公开(公告)号：US06557248B1

公开(公告)日：2003-05-06

申请号：US09087332

申请日：1998-05-29

Applicant: Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspeil ,  Ron Northrup ,  Semyon Sherstinsky ,  Sasson Someth

Inventor： Shamouil Shamouilian ,  Manoocher Birang ,  John F. Cameron ,  Chandra Deshpandey ,  Alfred Goldspeil ,  Ron Northrup ,  Semyon Sherstinsky ,  Sasson Someth

IPC: H01R4300

CPC classification number: C23C16/45521 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/6831 ,  H01L21/6833 ,  H02N13/00 ,  Y10T29/49117 ,  Y10T279/23

Abstract: A method of fabricating an electrostatic member 33 for holding a substrate 45 in a process chamber 80 containing erosive process gas. The method comprises the steps of forming an electrostatic member 33 comprising an insulator or dielectric layer 35 covering an electrically conductive layer, and shaping the electrostatic member 33 to form a dielectric covered electrode and an electrical connector 55 attached to the dielectric covered electrode 50 to conduct charge to the dielectric covered electrode 50.

Abstract translation: 一种制造静电部件33的方法，用于将基板45保持在包含腐蚀性处理气体的处理室80中。 该方法包括以下步骤：形成包括覆盖导电层的绝缘体或电介质层35的静电部件33，并且使静电部件33成形以形成介电覆盖电极和连接到电介质被覆电极50的电连接器55 充电到介电覆盖电极50。

公开(公告)号：US06554003B1

公开(公告)日：2003-04-29

申请号：US09698819

申请日：2000-10-26

Applicant: Manoocher Birang ,  Bruno Strul

Inventor： Manoocher Birang ,  Bruno Strul

IPC: B08B600

CPC classification number: H01L21/67253 ,  B08B3/048 ,  B08B3/12 ,  H01L21/67057

Abstract: Methods and apparatus are provided for cleaning a thin disc. In accordance with a first aspect, an apparatus is provided that includes a tank adapted to contain a fluid, and at least one support mechanism adapted to support a thin disc such that the thin disc is at least partially submerged in the fluid. The apparatus further includes a plurality of transducers each adapted to produce energy waves in the fluid, and a controller adapted to adjust the energy waves produced by each transducer so as to scan an energy wave maximum along a surface of a thin disc supported by the at least one support mechanism.

Abstract translation: 提供了用于清洁薄盘的方法和装置。 根据第一方面，提供了一种装置，其包括适于容纳流体的罐和适于支撑薄盘的至少一个支撑机构，使得所述薄盘至少部分地浸没在所述流体中。 该装置还包括多个换能器，每个换能器适于在流体中产生能量波，以及控制器，其适于调节由每个换能器产生的能量波，以便沿着由at支撑的薄盘的表面扫描能量波最大值 至少一个支持机制。

公开(公告)号：US06540594B2

公开(公告)日：2003-04-01

申请号：US10071745

申请日：2002-02-08

Applicant: Steven M. Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

Inventor： Steven M. Zuniga ,  Manoocher Birang ,  Hung Chen ,  Sen-Hou Ko

IPC: B24B500

CPC classification number: B24B37/30 ,  B24B37/32

Abstract: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

公开(公告)号：US06537133B1

公开(公告)日：2003-03-25

申请号：US09672549

申请日：2000-09-28

Applicant: Manoocher Birang ,  Nils Johansson ,  Allan Gleason

Inventor： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

IPC: B24B4900

CPC classification number: B24B47/12 ,  B24B37/013 ,  B24B37/205 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683

Abstract: An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.

Abstract translation: 使用用于在CMP处理期间原地确定终止该过程的端点的装置的晶片的化学机械抛光（CMP）的装置和方法。 该装置包括能够产生朝向晶片的激光束并检测从晶片反射的光的激光干涉仪，以及邻近通过压板形成的孔布置的窗口。 该窗口在晶片覆盖窗口的至少部分时间内为激光束提供通路。

公开(公告)号：US06516816B1

公开(公告)日：2003-02-11

申请号：US09544660

申请日：2000-04-06

Applicant: Anwar Husain ,  Brian J. Brown ,  David G. Andeen ,  Svetlana Sherman ,  John M. White ,  Michael Sugarman ,  Makoto Inagawa ,  Manoocher Birang

Inventor： Anwar Husain ,  Brian J. Brown ,  David G. Andeen ,  Svetlana Sherman ,  John M. White ,  Michael Sugarman ,  Makoto Inagawa ,  Manoocher Birang

IPC: B08B302

CPC classification number: H01L21/67028 ,  Y10S134/902

Abstract: An inventive vertical spin-dryer is provided. The inventive spin-dryer may have a shield system positioned to receive fluid displaced from a substrate vertically positioned within the spin-dryer. The shield system may have one or more shields positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The one or more shields are angled to encourage the flow of fluid therealong, and are preferably hydrophilic to prevent droplets from forming. Preferably the shield system has three shields positioned in a horizontally and vertically staggered manner so that fluid is transferred from a substrate facing surface of a first shield to the top or non-substrate-facing surface of an adjacent shield, etc. A pressure gradient may be applied across the interior of the spin-dryer to create an air flow which encourages fluid to travel along the shield system in a desired direction. A sensor adapted to facilitate desired flywheel position, an openable gripper having a remote actuator, a radiused gripper and a source of inert drying gas are also provided in individual embodiments.

公开(公告)号：US06511367B2

公开(公告)日：2003-01-28

申请号：US10059519

申请日：2002-01-28

Applicant: Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

Inventor： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC: B24B500

CPC classification number: B24B37/30 ,  B24B37/32 ,  B24B49/16

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the same purpose.

公开(公告)号：US06474712B1

公开(公告)日：2002-11-05

申请号：US09559889

申请日：2000-04-26

Applicant: Boris I. Govzman ,  Manoocher Birang ,  Michael Sugarman ,  Anwar Husain

Inventor： Boris I. Govzman ,  Manoocher Birang ,  Michael Sugarman ,  Anwar Husain

IPC: B66C100

CPC classification number: H01L21/68707 ,  Y10S414/141

Abstract: A gripper assembly is provided which supports a substrate in a vertical orientation. The gripper assembly's end effectors contact only the edge of the substrate. In a first aspect the end effectors each comprise a first pair of opposed surfaces and an second pair of opposed surfaces, all of which simultaneously contact the substrate, holding the substrate in a clamp-type manner. In a second aspect the end effectors each comprise a lower pair of opposed surfaces which simultaneously contact the substrate, and an upper pair of opposed surfaces, larger than the thickness of the substrate, which limit the substrate from horizontal tilting. In the second aspect the end effectors can close at a first elevation where they do not contact the substrate, and can then elevate to gently contact and support the substrate in a pocket-like manner. In a third aspect one of the end effectors has two pairs of opposed surfaces which simultaneously contact the substrate, and the other end effector has two pairs of opposed surfaces which limit the substrate from horizontal tilting. In any aspect no moving parts are required to limit the substrate's vertical and horizontal movement. In a further aspect, fingers to which the end effectors are coupled, are bent so that the gripper is not positioned above the substrate.

Abstract translation: 提供了一种夹持器组件，其以垂直取向支撑衬底。 夹持器组件的端部执行器仅接触基板的边缘。 在第一方面，端部执行器各自包括第一对相对表面和第二对相对表面，所述第二对相对表面同时接触基板，以夹紧方式保持基板。 在第二方面，端部执行器各自包括同时接触基板的下一对相对表面，以及大于基板厚度的上对对相对表面，其将基板限制为水平倾斜。 在第二方面，末端效应器可以在它们不接触衬底的第一高度处关闭，然后可以以袋状方式轻轻地接触和支撑衬底。 在第三方面中，一个端部执行器具有两对同时接触基板的相对表面，而另一端部执行器具有两对相对的表面，这些对面限制了基板的水平倾斜。 在任何方面，无需移动部件来限制基板的垂直和水平运动。 在另一方面，端部执行器耦合到的手指被弯曲，使得夹持器不位于衬底上方。

公开(公告)号：US06383058B1

公开(公告)日：2002-05-07

申请号：US09493859

申请日：2000-01-28

Applicant: Manoocher Birang ,  Boguslaw Swedek

Inventor： Manoocher Birang ,  Boguslaw Swedek

IPC: B24B722

CPC classification number: B24B37/205 ,  B24B37/013 ,  G05B19/4163

Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad. A light beam is directed by an optical endpoint detection system to impinge the surface of the substrate. A signal from the optical endpoint detection system is monitored, and if a first endpoint criterion is not detected within a first time window, polishing is stopped at a default polishing time. If the first endpoint criterion is detected within the first time window, the signal is monitored for the second endpoint criterion, and polishing stops if the second endpoint criterion is detected.

Abstract translation: 一种装置以及一种方法使基板的表面与抛光垫接触。 光束由光学终点检测系统引导以撞击衬底的表面。 监测来自光学终点检测系统的信号，并且如果在第一时间窗口内未检测到第一端点标准，则在默认抛光时间停止抛光。 如果在第一时间窗口内检测到第一终点标准，则监视第二终点标准的信号，如果检测到第二终点标准，则抛光停止。

公开(公告)号：US6146259A

公开(公告)日：2000-11-14

申请号：US907810

申请日：1997-08-08

Applicant: Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

Inventor： Steven M. Zuniga ,  Hung Chih Chen ,  Manoocher Birang ,  Kapila Wijekoon ,  Sen-Hou Ko

IPC: B24B37/30 ,  B24B37/32 ,  B24B49/16 ,  H01L21/304 ,  B24B47/02

CPC classification number: B24B37/30 ,  B24B37/32 ,  B24B49/16

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the purpose.

Abstract translation: 用于化学机械抛光装置的载体头包括柔性膜，其下表面提供基板接收表面。 承载头可以包括与柔性膜的上表面接触的突起，以将增加的负载施加到基底的潜在的被抛光的区域。 流体射流可用于此目的。

公开(公告)号：US5646814A

公开(公告)日：1997-07-08

申请号：US276010

申请日：1994-07-15

Applicant: Shamouil Shamouilian ,  Samuel Broydo ,  Manoocher Birang

Inventor： Shamouil Shamouilian ,  Samuel Broydo ,  Manoocher Birang

IPC: B23Q3/15 ,  H01L21/683 ,  H02N13/00

CPC classification number: H01L21/6875 ,  H01L21/6831 ,  H01L21/6833

Abstract: A multi-electrode electrostatic chuck (20) for holding a substrate (42) such as a silicon wafer during processing is described. The electrostatic chuck (20) comprises (i) a first electrode (22), (ii) a second electrode (24), and (iii) an insulator (26) having a lower portion (26a), a middle portion (26b) and an upper portion (26c). The lower portion (26a) of the insulator (26) is below the first electrode (22) and has a bottom surface (28) suitable for resting the chuck (20) on a support (44) in a process chamber (41). The middle portion (26b) of the insulator (26) lies between the first and second electrodes (22), (24). The upper portion (26c) of the insulator (26) is on the second electrode (24), and has a top surface (30) suitable for holding a substrate (42). The first and second electrodes (22, 24) can have a unipolar or bipolar configurations. In operation, the chuck (20) is placed on a support (44) in a process chamber (41) so that the bottom surface (28) of the chuck (20) rests on the support (44). A substrate (42) is placed on the top surface (30) of the chuck (20). When the first electrode (22) of the chuck (20) is electrically biased with respect to the support (44), a first electrostatic force holds the chuck (20) onto the support (44). When the second electrode (24) of the chuck (20) is electrically biased with respect to the substrate (42) placed on the chuck (20), a second electrostatic force holds the substrate (42) to the chuck (20).

Abstract translation: 描述了用于在处理期间保持硅晶片等基板（42）的多电极静电卡盘（20）。 静电卡盘（20）包括（i）第一电极（22），（ii）第二电极（24）和（iii）具有下部分（26a）的绝缘体（26），中间部分（26b） 和上部（26c）。 绝缘体（26）的下部（26a）位于第一电极（22）的下面，并且具有适于将卡盘（20）放置在处理室（41）中的支撑件（44）上的底表面（28）。 绝缘体（26）的中间部分（26b）位于第一和第二电极（22），（24）之间。 绝缘体（26）的上部（26c）在第二电极（24）上，并且具有适于保持基板（42）的顶表面（30）。 第一和第二电极（22,24）可以具有单极或双极结构。 在操作中，卡盘（20）被放置在处理室（41）中的支撑件（44）上，使得卡盘（20）的底表面（28）搁置在支撑件（44）上。 基板（42）被放置在卡盘（20）的顶表面（30）上。 当卡盘（20）的第一电极（22）相对于支撑件（44）被电偏置时，第一静电力将卡盘（20）保持在支撑件（44）上。 当卡盘（20）的第二电极（24）相对于放置在卡盘（20）上的基板（42）电气偏置时，第二静电力将基板（42）保持在卡盘（20）上。