Abstract:
A manufacturing method of a display substrate, a display substrate, and a display device. The manufacturing method includes: forming an active layer; forming a gate insulation film layer, a gate film layer and a photoresist film layer; exposing the photoresist film layer to a light and developing the exposed photoresist film layer until the developed photoresist film layer has a thickness of 1.8-2.2 μm and a slope angle not less than 70°; over-etching the gate film layer to form a gate electrode, an orthographic projection of the gate electrode being located within a region of an orthographic projection of the developed photoresist film layer; over-etching the gate insulation film layer by a gaseous corrosion method to form a gate insulation layer; peeling off the photoresist film layer remaining on a surface of the gate electrode; and performing a conductive treatment to the active layer.
Abstract:
The present disclosure relates to the display technology, and provides an OLED display substrate, a method for manufacturing the OLED display substrate and a display device. The method includes: forming pixel definition layer transition patterns with metal; and oxidizing the pixel definition layer transition patterns to form an insulative pixel definition layer.
Abstract:
There are provided a thin-film transistor and a production method thereof, an array substrate, and a display panel. The method comprises forming an active layer, a gate insulating layer, and a gate electrode on a substrate, wherein conductor conversion treatment is performed on both sides of the homogeneous active material layer to obtain an active layer, and the active layer comprises conductor regions located at both sides and a non-conductor region located at the center, wherein a projection of the gate electrode on the substrate is within a projection of the non-conductor region on the substrate, and the distances from the projection of the gate electrode to projections of the two conductor regions on the substrate are each between 0 micrometer and 1 micrometer.
Abstract:
Provided is a thin film transistor, including: a conductive light shielding layer; a metal oxide layer arranged on the light shielding layer; a buffer layer, an active layer, a gate insulating layer, a gate electrode, and an interlayer insulating layer arranged in sequence on the metal oxide layer, the interlayer insulating layer and the buffer layer comprising a first via hole and a second via hole for exposing the active layer, and a third via hole for exposing the metal oxide layer, in which a portion of the metal oxide layer exposed through the third via hole is a conductive portion, and other portions are insulative; and a source electrode and a drain electrode arranged on the interlayer insulating layer, in which the source electrode is connected to the active layer through the first via hole, and the drain electrode is connected to the active layer through the second via hole and connected to the conductive portion through the third via hole.
Abstract:
The present invention relates to a technical field of display, and discloses a substrate carrying apparatus. The apparatus comprises: a vertical bearing plate and an upper holding base; one side surface of the vertical bearing plate is a bearing surface, the upper holding base is provided at the upside of the bearing surface; the upper holding base is provided with a plurality of holder for holding the substrate; the left and right sides of the bearing surface are provided with a plurality of positioning clips for positioning the substrate from the left and right ends of the substrate. The substrate carrying apparatus of the present invention provides a holder on the upper holding base, and during loading of the substrate, after the substrate is transported in place by a manipulator, the substrate is held and hanged by the holder, and the substrate would not undergo a falling process, reducing the risk of substrate damage. The present invention further provides a sputtering device comprising one or more of the substrate carrying apparatuses.
Abstract:
The present invention relates to a technical field of display, and discloses a substrate carrying apparatus. The apparatus comprises: a vertical bearing plate and an upper holding base; one side surface of the vertical bearing plate is a bearing surface, the upper holding base is provided at the upside of the bearing surface; the upper holding base is provided with a plurality of holder for holding the substrate; the left and right sides of the bearing surface are provided with a plurality of positioning clips for positioning the substrate from the left and right ends of the substrate. The substrate carrying apparatus of the present invention provides a holder on the upper holding base, and during loading of the substrate, after the substrate is transported in place by a manipulator, the substrate is held and hanged by the holder, and the substrate would not undergo a falling process, reducing the risk of substrate damage. The present invention further provides a sputtering device comprising one or more of the substrate carrying apparatuses.
Abstract:
Provided are a manufacturing method of a display substrate, a display substrate, and a display device. The display substrate includes: a base substrate; and a top-gate type thin film transistor located on a side of the base substrate, the top-gate type thin film transistor comprises an active layer, a gate insulation layer and a gate electrode sequentially disposed in a direction away from the base substrate. A side surface of the gate insulation layer close to the gate electrode extends beyond an edge of the gate electrode in a direction parallel to the base substrate, and a side surface of the active layer close to the gate insulation layer extends beyond an edge of the gate insulation layer in the direction parallel to the base substrate.
Abstract:
The present disclosure provides a display substrate, a method for manufacturing the display substrate, and a display device. The display substrate includes a first conductive line extending in a first direction on a base substrate, a second conductive line extending in a second direction crossing the first direction on the base substrate, and an insulation layer arranged between the first conductive line and the second conductive line. The display substrate further includes a buffer layer arranged between the first conductive line and the base substrate, a groove extending in the first direction is formed in the buffer layer, the first conductive line is arranged in the groove, and a surface of the first conductive line away from the base substrate is flush with a surface of the buffer layer away from the base substrate.
Abstract:
A display substrate, a method for forming the display substrate and a display device are provided. The display substrate includes: a first conductive pattern located on a base substrate, where a ring-shaped conductive protection structure is arranged at an edge of a preset region of the first conductive pattern and surrounds the preset region, and the conductive protection structure is made of an anti-dry-etching material; an insulation layer covering the first conductive pattern; and a second conductive pattern located on a side of the insulation layer away from the first conductive pattern, where the second conductive pattern is electrically connected to the first conductive pattern through the via-hole.
Abstract:
Disclosed are a photoresist composition, a pixel definition structure and a manufacturing method thereof, and a display panel. The photoresist composition includes an organic film-forming resin, a superhydrophobic polymerizable monomer, a polyfunctional crosslinkable polymerizable monomer, a photoinitiator, an additive and a solvent.