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公开(公告)号：US20140148007A1
公开(公告)日：2014-05-29
申请号：US14170062
申请日：2014-01-31
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ji Hwang KIM , Sunpil YOUN , Sangwon KIM , Kwang-chul CHOI , Tae Hong MIN
IPC: H01L21/768
CPC classification number: H01L21/76898 , H01L21/563 , H01L21/768 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/481 , H01L23/49816 , H01L2224/02372 , H01L2224/0401 , H01L2224/0557 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2225/06568 , H01L2924/00014 , H01L2924/15311 , H01L2924/00 , H01L2224/05552
Abstract: A semiconductor device includes a substrate having a first side and a second side such that the first and second sides face each other, a through via plug penetrating the substrate, an insulating film liner, and an antipollution film. The insulating film liner is between the through via plug and the substrate and the insulating film liner has a recessed surface with respect to the second side. The antipollution film covers the second side and the antipollution film is on the recessed surface and between the through via plug and the substrate.
Abstract translation: 半导体器件包括具有第一侧和第二侧的基板，使得第一和第二面彼此面对，贯穿基板的通孔塞，绝缘膜衬垫和防污染膜。 绝缘膜衬垫位于通孔插塞和衬底之间，并且绝缘膜衬套相对于第二侧具有凹陷表面。 防污染膜覆盖第二面，防污染膜位于凹陷表面上，并且在通孔插塞和基底之间。
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32.发明申请公开(公告)号：US20250167043A1
公开(公告)日：2025-05-22
申请号：US18948843
申请日：2024-11-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Keun Wook SHIN , Sangwon KIM , Joonseok KIM , Joonyun KIM , Daejin YANG , Chang Seok LEE , Tae Won JEONG , GIYOUNG JO , LUHING HU
IPC: H01L21/768 , H01L23/522 , H01L23/532
Abstract: An interconnect structure including a dielectric layer having a trench structure; a conductive wiring including a metal compound represented by Chemical Formula 1 disposed within the trench structure (conductive interconnect), and air gap disposed between the conductive wiring. The trench structure has a line width of less than or equal to about 10 nm and an aspect ratio of greater than or equal to about 3. MXa Chemical Formula 1 In Chemical Formula 1, M is at least one metal of Zr, Nb, Cu, Ru, Al, Co, W, Mo, Ti, Ta, Ni, Pt, Cr, Rh, Ir, Pd, or Os, X is at least one element of C, N, P, As, S, Se, or Te, and a is a number determined by the stoichiometry of M and X.
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33.发明公开公开(公告)号：US20240168695A1
公开(公告)日：2024-05-23
申请号：US18540540
申请日：2023-12-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangwon KIM , Jeongryeol Seo , Younghoon Cho
CPC classification number: G06F3/1446 , G09G5/003 , G09G2300/026 , G09G2370/04
Abstract: Provided is a display module including a communication interface; and a plurality of driver integrated circuits (ICs), wherein a first driver IC among the plurality of driver ICs is configured to: based on obtaining a driving signal from an external device through the communication interface, provide the driving signal to a second driver IC adjacent to the first driver IC so that the driving signal is sequentially provided to remaining driver ICs among the plurality of driver ICs, and provide, to a second display module among the plurality of display modules, the driving signal based on module connection information including whether the second display module is connected to any one display module among the plurality of display modules by a daisy chain method.
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公开(公告)号：US20230267878A1
公开(公告)日：2023-08-24
申请号：US18308828
申请日：2023-04-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jeongryeol SEO , Sangwon KIM , Youngkook KIM
IPC: G09G3/32
CPC classification number: G09G3/32 , G09G2300/026 , G09G2360/04 , G09G2370/06 , G09G2370/16
Abstract: A display apparatus of a plurality of display apparatues constituting a wall display includes a first board, a second board, and a plurality of display modules. The first board includes a first communication interface including a circuitry for wireless transmission, and a timing controller configured to, in response to information on an image being received, generate a plurality of driving signals for driving the plurality of display modules based on the received information and transmit the plurality of driving signals to the second board through the first communication interface. The second board includes a second communication interface including circuitry for wireless reception, a plurality of interfaces electrically connected to the plurality of display modules, and an IC chip configured to, based on the plurality of driving signals being received through the second interface, provide each of the received driving signals to each of the display modules.
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公开(公告)号：US20220270565A1
公开(公告)日：2022-08-25
申请号：US17686165
申请日：2022-03-03
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jeongryeol SEO , Sangwon KIM , Youngkook KIM
IPC: G09G5/00 , G06F3/14 , H04L67/104
Abstract: An electronic apparatus communicating with a display apparatus including a plurality of display modules is provided. The electronic apparatus includes an Ethernet switch; and a processor connected to the Ethernet switch and including a virtual Ethernet port to which an Internet Protocol (IP) address is pre-allocated, wherein the processor is configured to: configure a network with an external electronic apparatus based on the IP address, and based on a signal for setting a screen of a display module, among the plurality of display modules, connected to a port of the Ethernet switch being received from the external electronic apparatus through the network, control the Ethernet switch to transmit the signal for setting the screen to the display module.
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Patent Agency Ranking
公开(公告)号：US20220171098A1
公开(公告)日：2022-06-02
申请号：US17459537
申请日：2021-08-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Taejin CHOI , Hyeonjin SHIN , Changseok LEE , Sangwon KIM
IPC: G02B1/113 , H01L27/146 , H01L21/027 , H01L31/0216 , H01L31/052 , H01L51/52 , G03F7/09
Abstract: Provided are an amorphous boron nitride film and an anti-reflection coating structure including the amorphous boron nitride film. The amorphous boron nitride film has an amorphous structure including an sp3 hybrid bond and an sp2 hybrid bond, in which a ratio of the sp3 hybrid bond in the amorphous boron nitride film is less than about 20%.
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37.发明申请公开(公告)号：US20210399826A1
公开(公告)日：2021-12-23
申请号：US17292860
申请日：2019-11-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Keonyoung LEE , Sangwon KIM
Abstract: Disclosed in various embodiments of the present invention are: an apparatus using a modulation and coding scheme (MCS) index table in a wireless communication system; an MCS index table determination method therefor; and an apparatus therefor. According to various embodiments of the present invention, an electronic device comprises at least one communication circuit for supporting wireless communication with a base station, a memory for storing at least two MCS index tables, and a processor operatively connected to the communication circuit and the memory, wherein the processor receives downlink control information (DCI), which includes a retransmission MCS index so as to be retransmitted from the base station, by using the communication circuit when a cyclic redundancy check (CRC) fails, compares same with the retransmission MCS index stored in the memory, on the basis of the retransmission MCS index of the downlink control information, determines a mismatch between the MCS index tables on the basis of determining that the retransmission MCX indexes differ, and restores the MCS index table on the basis of determining the mismatch between the MCS index tables. Additional various embodiments are possible.
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公开(公告)号：US20190384559A1
公开(公告)日：2019-12-19
申请号：US16393075
申请日：2019-04-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangwon KIM , Youngkook Kim , Jeongryeol Seo , Hyewon Lee
Abstract: An electronic apparatus includes an interface connected to a modular display apparatus, and a processor for transmitting an image signal to the modular display apparatus connected through the interface. The processor divides a plurality of display modules included in the modular display apparatus into a plurality of groups based on a vertical direction, divides the image signal into a plurality of image signals corresponding to the plurality of groups, and transmits the divided plurality of image signals to the plurality of groups.
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39.发明申请公开(公告)号：US20180061734A1
公开(公告)日：2018-03-01
申请号：US15497683
申请日：2017-04-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongwook LEE , Sangwon KIM , Minsu SEOL , Seongjun JEONG , Seunggeol NAM , Seongjun PARK , Hyeonjin SHIN
IPC: H01L23/373 , H01L21/48 , H01L23/31
CPC classification number: H01L23/3733 , B82Y30/00 , C08K3/042 , H01L21/4871 , H01L23/3171 , H01L23/373 , H01L23/3737 , H01L23/3738 , H01L23/42
Abstract: Disclosed are heat dissipation structures using nano-sized graphene fragments such as graphene quantum dots (GQDs) and/or methods of manufacturing the heat dissipation structures. A heat dissipation structure includes a heating element, and a heat dissipation film on the heating element to dissipate heat generated from the heating element, to outside. The heat dissipation film may include GQDs.
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40.发明申请HARDMASK COMPOSITION AND METHOD OF FORMING PATTERN USING THE HARDMASK COMPOSITION 审中-公开HARDMASK组合物和使用HARDMASK组合物形成图案的方法公开(公告)号：US20160291472A1
公开(公告)日：2016-10-06
申请号：US14843003
申请日：2015-09-02
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyeonjin SHIN , Sangwon KIM , Minsu SEOL , Seongjun PARK , Yeonchoo CHO
Abstract: A hardmask composition may include graphene nanoparticles having a size in a range of about 5 nm to about 100 nm and a solvent.
Abstract translation: 硬掩模组合物可以包括尺寸在约5nm至约100nm范围内的石墨烯纳米颗粒和溶剂。
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