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    APPARATUS AND A METHOD OF MACHINING A SHAPE THROUGH A COMPONENT
    31.
    发明申请
    APPARATUS AND A METHOD OF MACHINING A SHAPE THROUGH A COMPONENT 有权
    装置和通过组件加工形状的方法

    公开(公告)号：US20160239955A1

    公开(公告)日：2016-08-18

    申请号：US14996776

    申请日：2016-01-15

    申请人： ROLLS-ROYCE plc

    发明人： Graham Charles GUY

    IPC分类号： G06T7/00 ,  B23K26/382 ,  B23H1/04 ,  H04N5/225

    CPC分类号： G06T7/0006 ,  B23H1/04 ,  B23K26/03 ,  B23K26/032 ,  B23K26/14 ,  B23K26/382 ,  B23K2101/001 ,  B64F5/10 ,  G01N21/15 ,  G01N21/954 ,  G01N2021/151 ,  G06T2207/30164 ,  H04N5/2256

    摘要： A method of laser drilling a hole comprising providing a laser source at a first side of a component to laser drill a hole through the component. A light source is positioned in the path of the laser beam at the opposite side of the component. A camera is provided at the first side of the component. The camera is positioned such that it has a line of sight view of the light source through the laser drilled hole. The laser drilled hole in the component is viewed using the light provided by the light source at the opposite side of the component. The parameters of the laser drilled hole are measured using the view of the laser drilled hole provided by the camera and a flow of gas is provided over the surface of the light source to protect the light source.

    摘要翻译： 一种激光钻孔的方法，包括在部件的第一侧提供激光源，以激光钻孔穿过所述部件。 光源位于激光束在组件相对侧的路径中。 在组件的第一侧提供照相机。 相机被定位成使得其具有通过激光钻孔的光源的视线视图。 使用由光源在组件相对侧提供的光来观察组件中的激光钻孔。 使用由照相机提供的激光钻孔的视图来测量激光钻孔的参数，并且在光源的表面上提供气体流以保护光源。

    VAPOR DEPOSITION MASK, VAPOR DEPOSITION MASK PREPARATION BODY, METHOD FOR PRODUCING VAPOR DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR ELEMENT
    33.
    发明申请
    VAPOR DEPOSITION MASK, VAPOR DEPOSITION MASK PREPARATION BODY, METHOD FOR PRODUCING VAPOR DEPOSITION MASK, AND METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR ELEMENT 审中-公开
    蒸气沉积掩模，蒸气沉积掩模制备体，用于生产蒸气沉积掩模的方法和用于生产有机半导体元件的方法

    公开(公告)号：US20160168691A1

    公开(公告)日：2016-06-16

    申请号：US14783736

    申请日：2014-03-24

    申请人： Dai Nippon Printing Co., Ltd.

    发明人： Toshihiko TAKEDA ,  Katsunari OBATA ,  Hiromitsu OCHIAI

    IPC分类号： C23C16/04

    CPC分类号： C23C16/042 ,  B23K26/0604 ,  B23K26/0661 ,  B23K26/082 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/172 ,  B23K2103/50 ,  C23C14/042 ,  H01L27/3211 ,  H01L51/0011

    摘要： There are provided a vapor deposition mask capable of satisfying both high definition and lightweight in upsizing and forming a vapor deposition pattern with high definition while securing strength, a method for producing a vapor deposition mask and a vapor deposition mask preparation body capable of simply producing the vapor deposition mask, and furthermore, a method for producing an organic semiconductor element capable of producing an organic semiconductor element with high definition.A metal mask 10 in which a plurality of slits 15 are provided and a resin mask 20 are stacked. Openings 25 required for composing a plurality of screens are provided in the resin mask 20. The openings 25 correspond to a pattern to be produced by vapor deposition. Each of the slits 15 is provided at a position of overlapping with an entirety of at least one screen.

    摘要翻译： 提供了一种能够在确保强度的同时提高和形成具有高清晰度的气相沉积图案同时具有高清晰度和轻量化的气相沉积掩模，制造气相沉积掩模的方法和能够简单地生产 蒸镀掩模，此外，还可以制造能够制造高分辨率的有机半导体元件的有机半导体元件的制造方法。 设置有多个狭缝15的金属掩模10和层叠树脂掩模20。 构成多个筛网所需的开口25设置在树脂掩模20中。开口25对应于通过气相沉积产生的图案。 每个狭缝15设置在与整个至少一个屏幕重叠的位置。

    METHOD FOR LASER BORING OR LASER CUTTING A WORKPIECE
    34.
    发明申请
    METHOD FOR LASER BORING OR LASER CUTTING A WORKPIECE 审中-公开
    激光打孔或激光切割工艺的方法

    公开(公告)号：US20160167174A1

    公开(公告)日：2016-06-16

    申请号：US14899861

    申请日：2014-06-30

    申请人： ROBERT BOSCH GMBH ,  LASER ZENTRUM HANNOVER E.V.

    发明人： Claudia UNGER ,  Laszlo SAJTI ,  Juergen KOCH ,  Thorsten BAUER

    IPC分类号： B23K26/382 ,  B23K26/18

    CPC分类号： B23K26/382 ,  B23K26/18 ,  B23K26/38 ,  B23K26/389 ,  B23K26/706 ,  B23K2101/001

    摘要： The invention relates to a method for laser boring or laser cutting a workpiece (2), wherein—electromagnetic radiation (10) emitted from a laser strikes the workpiece (2) and—a liquid (16) which contains nanoparticles (18) is located on a workpiece (2) face facing away from the laser such that—the electromagnetic radiation (10) emitted by the laser strikes the nanoparticles (18) when the electromagnetic radiation (10) has passed through the workpiece (2). The nanoparticles are designed such that the majority of the electromagnetic radiation (10) is absorbed by the nanoparticles (18) in that the electromagnetic radiation (10) generates collective excitations, in particular plasmons such as surface plasmons for example, in the nanoparticles (18).

    摘要翻译： 本发明涉及一种用于激光镗孔或激光切割工件（2）的方法，其中从激光器发射的电磁辐射（10）撞击工件（2），并且包含纳米颗粒（18）的液体（16）位于 在离开激光器的工件（2）面上，使得当电磁辐射（10）已经通过工件（2）时，由激光器发射的电磁辐射（10）撞击纳米颗粒（18）。 纳米颗粒被设计成使得大部分电磁辐射（10）被纳米颗粒（18）吸收，因为电磁辐射（10）产生集合的激发，特别是诸如表面等离子体激元的等离子体，例如纳米颗粒（18） ）。

    GLASS CUTTING SYSTEMS AND METHODS USING NON-DIFFRACTING LASER BEAMS
    35.
    发明申请
    GLASS CUTTING SYSTEMS AND METHODS USING NON-DIFFRACTING LASER BEAMS 审中-公开
    玻璃切割系统和使用非衍射激光束的方法

    公开(公告)号：US20160159679A1

    公开(公告)日：2016-06-09

    申请号：US14943765

    申请日：2015-11-17

    申请人： Corning Incorporated

    发明人： James Andrew West

    IPC分类号： C03B33/10 ,  B23K26/402 ,  B23K26/382 ,  B23K26/067 ,  B23K26/06

    CPC分类号： C03B33/102 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/0676 ,  B23K26/38 ,  B23K26/382 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/54 ,  C03B33/0222 ,  Y02P40/57

    摘要： Embodiments are directed to systems for laser cutting at least one glass article comprising a pulsed laser assembly and a glass support assembly configured to support the glass article during laser cutting within the pulsed laser assembly, wherein the pulsed laser assembly comprise at least one non-diffracting beam (NDB) forming optical element configured to convert an input beam into a quasi-NDB beam; and at least one beam transforming element configured to convert the quasi-NDB beam into multiple quasi-NDB sub-beams spaced apart a distance of about 1 μm to about 500 μm; wherein the pulsed laser assembly is oriented to deliver one or more pulses of multiple quasi-NDB sub-beams onto a surface of the glass article, wherein each pulse of multiple quasi-NDB sub-beams is operable to cut a plurality of perforations in the glass article.

    摘要翻译： 实施例涉及用于激光切割至少一个玻璃制品的系统，所述玻璃制品包括脉冲激光组件和玻璃支撑组件，所述玻璃支撑组件被配置为在脉冲激光组件内的激光切割期间支撑玻璃制品，其中脉冲激光组件包括至少一种非衍射 光束（NDB）形成光学元件，被配置为将输入光束转换成准NDB光束; 以及至少一个光束变换元件，被配置为将准NDB光束转换成间隔大约1μm至大约500μm的多个准NDB子光束; 其中所述脉冲激光器组件被定向成将多个准NDB子光束的一个或多个脉冲传送到所述玻璃制品的表面上，其中多个准NDB子光束的每个脉冲可操作以在所述玻璃制品的表面上切割多个穿孔 玻璃制品。

    DEPOSITION MASK AND METHOD FOR PRODUCING DEPOSITION MASK
    37.
    发明申请
    DEPOSITION MASK AND METHOD FOR PRODUCING DEPOSITION MASK 审中-公开
    沉积掩模和生产沉积掩模的方法

    公开(公告)号：US20160115580A1

    公开(公告)日：2016-04-28

    申请号：US14980683

    申请日：2015-12-28

    申请人： V TECHNOLOGY CO., LTD.

    发明人： Michinobu MIZUMURA

    IPC分类号： C23C14/04 ,  B23K11/11 ,  B23K26/382 ,  C23C16/04

    CPC分类号： C23C14/042 ,  B23K11/11 ,  B23K26/382 ,  C23C16/042 ,  H01L51/0011

    摘要： A deposition mask is provided. The deposition mask including: a resin film 1 in which penetrating opening patterns 4 are formed and a frame-shaped metal thin film 5 having an opening is provided on one face 1a of the film 1; a metal mask 2 provided at a position corresponding to the opening of the metal thin film 5 on one face 1a side of the film 1, the metal mask 2 being separated from and independent of the film 1, the metal mask 2 being provided with through holes 6; and a metal frame 3 positioned on one face 1a side of the film 1, the metal frame 3 supporting the film 1 and the metal mask 2 by spot-welding a portion of the metal thin film 5 and an edge region of the metal mask 2 to one end face 3a.

    摘要翻译： 提供沉积掩模。 沉积掩模包括：在膜1的一个表面1a上设置有形成有穿透开口图案4的树脂膜1和具有开口的框状金属薄膜5; 金属掩模2设置在与膜1的一个面1a侧的金属薄膜5的开口对应的位置处，金属掩模2与膜1分离并且独立于膜1，金属掩模2设置有通孔 孔6; 以及位于膜1的一个面1a侧的金属框架3，通过点焊金属薄膜5的一部分和金属掩模2的边缘区域来支撑膜1的金属框架3和金属掩模2 到一个端面3a。

    METHODS OF FORMING HIGH-DENSITY ARRAYS OF HOLES IN GLASS
    38.
    发明申请
    METHODS OF FORMING HIGH-DENSITY ARRAYS OF HOLES IN GLASS 审中-公开
    形成玻璃中高密度阵列的方法

    公开(公告)号：US20160102009A1

    公开(公告)日：2016-04-14

    申请号：US14972352

    申请日：2015-12-17

    申请人： CORNING INCORPORATED

    发明人： Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

    IPC分类号： C03B33/08 ,  C03C23/00 ,  B23K26/386 ,  C03C15/02

    CPC分类号： C03B33/082 ,  B23K26/382 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  C03C15/00 ,  C03C15/02 ,  C03C23/0025 ,  G02B6/1225 ,  G02B6/136

    摘要： A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

    摘要翻译： 提供一种在玻璃中制造高密度孔阵列的方法，包括提供具有前表面的玻璃片，然后用聚焦在+/- 100内的焦点的UV激光束照射玻璃片的前表面 玻璃片的前表面的μm最理想地在前表面的+/-50μm内。 聚焦激光器的透镜的数值孔径希望在0.1至0.4的范围内，更优选在0.1至0.15的范围内，对于玻璃厚度在0.3mm至0.63mm之间，甚至更优选在0.12至0.13的范围内 从玻璃片的前表面102产生从玻璃片100延伸的露出孔，其直径在5至15μm，纵横比至少为20:1的孔中。 对于较薄的玻璃，在0.1-0.3mm的范围内，数值孔径期望地为0.25至0.4，更优选为0.25至0.3，并且该光束优选地聚焦在该光束的前表面的+/-30μm内 玻璃。 期望激光器以约15kHz或更低的重复率操作。 然后可以通过蚀刻来扩大由此产生的孔阵列。 如果需要，前表面可以在蚀刻之前被抛光。

    Methods of forming high-density arrays of holes in glass
    40.
    发明授权
    Methods of forming high-density arrays of holes in glass 有权
    在玻璃中形成高密度孔阵列的方法

    公开(公告)号：US09278886B2

    公开(公告)日：2016-03-08

    申请号：US13989914

    申请日：2011-11-30

    申请人： Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

    发明人： Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

    IPC分类号： B23K26/382 ,  C03C23/00 ,  B23K26/38 ,  B23K26/40 ,  C03C15/00 ,  G02B6/122 ,  G02B6/136

    CPC分类号： C03B33/082 ,  B23K26/382 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  C03C15/00 ,  C03C15/02 ,  C03C23/0025 ,  G02B6/1225 ,  G02B6/136

    摘要： A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

    摘要翻译： 提供一种在玻璃中制造高密度孔阵列的方法，包括提供具有前表面的玻璃片，然后用聚焦在+/- 100内的焦点的UV激光束照射玻璃片的前表面 玻璃片的前表面的μm最理想地在前表面的+/-50μm内。 聚焦激光器的透镜的数值孔径希望在0.1至0.4的范围内，更优选在0.1至0.15的范围内，对于玻璃厚度在0.3mm至0.63mm之间，甚至更优选在0.12至0.13的范围内 从玻璃片的前表面102产生从玻璃片100延伸的露出孔，其直径在5至15μm，纵横比至少为20:1的孔中。 对于较薄的玻璃，在0.1-0.3mm的范围内，数值孔径期望地为0.25至0.4，更优选为0.25至0.3，并且该光束优选地聚焦在该光束的前表面的+/-30μm内 玻璃。 期望激光器以约15kHz或更低的重复率操作。 然后可以通过蚀刻来扩大由此产生的孔阵列。 如果需要，前表面可以在蚀刻之前被抛光。