INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

Invention Application

US20250054866A1 INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

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Patent Title: INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
Application No.: US18796804

Application Date: 2024-08-07
Publication No.: US20250054866A1

Publication Date: 2025-02-13
Inventor: Keun Wook SHIN , Sangwon KIM , Chang Seok LEE , Joonseok KIM , Joonyun KIM , Giyoung JO , Luhing HU
Applicant: Samsung Electronics Co., Ltd.
Applicant Address: KR Suwon-si
Assignee: Samsung Electronics Co., Ltd.
Current Assignee: Samsung Electronics Co., Ltd.
Current Assignee Address: KR Suwon-si
Priority: KR10-2023-0103154 20230807
Main IPC: H01L23/532
IPC: H01L23/532 ; H01L23/528

INTERCONNECT STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME

Abstract:

Disclosed are an interconnect structure including a substrate, a metal layer on the substrate, and a passivation layer including a topological compound and in contact with the metal layer.

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/52	.用于在处于工作中的器件内部从一个组件向另一个组件通电的装置
H01L23/522	..包含制作在半导体本体上的多层导电的和绝缘的结构的外引互连装置的
H01L23/532	...按材料特点进行区分的