发明授权
- 专利标题： Light emitter packages, systems, and methods
- 专利标题（中）： 光发射器封装，系统和方法
-
申请号： US13713410申请日： 2012-12-13
-
公开(公告)号： US09349929B2公开(公告)日： 2016-05-24
- 发明人: Joseph G. Clark , Amber C. Abare , David T. Emerson , Jeremy S. Nevins , Raymond Rosado , Michael Bergmann
- 申请人： CREE, Inc.
- 申请人地址： US NC Durham
- 专利权人： Cree, Inc.
- 当前专利权人： Cree, Inc.
- 当前专利权人地址： US NC Durham
- 代理机构： Jenkins, Wilson, Taylor & Hunt, P.A.
- 主分类号： H01L33/58
- IPC分类号： H01L33/58 ; F21V21/00 ; H01L33/50 ; F21V7/00 ; H01L25/075 ; H01L33/54 ; F21K99/00 ; F21Y101/02 ; F21Y105/00
摘要：
Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.
公开/授权文献
- US20130322070A1 LIGHT EMITTER PACKAGES, SYSTEMS, AND METHODS 公开/授权日：2013-12-05
信息查询
IPC分类:
