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    MEMS packaging techniques
    31.
    发明授权
    MEMS packaging techniques 有权
    MEMS封装技术

    公开(公告)号：US09290376B1

    公开(公告)日：2016-03-22

    申请号：US14737896

    申请日：2015-06-12

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chun-Wen Cheng ,  Chien-Hsuan Tai ,  Chia-Hua Chu

    IPC: H01L27/00 ,  B81B7/00 ,  B81C1/00 ,  H01L27/12 ,  H01L27/20 ,  H01L27/146

    CPC classification number: H01L27/12 ,  B81B2203/0127 ,  B81C1/00238 ,  H01L27/14692 ,  H01L27/20

    Abstract: In some embodiments, the present disclosure provides a MEMS package. The MEMS package includes a MEMS IC comprising a MEMS substrate, a dielectric layer disposed over the MEMS substrate, and a piezoelectric layer disposed over the dielectric layer. The dielectric layer includes a flexible diaphragm made of dielectric material, and the piezoelectric layer includes a piezoelectric opening over the flexible diaphragm. A CMOS IC includes a CMOS substrate and an electrical interconnect structure. The CMOS IC is bonded to the MEMS IC so the electrical interconnect structure is proximate to the piezoelectric layer and so the CMOS IC encloses a back cavity over the flexible diaphragm. A support layer is disposed between the electrical interconnect structure and the piezoelectric layer. The support layer has a support layer opening which is disposed at a position vertically aligned with the flexible diaphragm and which is a part of the back cavity.

    Abstract translation: 在一些实施例中，本公开提供了MEMS封装。 MEMS封装包括包括MEMS衬底的MEMS IC，设置在MEMS衬底上的电介质层和设置在电介质层上的压电层。 电介质层包括由电介质材料制成的柔性隔膜，压电层包括柔性隔膜上方的压电开口。 CMOS IC包括CMOS衬底和电互连结构。 CMOS IC结合到MEMS IC，使得电互连结构接近于压电层，因此CMOS IC在柔性隔膜上封闭后腔。 支撑层设置在电互连结构和压电层之间。 支撑层具有支撑层开口，该支撑层开口设置在与柔性隔膜垂直对准的位置，并且是后腔的一部分。

    SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER
    36.
    发明申请
    SUPPORT STRUCTURE FOR MEMS DEVICE WITH PARTICLE FILTER 有权

    公开(公告)号：US20210047176A1

    公开(公告)日：2021-02-18

    申请号：US16542489

    申请日：2019-08-16

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chun-Wen Cheng ,  Chia-Hua Chu ,  Wen Cheng Kuo

    IPC: B81C1/00 ,  B81B7/00

    Abstract: Various embodiments of the present disclosure are directed towards a microphone including a support structure layer disposed between a particle filter and a microelectromechanical systems (MEMS) structure. A carrier substrate is disposed below the particle filter and has opposing sidewalls that define a carrier substrate opening. The MEMS structure overlies the carrier substrate and includes a diaphragm having opposing sidewalls that define a diaphragm opening overlying the carrier substrate opening. The particle filter is disposed between the carrier substrate and the MEMS structure. A plurality of filter openings extend through the particle filter. The support structure layer includes a support structure having one or more segments spaced laterally between the opposing sidewalls of the carrier substrate. The one or more segments of the support structure are spaced laterally between the plurality of filter openings.

    MEMS microphone having diaphragm
    37.
    发明授权
    MEMS microphone having diaphragm 有权

    公开(公告)号：US10715924B2

    公开(公告)日：2020-07-14

    申请号：US16016996

    申请日：2018-06-25

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chun-Wen Cheng ,  Chia-Hua Chu ,  Chun Yin Tsai

    IPC: H04R19/00 ,  H04R19/04 ,  H04R31/00

    Abstract: A MEMS microphone includes a backplate that has a plurality of open areas, and a diaphragm spaced apart from the backplate. The diaphragm is deformable by sound waves to cause gaps between the backplate and the diaphragm being changed at multiple locations on the diaphragm. The diaphragm includes a plurality of anchor areas, located near a boundary of the diaphragm, which is fixed relative to the backplate. The diaphragm also includes multiple vent valves. Examples of the vent valve include a wing vent valve and a vortex vent valve.

    Structures and formation methods of micro-electro mechanical system device
    40.
    发明授权
    Structures and formation methods of micro-electro mechanical system device 有权
    微机电系统装置的结构和形成方法

    公开(公告)号：US09567206B2

    公开(公告)日：2017-02-14

    申请号：US14276295

    申请日：2014-05-13

    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

    Inventor： Chia-Hua Chu ,  Chun-Wen Cheng ,  Shang-Ying Tsai ,  Chin-Wei Liang

    IPC: B81B7/02 ,  B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0041 ,  B81B7/02 ,  B81C1/00238 ,  B81C1/00293

    Abstract: A micro-electro mechanical system (MEMS) device is provided. The MEMS device includes a cap substrate and a MEMS substrate bonded with the cap substrate. The MEMS substrate includes a first movable element and a second movable element. The MEMS device also includes a first closed chamber between the MEMS substrate and the cap substrate, and the first movable element is in the first closed chamber. The MEMS device further includes an outgassing layer in the first closed chamber. In addition, the MEMS device includes a second closed chamber between the MEMS substrate and the cap substrate, and the second movable element is in the second closed chamber.

    Abstract translation: 提供了微机电系统（MEMS）装置。 MEMS器件包括盖衬底和与衬底接合的MEMS衬底。 MEMS基板包括第一可移动元件和第二可移动元件。 MEMS器件还包括在MEMS衬底和盖衬底之间的第一封闭腔室，并且第一可移动元件位于第一封闭腔室中。 MEMS装置还包括在第一封闭室中的除气层。 另外，MEMS器件包括在MEMS衬底和盖衬底之间的第二闭合腔，并且第二可移动元件位于第二闭合腔中。

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