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公开(公告)号：US20210057390A1
公开(公告)日：2021-02-25
申请号：US17092939
申请日：2020-11-09
申请人： Cree, Inc.
摘要： Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.
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公开(公告)号：US10361349B2
公开(公告)日：2019-07-23
申请号：US15694591
申请日：2017-09-01
申请人： Cree, Inc.
摘要： Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
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公开(公告)号：US20210074687A1
公开(公告)日：2021-03-11
申请号：US16950142
申请日：2020-11-17
申请人： Cree, Inc.
发明人： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
IPC分类号： H01L25/075 , H01L33/46 , H01L33/50 , H01L27/15 , H01L33/58 , H01L33/60 , H01L33/62 , H01L25/00
摘要： At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
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公开(公告)号：US10854584B2
公开(公告)日：2020-12-01
申请号：US15499520
申请日：2017-04-27
申请人： Cree, Inc.
IPC分类号： H01L33/62 , H01L33/00 , H01L33/38 , H01L33/48 , H01L33/50 , H01L33/22 , H01L25/075 , H01L23/00
摘要： An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
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公开(公告)号：US09897267B2
公开(公告)日：2018-02-20
申请号：US13838654
申请日：2013-03-15
申请人： CREE, Inc.
发明人： Christopher P. Hussell , Sung Chul Joo , Erin Welch , Peter Scott Andrews , Joseph G. Clark , John A. Edmond , Jesse C. Reiherzer
IPC分类号： F21V23/02 , F21K9/90 , F21Y103/10 , F21Y115/10
CPC分类号： F21K9/90 , F21Y2103/10 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , Y10T29/49117 , H01L2924/00014 , H01L2924/00
摘要： Light emitter components, systems, and related methods having improved optical efficiency and a lower manufacturing cost are disclosed. In one aspect, a light emitter component can include a substrate having an elongated body and first and second ends. At least a first trace and a second trace can be provided on the substrate. In some aspects, the first trace can be disposed proximate the first end of the substrate and the second trace can be disposed proximate the second end of the substrate, with no other portion of the first trace or second trace being disposed between the first and second ends of the substrate. In some aspects, a string of LED chips can be provided on the substrate. The string of LED chips can be disposed between the first and second ends of the substrate. Angled traces, gaps and light emitter components can also be provided in some aspects.
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公开(公告)号：US09349929B2
公开(公告)日：2016-05-24
申请号：US13713410
申请日：2012-12-13
申请人： CREE, Inc.
发明人： Joseph G. Clark , Amber C. Abare , David T. Emerson , Jeremy S. Nevins , Raymond Rosado , Michael Bergmann
IPC分类号： H01L33/58 , F21V21/00 , H01L33/50 , F21V7/00 , H01L25/075 , H01L33/54 , F21K99/00 , F21Y101/02 , F21Y105/00
CPC分类号： H01L33/58 , F21K9/233 , F21V7/00 , F21V21/00 , F21Y2105/18 , F21Y2115/10 , H01L25/0753 , H01L33/50 , H01L33/54 , H01L2224/48091 , H01L2924/00014
摘要： Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
摘要翻译： 公开了具有改进性能的光发射器封装，系统和方法。 在一个方面，光发射器封装可以包括可以包括阳极和阴极的底座。 第一光发射器芯片可以安装在阴极的至少一部分上，并且第二发光芯片可以被引线接合到阳极的至少一部分。 多个光发射器芯片可以设置在第一和第二发光器芯片之间。
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公开(公告)号：US10312224B2
公开(公告)日：2019-06-04
申请号：US15401240
申请日：2017-01-09
申请人： Cree, Inc.
发明人： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
IPC分类号： H01L25/075 , H01L27/15 , H01L33/50 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L25/00 , H01L33/46 , H01L33/00 , H01L33/38 , H01L33/44
摘要： At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
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公开(公告)号：US20190074417A1
公开(公告)日：2019-03-07
申请号：US15694591
申请日：2017-09-01
申请人： Cree, Inc.
IPC分类号： H01L33/60 , H01L23/00 , H01L25/075
CPC分类号： H01L33/60 , H01L24/48 , H01L25/0753 , H01L33/0095 , H01L33/505 , H01L33/56 , H01L33/62 , H01L2224/48137 , H01L2924/12041 , H01L2933/0033 , H01L2933/005 , H01L2933/0058
摘要： Light emitting diode components and devices with a wall of reflective material and having improved performance and beam angle, are provided. Reflective material provided with light emitting diode devices is configured to optimize light reflectivity by altering the composition, thickness, placement and/or angle thereof. Methods of making and assembly light emitting diode components and devices with reflective materials and improved performance, are also provided.
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公开(公告)号：US20170294418A1
公开(公告)日：2017-10-12
申请号：US15401240
申请日：2017-01-09
申请人： Cree, Inc.
发明人： John Edmond , Matthew Donofrio , Jesse Reiherzer , Peter Scott Andrews , Joseph G. Clark , Kevin Haberern
CPC分类号： H01L25/0753 , H01L25/50 , H01L27/156 , H01L33/0079 , H01L33/382 , H01L33/44 , H01L33/46 , H01L33/50 , H01L33/502 , H01L33/504 , H01L33/508 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2933/0033 , H01L2933/0058
摘要： At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.
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公开(公告)号：US20170229431A1
公开(公告)日：2017-08-10
申请号：US15499520
申请日：2017-04-27
申请人： Cree, Inc.
IPC分类号： H01L25/075 , H01L33/48 , H01L33/38 , H01L33/62 , H01L33/50
CPC分类号： H01L25/0756 , H01L24/14 , H01L24/81 , H01L24/94 , H01L33/0079 , H01L33/0095 , H01L33/22 , H01L33/38 , H01L33/486 , H01L33/50 , H01L33/507 , H01L33/62 , H01L2224/13013 , H01L2224/13014 , H01L2224/13147 , H01L2224/13639 , H01L2224/1403 , H01L2224/14051 , H01L2224/1411 , H01L2224/14131 , H01L2224/14155 , H01L2224/14177 , H01L2224/81193 , H01L2224/81203 , H01L2224/81805 , H01L2224/81895 , H01L2224/94 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2933/0033 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
摘要： An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide LED dies that are joined to a carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area.
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