公开(公告)号：US20150377806A1

公开(公告)日：2015-12-31

申请号：US14766682

申请日：2013-02-08

申请人： JFE STEEL CORPORATION

发明人： Toru MINOTE ,  Yuichi TOKITA ,  Yoshikiyo TAMAI ,  Takeshi FUJITA

IPC分类号： G01N25/00 ,  G01L1/00 ,  G01B21/20

CPC分类号： G01N25/00 ,  B21D22/022 ,  B21D22/208 ,  G01B21/20 ,  G01L1/00 ,  G06F17/5009 ,  G06F17/5086 ,  G06F2217/80

摘要： A method of analyzing press-forming of a press-forming material including analyzing press-forming, analyzing springback and analyzing a change in shape of the press-forming material. The analyzing press-forming may include setting an initial temperature distribution for the heated press-forming material and performing a press-forming analysis by combining temperature analysis and structural analysis to obtain shape information, temperature distribution, stress distribution, and strain distribution. The analyzing springback may occur with and without consideration of contact heat transfer between a press-forming tool and the press-forming material. The method may further include modifying the temperature distribution obtained in the analyzing springback and then re-analyzing the change in shape of the press-forming material. The analyzing the change in shape may be performed until a temperature distribution in the press-forming material is within the range of ±5° C.

摘要翻译： 一种分析压制成形材料的压制成形方法，包括分析压制成型，分析回弹和分析压制成型材料的形状变化。 分析压制成形可以包括设定加热成形材料的初始温度分布，并通过组合温度分析和结构分析进行压制成形分析，以获得形状信息，温度分布，应力分布和应变分布。 在压制成形工具和压制成形材料之间可以考虑和不考虑接触热传递而发生分析回弹。 该方法还可以包括改变在分析回弹中获得的温度分布，然后重新分析压制成形材料的形状变化。 可以进行分析形状变化，直到压制成形材料中的温度分布在±5℃的范围内

公开(公告)号：US20150363526A1

公开(公告)日：2015-12-17

申请号：US14304499

申请日：2014-06-13

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Min-Chie Jeng ,  Chung-Kai Lin ,  Ke-Wei Su ,  Yi-Shun Huang ,  Ya-Chin Liang ,  Cheng Hsiao ,  Juan Yi Chen ,  Wai-Kit Lee

IPC分类号： G06F17/50

CPC分类号： G06F17/5036 ,  G06F17/5068 ,  G06F2217/80

摘要： A method includes receiving input information related to devices of an integrated circuit. A first simulation of the integrated circuit is performed over a first time period. Average temperature changes of the devices over the first time period are calculated. A second simulation of the integrated circuit is performed over a second time period using the average temperature changes of the devices. The first simulation and the second simulation are executed by a processor unit.

摘要翻译： 一种方法包括接收与集成电路的装置相关的输入信息。 在第一时间段内执行集成电路的第一模拟。 计算设备在第一时间段内的平均温度变化。 使用器件的平均温度变化在第二时间段内执行集成电路的第二仿真。 第一模拟和第二模拟由处理器单元执行。

公开(公告)号：US20150342056A1

公开(公告)日：2015-11-26

申请号：US14284747

申请日：2014-05-22

申请人： International Business Machines Corporation

发明人： Mitchell G. Ferrill ,  Curtis Grosskopf ,  Matthew S. Kelly ,  Thomas H. Lewis ,  Wen Wei Low

IPC分类号： H05K3/00

CPC分类号： G06F17/5081 ,  G06F17/5068 ,  G06F2217/80

摘要： A method for printed circuit board design of temperature sensitive components includes a scrub tool receiving a list of part numbers for electronic components of a printed circuit board assembly (“PCBA”). The scrub tool sends one or more queries for finding temperature and time limits of the electronic components to a database. A mapping tool receives a selection of one or more part numbers responsive to the one or more queries, wherein the selection is responsive to the temperature and time limits. The mapping tool sends a data structure to a physical design tool which is configured with physical design data for generating a graphic representation of the PCBA. The data structure from the mapping tool provides the received selection of one or more part numbers and configures the physical design tool to highlight components having part numbers of the selection on the PCBA graphic representation.

摘要翻译： 温度敏感部件的印刷电路板设计的方法包括：擦拭工具，其接收印刷电路板组件（“PCBA”）的电子部件的部件号列表。 擦洗工具发送一个或多个查询，以查找电子组件的温度和时间限制到数据库。 映射工具响应于一个或多个查询而接收一个或多个部件号的选择，其中所述选择响应于温度和时间限制。 映射工具将数据结构发送到物理设计工具，物理设计工具配置有用于生成PCBA图形表示的物理设计数据。 来自映射工具的数据结构提供了接收到的一个或多个部件号的选择，并且配置物理设计工具来突出显示在PCBA图形表示上具有选择部分编号的部件。

公开(公告)号：US09183330B2

公开(公告)日：2015-11-10

申请号：US13363345

申请日：2012-01-31

申请人： William Matthew Hogan

发明人： William Matthew Hogan

IPC分类号： G06F17/50

CPC分类号： G06F17/5022 ,  G06F2217/78 ,  G06F2217/80

摘要： Aspects of the invention relate to techniques for estimating power and thermal profiles for an integrated circuit design. With various implementations of the invention, a group of devices is identified in a netlist based on information of the group of devices. The netlist may be a schematic netlist or a layout netlist extracted from a layout design. Power consumption information for the group of devices is determined based on device parameters for the group of devices and a lookup table. The determined power consumption information is then associated with layout location information. A thermal profile may then be estimated based on the power consumption information.

摘要翻译： 本发明的方面涉及用于估计集成电路设计的功率和热分布的技术。 通过本发明的各种实现，基于设备组的信息，在网表中识别一组设备。 网表可以是从布局设计中提取的示意网表或布局网表。 基于设备组的设备参数和查找表来确定设备组的功耗信息。 然后将确定的功耗信息与布局位置信息相关联。 然后可以基于功耗信息来估计热分布。

公开(公告)号：US20150278427A1

公开(公告)日：2015-10-01

申请号：US14231200

申请日：2014-03-31

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Shyh-Horng YANG ,  Chung-Kai LIN ,  Chung-Hsing WANG ,  Kuo-Nan YANG ,  Shou-En LIU ,  Jhong-Sheng WANG ,  Tan-Li CHOU

IPC分类号： G06F17/50

CPC分类号： G06F17/5081 ,  G06F17/5036 ,  G06F2217/80

摘要： A method of designing a circuit includes receiving a circuit design, and determining a temperature change of at least on back end of line (BEOL) element of the circuit design. The method further includes identifying at least one isothermal region within the circuit design; and determining, using a processor, a temperature increase of at least one front end of line (FEOL) device within the at least one isothermal region. The method further includes combining the temperature change of the at least one BEOL element with the temperature change of the at least one FEOL device, and comparing the combined temperature change with a threshold value.

摘要翻译： 一种设计电路的方法包括接收电路设计，并确定电路设计的至少后端（BEOL）元件的温度变化。 该方法还包括识别电路设计内的至少一个等温区域; 以及使用处理器确定所述至少一个等温区域内的至少一个前端（FEOL）装置的温度升高。 该方法还包括将至少一个BEOL元件的温度变化与至少一个FEOL装置的温度变化组合，以及将组合的温度变化与阈值进行比较。

公开(公告)号：US20150227667A1

公开(公告)日：2015-08-13

申请号：US14175429

申请日：2014-02-07

申请人： QUALCOMM Incorporated

发明人： Chunchen Liu

IPC分类号： G06F17/50 ,  H05K3/00 ,  H05K1/02

CPC分类号： G06F17/5077 ,  G06F2217/80 ,  G06F2217/84 ,  H05K1/0201 ,  H05K1/0296 ,  H05K3/0005 ,  Y10T29/49162

摘要： A circuit design scheme routes wires based on temperature. In particular, temperature conditions along a prospective route are taken into account when determining whether to use that route for a wire. For example, a route can be selected from among a set of prospective routes based on which route is associated with the “smoothest” temperature gradient. Here, preference may be given to the route or routes having the smallest amount of temperature variation along the route.

摘要翻译： 电路设计方案基于温度来布线。 特别地，当确定是否将该路线用于电线时，将考虑沿着预期路线的温度条件。 例如，可以基于哪个路线与“最平滑的”温度梯度相关联的一组预期路线中的路线选择。 这里，可以优选沿着路线具有最小温度变化量的路线或路线。

公开(公告)号：US20150179529A1

公开(公告)日：2015-06-25

申请号：US14133840

申请日：2013-12-19

申请人： Taiwan Semiconductor Manufacturing Company Limited

发明人： Chih-Liang Chen ,  Jiann-Tyng Tzeng ,  Shu-Hui Sung ,  Charles Chew-Yuen Young

IPC分类号： H01L21/66 ,  G01N25/72

CPC分类号： G06F17/5009 ,  G01R31/2874 ,  G06F17/5068 ,  G06F17/5081 ,  G06F2217/78 ,  G06F2217/80 ,  H01L27/0688

摘要： Among other things, one or more systems and techniques for analyzing a tiered semiconductor structure are provided. One or more segments are defined for the tiered semiconductor structure. The one or more segments are iteratively evaluated during electrical simulation while taking into account thermal properties to determine power metrics for the segments. The power metrics are used to determine temperatures generated by integrated circuitry within the segments. Responsive to a segment having a temperature above a temperature threshold, a temperature action plan, such as providing an alert or inserting one or more thermal release structures into the segment, is implemented. In this way, the one or more segments are iteratively evaluated to identify and resolve thermal and reliability issues.

摘要翻译： 除其他之外，还提供了用于分析分层半导体结构的一个或多个系统和技术。 为分层半导体结构定义一个或多个段。 在电模拟期间迭代地评估一个或多个段，同时考​​虑热属性以确定段的功率度量。 功率度量用于确定段内集成电路产生的温度。 响应于温度高于温度阈值的段，实现诸如提供警报或将一个或多个热释放结构插入到段中的温度行动计划。 以这种方式，迭代地评估一个或多个段以识别和解决热和可靠性问题。

公开(公告)号：US20150178421A1

公开(公告)日：2015-06-25

申请号：US14577644

申请日：2014-12-19

申请人： BrightBox Technologies, Inc.

发明人： Francesco Borrelli ,  Allan Daly ,  Yudong Ma ,  Bruce C. Wootton

IPC分类号： G06F17/50 ,  G05B15/02 ,  F24F11/00

CPC分类号： G06F17/5009 ,  G05B15/02 ,  G06F17/5004 ,  G06F2217/78 ,  G06F2217/80

摘要： A system for and method of modeling thermal performance characteristics of HVAC components in a building uses the building power or other meter to measure power consumed by the components. The models are used to test the components, preferably during off hours, to ensure proper and efficient operation. Preferably, the testing software is written in a high-level interpretive language that is independent of the HVAC component being modeled. The models are adaptively maintained by periodically ensuring that their measured output matches the predicted output. When the two do not match, the model parameters are updated. These models can also be used to generate reports comparing costs and cost savings for different temperature and other environmental settings within selected zones in the building.

摘要翻译： 建筑物中HVAC组件的热性能特性建模系统和建模方法使用建筑物功率或其他仪表来测量组件所消耗的功率。 这些型号用于测试组件，优选在非工作时间内，以确保正确和高效的操作。 优选地，测试软件以独立于被建模的HVAC组件的高级解释语言编写。 这些模型通过定期确保其测量输出与预测输出相匹配来自适应地维护。 当两者不匹配时，模型参数更新。 这些型号还可用于生成报告，以便比较建筑物内所选区域内不同温度和其他环境设置的成本和成本。

公开(公告)号：US20150121331A1

公开(公告)日：2015-04-30

申请号：US14525292

申请日：2014-10-28

申请人： International Business Machines Corporation

发明人： Keiji Matsumoto

IPC分类号： G06F17/50

CPC分类号： G06F17/5077 ,  G06F17/5068 ,  G06F2217/78 ,  G06F2217/80 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/15311

摘要： A method for determining an area of a region for receiving a heat sink on a surface of a chip-supporting substrate is disclosed. The method can include determining, in response to a specified voltage drop associated with substrate wiring, a first set of wiring cross-sectional areas and corresponding lengths that satisfy the specified voltage drop. The method can also include determining, by selecting, in response to a specified thermal resistance associated with substrate wiring and insulating layers, from the first set, a second set of wiring cross-sectional areas and corresponding lengths that satisfy the specified thermal resistance. The method can also include selecting, from a set of placement areas corresponding to the second set of wiring cross-sectional areas and corresponding lengths, a heat sink placement area that is greater than a lower size for a placement area and less than an upper size for a placement area.

摘要翻译： 公开了一种用于确定用于在芯片支撑衬底的表面上接收散热器的区域的面积的方法。 该方法可以包括响应于与衬底布线相关联的指定电压降，确定满足特定电压降的第一组布线横截面积和对应的长度。 该方法还可以包括通过响应于与衬底布线和绝缘层相关联的指定热阻从第一组中选择满足特定热阻的第二组布线横截面区域和对应的长度来确定。 该方法还可以包括从对应于第二组布线横截面区域和相应长度的一组放置区域中选择大于放置区域的较小尺寸并小于上部尺寸的散热器放置区域 用于放置区域。

公开(公告)号：US20150100267A1

公开(公告)日：2015-04-09

申请号：US14399570

申请日：2013-05-10

申请人： Gerald Mischke

发明人： Gerald Mischke

IPC分类号： G01K17/06 ,  G01K13/02

CPC分类号： G01K17/06 ,  G01J5/10 ,  G01J2005/0077 ,  G01K13/02 ,  G01K17/00 ,  G06F17/5004 ,  G06F2217/80

摘要： A method to determine the heat transfer through some enveloping surface is being presented, where a convective as well as a radiation heat-transfer is considered.

摘要翻译： 正在提出一种确定通过一些包封表面的热传递的方法，其中考虑了对流以及辐射热传递。