公开(公告)号：US20250054866A1

公开(公告)日：2025-02-13

申请号：US18796804

申请日：2024-08-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keun Wook SHIN ,  Sangwon KIM ,  Chang Seok LEE ,  Joonseok KIM ,  Joonyun KIM ,  Giyoung JO ,  Luhing HU

IPC: H01L23/532 ,  H01L23/528

Abstract: Disclosed are an interconnect structure including a substrate, a metal layer on the substrate, and a passivation layer including a topological compound and in contact with the metal layer.

公开(公告)号：US20140324271A1

公开(公告)日：2014-10-30

申请号：US14256557

申请日：2014-04-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee Jin OH ,  Kyung Jae KIM ,  Hyun Suk MIN ,  Sung Geun SONG ,  Chang Seok LEE ,  Ho Yeon LEE

IPC: G05D1/02

CPC classification number: G05D1/0246 ,  A47L2201/04 ,  G05B15/00 ,  G05B2219/45098 ,  G05D1/0251 ,  G05D1/0274 ,  G05D2201/0203 ,  G05D2201/0207 ,  H04L12/2803

Abstract: A cleaning robot is provided. The cleaning robot includes a main body, a moving assembly to move the main body around a home, an imaging unit to obtain images around the main body, a controller to generate a map of the home using the obtained images, and a communication unit to transmit the generated map to a home monitoring apparatus. A procedure to match location and type information of electric devices to a two-Dimensional (2D) or three-Dimensional (3D) map of the home may be automated. As described above, the map of the home may be realistically generated by utilizing a map generated by the cleaning robot and inconvenience experienced by a user to manually register electric devices located in each room of the home may be solved by automatically registering the electric devices.

Abstract translation: 提供清洁机器人。 清洁机器人包括主体，使主体围绕家庭移动的移动组件，用于获得主体周围的图像的成像单元，使用所获得的图像生成家庭地图的控制器，以及通信单元， 将生成的地图发送到家庭监视设备。 将电气设备的位置和类型信息与家庭的二维（2D）或三维（3D）地图匹配的过程可以是自动的。 如上所述，可以通过利用由清洁机器人生成的地图来实际生成家庭地图，并且可以通过自动登记电气设备来解决用户手动登记位于家庭每个房间中的电气设备所经历的不便。

公开(公告)号：US20250105154A1

公开(公告)日：2025-03-27

申请号：US18900133

申请日：2024-09-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Giyoung JO ,  Sangwon KIM ,  Jaewon KIM ,  Hyeon Jin SHIN ,  Van Luan NGUYEN ,  Chang Seok LEE

IPC: H01L23/532 ,  H01L21/768

Abstract: Disclosed is an interconnect structure including a substrate, a conductive layer on the substrate, and a passivation layer in contact with the conductive layer, where the passivation layer includes a first layer including boron nitride (h-BN) having a hexagonal crystal structure and a second layer including amorphous boron nitride (a-BN), and the first layer is in contact with the conductive layer the first layer.

公开(公告)号：US20250098390A1

公开(公告)日：2025-03-20

申请号：US18653130

申请日：2024-05-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonseok KIM ,  Joonyun KIM ,  Huije RYU ,  Chang Seok LEE ,  Luhing HU

IPC: H01L27/15 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H01L33/62

Abstract: A panel includes: a substrate, unit pixels arranged repeatedly on the substrate, and unit pixel circuits including a unit pixel circuit repeatedly arranged on the substrate and electrically connected to a unit pixel. Each unit pixel includes a red sub-pixel including a red optoelectronic element configured to display red color or detect red light, a green sub-pixel including a green optoelectronic element configured to display green color or detect green light, and a blue sub-pixel including a blue optoelectronic element configured to display blue color or detect blue light. Each unit pixel circuit includes a red pixel circuit electrically connected to the red optoelectronic element, a green pixel circuit electrically connected to the green optoelectronic element, and a blue pixel circuit electrically connected to the blue optoelectronic element. The red pixel circuit, the green pixel circuit, and the blue pixel circuit are stacked along a thickness direction of the substrate.

公开(公告)号：US20250167043A1

公开(公告)日：2025-05-22

申请号：US18948843

申请日：2024-11-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keun Wook SHIN ,  Sangwon KIM ,  Joonseok KIM ,  Joonyun KIM ,  Daejin YANG ,  Chang Seok LEE ,  Tae Won JEONG ,  GIYOUNG JO ,  LUHING HU

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532

Abstract: An interconnect structure including a dielectric layer having a trench structure; a conductive wiring including a metal compound represented by Chemical Formula 1 disposed within the trench structure (conductive interconnect), and air gap disposed between the conductive wiring. The trench structure has a line width of less than or equal to about 10 nm and an aspect ratio of greater than or equal to about 3. MXa  Chemical Formula 1 In Chemical Formula 1, M is at least one metal of Zr, Nb, Cu, Ru, Al, Co, W, Mo, Ti, Ta, Ni, Pt, Cr, Rh, Ir, Pd, or Os, X is at least one element of C, N, P, As, S, Se, or Te, and a is a number determined by the stoichiometry of M and X.