公开(公告)号：US06591493B1

公开(公告)日：2003-07-15

申请号：US09706900

申请日：2000-11-06

申请人： Yoshihiro Yoshida ,  Osamu Okuda ,  Akira Kabeshita ,  Naoyuki Kitamura

发明人： Yoshihiro Yoshida ,  Osamu Okuda ,  Akira Kabeshita ,  Naoyuki Kitamura

IPC分类号： H05K330

CPC分类号： H05K13/0409 ,  Y10T29/4913 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A method of preventing a nozzle or nozzles from dropping in a component mounting apparatus include gripping the nozzle structures with pivotal levers that are biased to a closed position. The pivotal levers are released after activation of the nozzles to permit appropriate movement for picking up, inspecting, orientating and locating electronic components on a substrate with the nozzles. During the operation of the mounting head, the levers are maintained in a release position against a biasing force and at the end of the operation, the biasing force can then cause the levers to close and support the nozzles in a gripping manner.

摘要翻译： 防止喷嘴或喷嘴掉落在部件安装装置中的方法包括用偏置到关闭位置的枢转杆夹紧喷嘴结构。 在激活喷嘴之后释放枢转杆以允许用喷嘴拾取，检查，定向和定位基板上的电子部件的适当移动。 在安装头的操作期间，杠杆被保持在抵抗偏压力的释放位置，并且在操作结束时，偏压力可以使杠杆闭合并以夹持方式支撑喷嘴。

公开(公告)号：US06527905B1

公开(公告)日：2003-03-04

申请号：US09703924

申请日：2000-11-02

申请人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

发明人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

IPC分类号： B32B3500

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/11005 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01082 ,  H05K13/0465 ,  H05K13/0469 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/17 ,  Y10T156/1798 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of mounting an electronic component at a specified position of an object. The method includes applying a sealant beforehand in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then, without obstructing successive bonding of electrodes of the electronic component and the object, the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component because of the air bubbles can be reduced. Only a short period of time is required to apply the sealant even though it is applied twice, so that production time is shortened and production efficiency is improved.

摘要翻译： 一种将电子部件安装在物体的指定位置的方法。 该方法包括在第一施加过程中预先施加密封剂。 密封剂通过在布置位置避免电极，并且紧密接触布置的电子部件和物体，在第一施加过程中快速，充分且强制地施加。 然后，在不妨碍电子部件和物体的电极的连续接合的情况下，以通常的方式进行电极的接合。 通过以与常规方法相同的方式将密封剂施加到电子部件的周边来进行第二施加过程，该方法足以使密封剂流动到先前施加在电子部件下方的密封剂。 可以相应地进行第二次应用程序的充分进行。 气泡不会被夹在电子部件和物体之间，结果是由于气泡而导致的电子部件的破损或腐蚀导致的安装故障可以减少。 即使施加两次，也只需要很短的时间来施加密封剂，从而缩短生产时间并提高生产效率。

公开(公告)号：US06298547B1

公开(公告)日：2001-10-09

申请号：US09158536

申请日：1998-09-22

申请人： Osamu Okuda ,  Yoshihiro Yoshida ,  Akira Kabeshita ,  Satoshi Shida ,  Naoyuki Kitamura

发明人： Osamu Okuda ,  Yoshihiro Yoshida ,  Akira Kabeshita ,  Satoshi Shida ,  Naoyuki Kitamura

IPC分类号： H05K1304

CPC分类号： H05K13/0409 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53178 ,  Y10T29/53191

摘要： An electronic component mounting method which employs a first air feed device connected to an air passage at one end part of a spline shaft, and a second air feed device connected to the air passage in the vicinity of the other end of the spline shaft. The first and second air feeds function to supply air to the air passage to return an interior thereof to atmospheric pressure. The time required to return the vacuum pressure in the air passage to atmospheric pressure can be shortened by the use of the two separate air feeds.

摘要翻译： 一种电子部件安装方法，其采用与花键轴的一端部的空气通路连接的第一供气装置，以及与所述花键轴的另一端附近的所述空气通路连接的第二供气装置。 第一和第二空气进料用于向空气通道供应空气以将其内部返回到大气压力。 通过使用两个单独的空气进料，可以缩短将空气通道中的真空压力恢复到大气压所需的时间。

公开(公告)号：US06283323B1

公开(公告)日：2001-09-04

申请号：US09469539

申请日：1999-12-22

申请人： Tadashi Endo ,  Takao Kashiwazaki ,  Shuichi Kubota ,  Koji Okawa ,  Masato Tanino ,  Akira Kabeshita

发明人： Tadashi Endo ,  Takao Kashiwazaki ,  Shuichi Kubota ,  Koji Okawa ,  Masato Tanino ,  Akira Kabeshita

IPC分类号： B65H528

CPC分类号： B65H75/22 ,  B65H2701/1942 ,  H05K13/0417

摘要： A receiving reel 10 comprises a receiving ratchet 11 and a detachable receiving cap 12 that is set in the receiving ratchet 11 and on which a covering tape 1c is wound, and is provided with contact members 13 and 14 that are provided on the area of engagement of the receiving cap 12 and the receiving ratchet 11. The contact members make contact in the direction of rotation and prevent the receiving cap 12 from coming loose. Mutually contacting concave and convex members 15 and 16 are provided on the contact surfaces along the direction of rotation of the contact members 13 and 14 to make it simple to detach the receiving cap 12 and to prevent it from coming loose and falling off.

摘要翻译： 接收卷轴10包括接收棘轮11和设置在接收棘轮11中并且其上缠绕有覆盖带1c的可拆卸接收帽12，并且设置有接合部件13和14，接触部件13和14设置在接合区域 接触帽12和接收棘轮11.接触构件在旋转方向上接触，并防止接收帽12松动。 沿着接触构件13和14的旋转方向在接触表面上设置相互接触的凹形和凸形构件15和16，使得容易拆卸接收盖12并防止其松动脱落。

公开(公告)号：US06206066B1

公开(公告)日：2001-03-27

申请号：US09091104

申请日：1998-06-12

申请人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

发明人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

IPC分类号： B32B3500

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/11005 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01082 ,  H05K13/0465 ,  H05K13/0469 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/17 ,  Y10T156/1798 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of and apparatus for mounting an electronic component at a specified position of an object. The method includes applying a sealant in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component can be reduced. Only a short period of time is required to apply the sealant even though it is applied twice, so that production time is shortened and production efficiency is improved.

摘要翻译： 一种用于将电子部件安装在物体的指定位置的方法和装置。 该方法包括在第一施加过程中施加密封剂。 密封剂通过在布置位置避免电极，并且紧密接触布置的电子部件和物体，在第一施加过程中快速，充分且强制地施加。 然后以通常的方式进行电极的接合。 通过以与常规方法相同的方式将密封剂施加到电子部件的周边来进行第二施加过程，该方法足以使密封剂流动到先前施加在电子部件下方的密封剂。 可以相应地进行第二次应用程序的充分进行。 气泡不会被夹在电子部件和物体之间，结果是由于电子部件的断裂或腐蚀导致的安装故障可以减少。 即使施加两次，也只需要很短的时间来施加密封剂，从而缩短生产时间并提高生产效率。

公开(公告)号：US5012388A

公开(公告)日：1991-04-30

申请号：US425840

申请日：1989-10-20

申请人： Akira Kabeshita ,  Tokuhito Hamane ,  Yoshifumi Kitayama

发明人： Akira Kabeshita ,  Tokuhito Hamane ,  Yoshifumi Kitayama

IPC分类号： H01G4/12 ,  H01C1/012 ,  H01C7/00 ,  H01C17/00 ,  H01G2/06 ,  H01G4/252 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC分类号： H01G2/065 ,  H01C17/006 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10636 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613

摘要： A chip type electronic component includes a main body having opposite first and second end surfaces and a lower surface defining a first plane. First and second electrode portions are respectively connected to the first and second end surfaces of the main body. Each of the first and second electrode portions includes a lower surface. Each lower surface of the first and second electrode portions includes a first planar face extending adjacent the main body in a second plane which is parallel to the first plane defined by the main body, and a second planar face extending adjacent the first planar face in a third plane which extends upwardly at an angle relative the second plane away from the main body. Accordingly, upon mounting of the chip type electronic component to a planar circuit board, a space is provided between the second planar face of each of the first and second electrode portions for accommodating solder materials.

摘要翻译： 芯片型电子部件包括具有相对的第一和第二端面的主体和限定第一平面的下表面。 第一电极部分和第二电极部分分别连接到主体的第一和第二端面。 第一电极部分和第二电极部分中的每一个包括下表面。 第一电极部分和第二电极部分的每个下表面包括在平行于由主体限定的第一平面的第二平面中相对于主体延伸的第一平面和与第一平面相邻延伸的第二平面， 第三平面，其以相对于第二平面离开主体的一角度向上延伸。 因此，在芯片型电子部件安装在平面电路基板上时，在第一和第二电极部分的第二平面之间设置有容纳焊料的空间。

公开(公告)号：US4720914A

公开(公告)日：1988-01-26

申请号：US841865

申请日：1986-03-10

申请人： Yukio Maeda ,  Shinichi Kudou ,  Akira Kabeshita

发明人： Yukio Maeda ,  Shinichi Kudou ,  Akira Kabeshita

IPC分类号： H05K3/12 ,  H05K3/20

CPC分类号： H05K3/1241 ,  H05K2203/0126 ,  Y10T29/49155

摘要： The present invention relates to method and apparatus for forming a thick film circuit by discharging a thick film paste from a paste discharging hole of a drawing nozzle and drawing a desired pattern on a substrate. The paste discharging hole has a substantially wide configuration and the drawing nozzle is rotated about its axis of rotation so that the longitudinal direction of the elongated cross-section of the paste discharging hole is substantially normal to the direction in which the drawing nozzle is moved with respect to the substrate.

摘要翻译： PCT No.PCT / JP84 / 00380 Sec。 371日期：1986年3月10日 102（e）1986年3月10日PCT PCT。1984年7月26日PCT公布。 出版物WO86 / 日本特愿1986年2月13日。本发明涉及通过从拉丝喷嘴的浆料排出孔排出厚膜浆料并在基材上拉伸所需图案来形成厚膜回路的方法和装置。 糊剂排出孔具有基本上宽的构造，并且拉伸喷嘴绕其旋转轴线旋转，使得糊料排出孔的细长横截面的纵向方向基本上垂直于拉伸喷嘴移动的方向 相对于底物。

公开(公告)号：US4370804A

公开(公告)日：1983-02-01

申请号：US183839

申请日：1980-09-03

申请人： Yoshihiko Misawa ,  Akira Kabeshita ,  Kazuhiro Mori ,  Hiroshi Nakagawa ,  Shigeru Araki, deceased

发明人： Yoshihiko Misawa ,  Akira Kabeshita ,  Kazuhiro Mori ,  Hiroshi Nakagawa ,  Shigeru Araki, deceased

IPC分类号： B23P19/04 ,  B23P21/00 ,  H05K13/04 ,  B23P23/00

CPC分类号： H05K13/0495 ,  B23P19/04 ,  H05K13/0417 ,  Y10T29/53183

摘要： An apparatus for automatically mounting electronic components on printed circuit boards has an insertion head which is adapted to rotate on an engaging shaft within a rotary bearing and be guided in the extent of rotation by means of a steel ball. Only the engaging shaft rotates and the position from which the components are supplied to the insertion head is stationary, the space needed for the inserting apparatus can be kept small. The bearing can be changed or the position of the bearing changed to change the insertion angle of the component relative to the printed circuit board, thus making possible various arrangements of the components on the circuit board.

摘要翻译： 用于将电子部件自动安装在印刷电路板上的装置具有插入头，其适于在旋转轴承内的接合轴上旋转，并且通过钢球在旋转的程度中被引导。 只有接合轴旋转并且将部件供应到插入头的位置是静止的，所以插入装置所需的空间可以保持较小。 可以改变轴承或改变轴承的位置以改变部件相对于印刷电路板的插入角度，从而使电路板上部件的各种布置成为可能。

公开(公告)号：US08528196B2

公开(公告)日：2013-09-10

申请号：US13143587

申请日：2010-01-08

申请人： Kazuaki Kosaka ,  Akira Kabeshita ,  Nobuhiko Muraoka ,  Syozo Kadota

发明人： Kazuaki Kosaka ,  Akira Kabeshita ,  Nobuhiko Muraoka ,  Syozo Kadota

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H05K13/0452

摘要： A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

摘要翻译： 一种用于将元件安装在沿着基板边缘部分的方向的第一方向上放置在基板的边缘部分上的多个安装区域上的部件安装装置，包括用于保持放置在部件传送位置的部件的部件放置单元， 在与第一方向正交的第二方向上与基板的边缘部分间隔开，沿着第二方向移动被保持的部件，并将部件放置在安装区域上，用于将部件顺序地供给到间隔开的部件供给位置的部件供给单元 以及用于保持馈送到部件供给位置的部件的元件传送单元，移动保持的部件，以及将部件放置在部件传送位置。 因此，能够以良好的工作效率将部件均匀地配置在大的基板上。

公开(公告)号：US20110289772A1

公开(公告)日：2011-12-01

申请号：US13143587

申请日：2010-01-08

申请人： Kazuaki Kosaka ,  Akira Kabeshita ,  Nobuhiko Muraoka ,  Syozo Kadota

发明人： Kazuaki Kosaka ,  Akira Kabeshita ,  Nobuhiko Muraoka ,  Syozo Kadota

IPC分类号： H05K13/04

CPC分类号： H05K13/0452

摘要： A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

摘要翻译： 一种用于将元件安装在沿着基板边缘部分的方向的第一方向上放置在基板的边缘部分上的多个安装区域上的部件安装装置，包括用于保持放置在部件传送位置的部件的部件放置单元， 在与第一方向正交的第二方向上与基板的边缘部分间隔开，沿着第二方向移动被保持的部件，并将部件放置在安装区域上，用于将部件顺序地供给到间隔开的部件供给位置的部件供给单元 以及用于保持馈送到部件供给位置的部件的元件传送单元，移动保持的部件，以及将部件放置在部件传送位置。 因此，能够以良好的工作效率将部件均匀地配置在大的基板上。