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95 条记录 (耗时 0.028 秒)

    SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER
    35.
    发明申请
    SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER 有权

    公开(公告)号：US20210047176A1

    公开(公告)日：2021-02-18

    申请号：US16542489

    申请日：2019-08-16

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Chun-Wen Cheng ,  Chia-Hua Chu ,  Wen Cheng Kuo

    IPC分类号： B81C1/00 ,  B81B7/00

    摘要： Various embodiments of the present disclosure are directed towards a microphone including a support structure layer disposed between a particle filter and a microelectromechanical systems (MEMS) structure. A carrier substrate is disposed below the particle filter and has opposing sidewalls that define a carrier substrate opening. The MEMS structure overlies the carrier substrate and includes a diaphragm having opposing sidewalls that define a diaphragm opening overlying the carrier substrate opening. The particle filter is disposed between the carrier substrate and the MEMS structure. A plurality of filter openings extend through the particle filter. The support structure layer includes a support structure having one or more segments spaced laterally between the opposing sidewalls of the carrier substrate. The one or more segments of the support structure are spaced laterally between the plurality of filter openings.

    MEMS microphone having diaphragm
    36.
    发明授权
    MEMS microphone having diaphragm 有权

    公开(公告)号：US10715924B2

    公开(公告)日：2020-07-14

    申请号：US16016996

    申请日：2018-06-25

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Chun-Wen Cheng ,  Chia-Hua Chu ,  Chun Yin Tsai

    IPC分类号： H04R19/00 ,  H04R19/04 ,  H04R31/00

    摘要： A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.

    Structures and formation methods of micro-electro mechanical system device
    39.
    发明授权
    Structures and formation methods of micro-electro mechanical system device 有权
    微机电系统装置的结构和形成方法

    公开(公告)号：US09567206B2

    公开(公告)日：2017-02-14

    申请号：US14276295

    申请日：2014-05-13

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Chia-Hua Chu ,  Chun-Wen Cheng ,  Shang-Ying Tsai ,  Chin-Wei Liang

    IPC分类号： B81B7/02 ,  B81B7/00 ,  B81C1/00

    CPC分类号： B81B7/0041 ,  B81B7/02 ,  B81C1/00238 ,  B81C1/00293

    摘要： A micro-electro mechanical system (MEMS) device is provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first closed chamber between the MEMS substrate and the cap substrate, and the first movable element is in the first closed chamber. The MEMS device further includes an outgassing layer in the first closed chamber. In addition, the MEMS device includes a second closed chamber between the MEMS substrate and the cap substrate, and the second movable element is in the second closed chamber.

    摘要翻译： 提供了微机电系统（MEMS）装置。 MEMS器件包括盖衬底和与衬底接合的MEMS衬底。 MEMS基板包括第一可移动元件和第二可移动元件。 MEMS器件还包括在MEMS衬底和盖衬底之间的第一封闭腔室，并且第一可移动元件位于第一封闭腔室中。 MEMS装置还包括在第一封闭室中的除气层。 另外，MEMS器件包括在MEMS衬底和盖衬底之间的第二闭合腔，并且第二可移动元件位于第二闭合腔中。

    Biosensor with a sensing surface on an interlayer dielectric
    40.
    发明授权
    Biosensor with a sensing surface on an interlayer dielectric 有权
    生物传感器在层间电介质上具有感测表面

    公开(公告)号：US09488615B2

    公开(公告)日：2016-11-08

    申请号：US14573162

    申请日：2014-12-17

    申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

    发明人： Chun-Wen Cheng ,  Fei-Lung Lai ,  Chia-Hua Chu ,  Yi-Hsien Chang ,  Hsin-Chieh Huang

    IPC分类号： G01N27/414 ,  H01L23/498 ,  H01L21/48

    CPC分类号： G01N27/4148 ,  G01N27/4145 ,  H01L21/486 ,  H01L23/5226 ,  H01L23/5283 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present disclosure relates to an integrated chip having an integrated bio-sensor having horizontal and vertical sensing surfaces. In some embodiments, the integrated chip has a sensing device disposed within a semiconductor substrate. A back-end-of the line (BEOL) metallization stack with a plurality of metal interconnect layers electrically coupled to the sensing device is arranged within an inter-level dielectric (ILD) layer overlying the semiconductor substrate. A sensing well is located within a top surface of the ILD layer. The sensing well has a horizontal sensing surface extending along a top surface of a first one of the plurality of metal interconnect layers and a vertical sensing surface extending along a sidewall of a second one of the plurality of metal interconnect layers overlying the first one of the plurality of metal interconnect layers. The use of both horizontal and vertical sensing surfaces enables more accurate sensing.

    摘要翻译： 本公开涉及具有集成的生物传感器的集成芯片，其具有水平和垂直的感测表面。 在一些实施例中，集成芯片具有设置在半导体衬底内的感测装置。 具有电耦合到感测装置的多个金属互连层的线路后端（BEOL）金属化堆叠被布置在覆盖半​​导体衬底的层间电介质（ILD）层内。 感测井位于ILD层的顶表面内。 感测井具有沿着多个金属互连层中的第一个的顶表面延伸的水平感测表面和垂直感测表面，该垂直感测表面沿着多个金属互连层中的第一个上的第一个金属互连层的第二个 多个金属互连层。 使用水平和垂直传感表面可以实现更准确的感测。