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    HIGH DENSITY MULTI-CHIP LED DEVICES
    2.
    发明申请
    HIGH DENSITY MULTI-CHIP LED DEVICES 审中-公开
    高密度多芯片LED器件

    公开(公告)号：US20150048393A1

    公开(公告)日：2015-02-19

    申请号：US14531350

    申请日：2014-11-03

    申请人： CREE, INC

    发明人： Peter Scott Andrews ,  Raymond Rosado ,  Michael P. Laughner ,  David T. Emerson ,  Amber C. Abare ,  Jeffrey C. Britt

    IPC分类号： H01L33/62 ,  H01L33/58 ,  H01L33/48 ,  H01L25/075

    CPC分类号： H01L25/0753 ,  H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  Y10T29/49002 ,  H01L2924/00014

    摘要： High density multi-chip LED devices are described. Embodiments of the present invention provide high-density, multi-chip LED devices with relatively high efficiency and light output in a compact size. An LED device includes a plurality of interconnected LED chips and an optical element such as a lens. The LED chips may be arranged in two groups, wherein the LED chips within each group are connected in parallel and the groups are connected in series. In some embodiments, the LED device includes a submount, which may be made of ceramic. The submount may include a connection bus and semicircular areas to which chips are bonded. Wire bonds can be connected to the LED chips so that all the wire bonds are disposed on the outside of a group of LED chips to minimize light absorption.

    摘要翻译： 描述了高密度多芯片LED器件。 本发明的实施例提供了具有相对较高效率和小尺寸的光输出的高密度多芯片LED器件。 LED装置包括多个互连的LED芯片和诸如透镜的光学元件。 LED芯片可以分为两组，其中每组中的LED芯片并联连接，并且串联连接。 在一些实施例中，LED装置包括可由陶瓷制成的底座。 底座可以包括连接母线和与芯片接合的半圆形区域。 引线键可以连接到LED芯片，使得所有的引线键都布置在一组LED芯片的外部以最小化光吸收。

    Light emitting diodes, components and related methods
    3.
    发明授权
    Light emitting diodes, components and related methods 有权

    公开(公告)号：US10897000B2

    公开(公告)日：2021-01-19

    申请号：US16380400

    申请日：2019-04-10

    申请人： Cree, Inc.

    发明人： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

    IPC分类号： H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L25/075 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

    摘要： Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Light emitting diodes, components and related methods
    6.
    发明授权
    Light emitting diodes, components and related methods 有权

    公开(公告)号：US10964858B2

    公开(公告)日：2021-03-30

    申请号：US16380400

    申请日：2019-04-10

    申请人： Cree, Inc.

    发明人： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

    IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

    摘要： Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    Light emitting diodes, components and related methods
    7.
    发明授权
    Light emitting diodes, components and related methods 有权

    公开(公告)号：US10930826B2

    公开(公告)日：2021-02-23

    申请号：US16380400

    申请日：2019-04-10

    申请人： Cree, Inc.

    发明人： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

    IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58

    摘要： Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.

    LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS
    10.
    发明申请
    LIGHT EMITTING DIODES, COMPONENTS AND RELATED METHODS 有权

    公开(公告)号：US20210119090A1

    公开(公告)日：2021-04-22

    申请号：US17116576

    申请日：2020-12-09

    申请人： Cree, Inc.

    发明人： Peter Scott Andrews ,  Jesse Colin Reiherzer ,  Amber C. Abare

    IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L33/60 ,  H01L33/62

    摘要： Light emitting diodes, components, and related methods, with improved performance over existing light emitting diodes. In some embodiments, light emitter devices included herein include a submount, a light emitter, a light affecting material, and a wavelength conversion component. Wavelength conversion components provided herein include a transparent substrate having an upper surface and a lower surface, and a phosphor compound disposed on the upper surface or lower surface, wherein the wavelength conversion component is configured to alter a wavelength of a light emitted from a light source when positioned proximate to the light source.