Abstract:
“An active-load dominant circuit for common-mode glitch interference cancellation, biased between a first voltage potential and a second voltage potential with an accompanying common-mode glitch interferer. The active-load dominant circuit includes a pair of pull-up networks and a pair of active-load networks. The common-mode glitch interferer is cancelled out due to a symmetric structure of the pair of pull-up networks. At least one set signal and at least one reset signal are provided to a latch in response to a clock signal or a complemented clock signal. At least one of the set signal and the reset signal can be pulled up to the first voltage potential or pulled down to the second voltage potential. The voltage difference of the set signal and the reset signal is large enough for a latch.”
Abstract:
A package substrate having landless conductive traces is proposed, which includes a core layer with a plurality of plated through holes formed therein, and a plurality of conductive traces formed on at least a surface of the core layer. Each of the conductive traces has a connection end, a bond pad end, and a base body connecting the connection end and the bond pad end, the conductive trace is electrically connected to a corresponding one of the plated through holes through the connection end, and the connection end has a width greater than that of the base body but not greater than the diameter of the plated through hole, thereby increasing the contact area between the conductive trace and the plated through hole and preventing the contact surface of the conductive trace with the plated through hole from cracking.
Abstract:
This invention discloses a monolithic inductor including a body made by compressing a magnetic powder, a coil positioned in the body, and a permanent magnet positioned in the body and in a magnetic circuit formed by applying current to the coil. The monolithic inductor of this invention includes the magnetic body containing the permanent magnet and the coil. The permanent magnet in the magnetic circuit (path of magnetic flux lines) formed by applying current to the coil generates a reverse-bias magnetic field, thereby increasing the operating range of the magnetic body, the saturation current of the magnetic body, and the rated current of the inductor.
Abstract:
A MOSFET includes a gate having a high-k gate dielectric on a substrate and a gate electrode on the gate dielectric. The gate dielectric protrudes beyond the gate electrode. A deep source and drain having shallow extensions are formed on either side of the gate. The deep source and drain are formed by selective in-situ doped epitaxy or by ion implantation and the extensions are formed by selective, in-situ doped epitaxy. The extensions lie beneath the gate in contact with the gate dielectric. The material of the gate dielectric and the amount of its protrusion beyond the gate electrode are selected so that epitaxial procedures and related procedures do not cause bridging between the gate electrode and the source/drain extensions. Methods of fabricating the MOSFET are described.
Abstract:
A DC-DC converter is provided. The DC-DC converter a power stage includes a first high side driver and a protecting circuit including a second high side driver, wherein the first high side driver and the second high side driver are connected in parallel, and operate in complementary.
Abstract:
A pulse filter and a bridge driver using the same, the pulse filter including: a first NMOS transistor, having a drain coupled to a first PMOS transistor for providing a reset signal, a gate coupled to a second reset signal, and a source coupled to a second set signal; a second NMOS transistor, having a drain coupled to a second PMOS transistor for providing a set signal, a gate coupled to the second set signal, and a source coupled to the second reset signal; a third NMOS transistor, having a drain coupled to the second set signal, a gate coupled to the second reset signal, and a source coupled to a second power line; and a fourth NMOS transistor, having a drain coupled to the second reset signal, a gate coupled to the second set signal, and a source coupled to the second power line.
Abstract:
A semiconductor structure includes a chip, a plurality of metal posts disposed in the chip and a buffer layer disposed on the chip. The chip includes a silicon-based layer having opposite first and second surfaces, and a build-up structure formed on the first surface of the silicon-based layer consisting of at least a metal layer and a low-k dielectric layer alternatively stacked on one another. Each of the metal posts is disposed in the silicon-based layer with one end thereof electrically connected with the metal layer while the other end is exposed from the second surface of the silicon-based layer. The buffer layer is disposed on the build-up structure. By positioning the low-k dielectric layer far from the second surface that is used for connecting to an external electronic component, the present invention reduces the overall thermal stress.
Abstract:
A MOSFET includes a gate having a high-k gate dielectric on a substrate and a gate electrode on the gate dielectric. The gate dielectric protrudes beyond the gate electrode. A deep source and drain having shallow extensions are formed on either side of the gate. The deep source and drain are formed by selective in-situ doped epitaxy or by ion implantation and the extensions are formed by selective, in-situ doped epitaxy. The extensions lie beneath the gate in contact with the gate dielectric. The material of the gate dielectric and the amount of its protrusion beyond the gate electrode are selected so that epitaxial procedures and related procedures do not cause bridging between the gate electrode and the source/drain extensions. Methods of fabricating the MOSFET are described.
Abstract:
The present invention relates to a power inductor having a heat dissipating structure formed on the surface thereof, which comprises: at least a conducting wire; and a cladding, made of a magnetic material for wrapping the conductive wire, having the heat dissipating structure of embossed patterns formed on the surface thereof. Preferably, the embossed pattern can be a cone, a cuboid, a column, or the combination thereof. Moreover, the length of any edge or the diameter of any one of the embossed patterns is about 1%˜50% of that of the power inductor, and the height of any one of the embossed patterns is about 1%˜50% of the thickness of the power inductor.
Abstract:
A transistor having a discontinuous contact etch stop layer comprising: a substrate having a surface, a gate dielectric on said surface of said substrate, a gate electrode on said gate dielectric, a spacer along a sidewall of said gate dielectric and gate electrode, a source and a drain formed on opposite sides, respectively, of said gate dielectric and said gate electrode, the source and drain defining a channel region having a channel length extending substantially from said source to said drain, in the substrate therebetween, and a contact etch stop layer on said gate and said spacers, and said source and drain. The contact etch stop layer is substantially locally continuous in a direction perpendicular to the channel region length and substantially locally discontinuous in a direction parallel to the channel region length.