018-09-11

申请人： NICHIA CORPORATION

发明人： Daisuke KASAI

IPC分类号： H01L33/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/40

CPC分类号： H01L33/005 ,  H01L25/075 ,  H01L25/0753 ,  H01L33/00 ,  H01L33/0095 ,  H01L33/40 ,  H01L33/405 ,  H01L33/50 ,  H01L33/502 ,  H01L33/505 ,  H01L2933/0016 ,  H01L2933/0041

摘要： A method for manufacturing a light emitting device includes: preparing an LED die having a laminated structure including a light emitting surface, an electrode forming surface, and a side surface, and at least one electrode placed on the electrode forming surface; preparing a wavelength conversion member having an upper surface defining a recess, the recess having an opening diameter greater than a diameter of the light emitting surface in a plan view; placing a light-transmissive member within the recess; mounting the LED die on an upper surface of the light-transmissive member white the light emitting surface faces the upper surface of the light-transmissive member and pressing the LED die so that at least a portion of the light-transmissive member is placed on the side surface of the laminated structure; and placing a light reflecting member to cover the LED die, the light-transmissive member, and the wavelength conversion member.

公开(公告)号：US20180331078A1

公开(公告)日：2018-11-15

申请号：US15593042

申请日：2017-05-11

申请人： Cree, Inc.

发明人： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC分类号： H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L33/46

CPC分类号： H01L25/075 ,  H01L33/46 ,  H01L33/502 ,  H01L33/54 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0058

摘要： Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

公开(公告)号：US20180240947A1

公开(公告)日：2018-08-23

申请号：US15750958

申请日：2015-12-18

申请人： Jiangsu Cherrity Optronics Co., Ltd

发明人： Jinhua HE

IPC分类号： H01L33/52 ,  H01L33/48 ,  H01L33/00 ,  H01L27/15

CPC分类号： H01L33/52 ,  H01L25/075 ,  H01L27/153 ,  H01L33/005 ,  H01L33/48 ,  H01L33/483 ,  H01L33/50 ,  H01L33/501 ,  H01L33/56

摘要： Provided is a process method for bond-packaging an LED using an organic silicone resin photoconverter by tandem rolling, including the following continuous process flow: preparation of a semi-cured photoconversion sheet, pseudo-curing of the semi-cured photoconversion sheet, preparation of a flip chip LED array sheet, forming of LED package elements by dual-roller roll-bonding, curing of the LED package elements, and cutting of the LED package elements. The present invention has a significant advantage of bond-packaging an LED by using a continuous rolling process, and can satisfy a condition requirement of bond-packaging an LED using an organic silicone resin photoconverter, thereby improving the production efficiency and yield of LED packages in industrialized batch production.

公开(公告)号：US09941258B2

公开(公告)日：2018-04-10

申请号：US14572911

申请日：2014-12-17

申请人： GE Lighting Solutions, LLC

发明人： Ming Kong ,  Jeffrey Bisberg ,  John Powell

IPC分类号： H01L25/075 ,  F21K9/232 ,  F21S4/22 ,  F21V29/70 ,  F21V3/02 ,  F21V29/87 ,  F21Y103/10 ,  F21Y115/10

CPC分类号： H01L25/075 ,  F21K9/232 ,  F21S4/22 ,  F21V3/02 ,  F21V29/70 ,  F21V29/87 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

摘要： An LED lead frame assembly includes a circuit strip assembly, a plastic dam member overmolded onto the circuit strip assembly and a LED chip assembly disposed in a pocket of the plastic dam member. The LED chip assembly is electrically coupled to the circuit strip assembly to power the LED chip assembly.

公开(公告)号：US09679879B2

公开(公告)日：2017-06-13

申请号：US14762602

申请日：2014-01-22

申请人： Zhejiang Zhongzhou Lighting Technology Co., Ltd. ,  Qunliang Zheng

发明人： Xiaobiao Zhu

IPC分类号： H01L25/075 ,  H01L33/54 ,  H01L33/62 ,  H01L23/00 ,  H01L33/64

CPC分类号： H01L25/0753 ,  H01L24/83 ,  H01L24/97 ,  H01L25/075 ,  H01L33/54 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/83805 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/00

摘要： Provided is a LED light-emitting device including: a carrier, which is a transparent body, and on a carrying surface of which conductors are provided; a plurality of LED chips, which are electrically connected to the conductors by way of eutectic bonding, so as to realize electrical connection among the plurality of LED chips; an encapsulation structural member, which is a transparent body and encapsulates on the periphery of the carrier and the LED chips; and a pair of electrodes, wherein positive electrode/negative electrodes in the pair of electrodes are electrically connected to the LED chips located at the most upstream/most downstream of a current transmission in the plurality of LED chips by means of the conductors, and extend to the outside of the encapsulation structural member.

公开(公告)号：US09647177B2

公开(公告)日：2017-05-09

申请号：US15079812

申请日：2016-03-24

申请人： Epistar Corporation

发明人： Chiu-Lin Yao ,  Chih-Chiang Lu

IPC分类号： H01L33/10 ,  H01L33/46 ,  H01L33/00 ,  H01L25/075 ,  H01L33/64 ,  H01L33/44 ,  H01L33/62

CPC分类号： H01L27/15 ,  H01L25/075 ,  H01L25/0753 ,  H01L29/2003 ,  H01L29/22 ,  H01L29/6609 ,  H01L29/66969 ,  H01L29/861 ,  H01L33/007 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/22 ,  H01L33/24 ,  H01L33/32 ,  H01L33/385 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/0066 ,  H01L2933/0075 ,  H01L2924/00

摘要： The present disclosure is to provide an optoelectronic device. The optoelectronic device comprises a heat dispersion substrate; an insulative protection layer on the heat dispersion substrate, wherein the insulative protection layer comprises AlInGaN series material; and an optoelectronic unit comprising an epitaxial structure comprising multiple layers on the insulative protection layer, wherein at least one layer of the epitaxial structure comprises III-V group material devoid of nitride.

公开(公告)号：US20170122545A1

公开(公告)日：2017-05-04

申请号：US15012906

申请日：2016-02-02

申请人： LUMION TECH CO., LTD.

发明人： HSIEH-CHIA CHEN ,  YI-SUNG HUNG ,  CHIEN-WEN HO

IPC分类号： F21V31/04 ,  F21V23/00 ,  F21V19/00

CPC分类号： F21V31/04 ,  F21K9/20 ,  F21V19/002 ,  F21V23/002 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01L25/075 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2924/181 ,  H05B33/0809 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The disclosure is related to a light module, comprising a circuit board, at least one light unit, a power conversion unit, a plurality of power cords and an encapsulating material. At least one light unit is disposed on the circuit board. The power conversion unit is disposed on the circuit board. A plurality of power cords is coupled between the power conversion unit and at least one light unit. The encapsulating material is for encapsulating at least one light unit, the power conversion unit and the power cords.

公开(公告)号：US09627351B2

公开(公告)日：2017-04-18

申请号：US14834606

申请日：2015-08-25

申请人： Sensor Electronic Technology, Inc.

发明人： Yuri Bilenko ,  Michael Shur ,  Remigijus Gaska ,  Alexander Dobrinsky

IPC分类号： H01L29/24 ,  H01L23/00 ,  H01L33/62 ,  H01L25/07 ,  H01L21/78 ,  H01L33/52 ,  H01L23/495 ,  H01L33/60

CPC分类号： H01L23/49541 ,  H01L21/78 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/81 ,  H01L24/94 ,  H01L25/072 ,  H01L25/075 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/1403 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/81191 ,  H01L2224/94 ,  H01L2924/01322 ,  H01L2924/12 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/81

摘要： A solution for packaging a two terminal device, such as a light emitting diode, is provided. In one embodiment, a method of packaging a two terminal device includes: patterning a metal sheet to include a plurality of openings; bonding at least one two terminal device to the metal sheet, wherein a first opening corresponds to a distance between a first contact and a second contact of the at least one two terminal device; and cutting the metal sheet around each of the least one two terminal device, wherein the metal sheet forms a first electrode to the first contact and a second electrode to the second contact.