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    EARPHONE HAVING AN ACOUSTIC TUNING MECHANISM
    33.
    发明申请
    EARPHONE HAVING AN ACOUSTIC TUNING MECHANISM 审中-公开
    具有呼吸调谐机制的耳机

    公开(公告)号：US20170070808A1

    公开(公告)日：2017-03-09

    申请号：US15339589

    申请日：2016-10-31

    Applicant: Apple Inc.

    Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase

    IPC: H04R1/28 ,  H04R1/10 ,  H04R1/02

    CPC classification number: H04R1/2823 ,  H04R1/023 ,  H04R1/10 ,  H04R1/1016 ,  H04R1/20 ,  H04R1/2807 ,  H04R1/2811

    Abstract: An earphone comprising an earphone housing having a body portion, the body portion having an acoustic output opening to output sound from a driver positioned therein into an ear of a user. An acoustic tuning member is positioned within the body portion. The acoustic tuning member defines a back volume chamber of the driver and includes an acoustic output port for outputting sound from the back volume chamber of the driver to improve an acoustic performance of the earphone.

    Abstract translation: 一种耳机，包括具有主体部分的耳机壳体，所述主体部分具有声输出开口，以将来自位于其中的驾驶员的声音输出到用户的耳朵中。 声学调谐构件定位在主体部分内。 声学调谐构件限定了驾驶员的后部体积腔室，并且包括用于从驾驶员的后部体积腔室输出声音以改善耳机的声学性能的声学输出端口。

    Earphone having a controlled acoustic leak port
    35.
    发明授权
    Earphone having a controlled acoustic leak port 有权
    耳机具有受控的声音泄漏口

    公开(公告)号：US09210496B2

    公开(公告)日：2015-12-08

    申请号：US14626806

    申请日：2015-02-19

    Applicant: Apple Inc.

    Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase ,  Andrew P. Bright ,  Christopher R. Wilk

    IPC: H04R25/00 ,  H04R1/10 ,  H04R1/28 ,  H04R1/02

    CPC classification number: H04R1/2849 ,  H04R1/02 ,  H04R1/023 ,  H04R1/1016 ,  H04R1/1058 ,  H04R1/1075 ,  H04R1/2826 ,  H04R1/2846

    Abstract: An earphone comprising an earphone housing having a wall comprising (1) a front side that joins (2) an end portion in which a primary sound output opening is formed, which joins (3) a face portion in which a secondary output opening is formed, which joins (4) a back side which joins the front side and encloses a driver, wherein the face portion and the front side form a tapered portion of the earphone housing that is dimensioned to be inserted into, and contact, an ear of a wearer, wherein the primary output opening is dimensioned to output sound generated by a diaphragm of the driver contained within the earphone housing into the ear, the secondary output opening is dimensioned to vent the ear to a surrounding environment, and wherein the primary output opening and the secondary output opening face different directions and are positioned over a sound output face of the driver.

    Abstract translation: 一种耳机，包括具有壁的耳机壳体，所述耳机壳体包括：（1）连接（2）形成有主要声音输出开口的端部的前侧，其连接（3）形成有二次输出开口的面部 ，其连接（4）连接前侧并包围驱动器的后侧，其中所述面部部分和所述前侧形成所述耳机壳体的锥形部分，所述锥形部分的尺寸被设计成插入到所述耳机的耳朵中并接触 佩戴者，其中所述主输出开口的尺寸被设计为将包含在所述耳机壳体内的所述驾驶员的振膜产生的声音输出到所述耳朵中，所述次级输出开口的尺寸被设计成将耳朵排出到周围环境，并且其中所述主输出开口和 次级输出开口面向不同的方向并位于驾驶员的声音输出面上方。

    Earphone having an acoustic tuning mechanism
    36.
    发明授权
    Earphone having an acoustic tuning mechanism 有权
    具有声调谐机构的耳机

    公开(公告)号：US09161118B2

    公开(公告)日：2015-10-13

    申请号：US14581913

    申请日：2014-12-23

    Applicant: Apple Inc.

    Inventor： Michael B. Howes ,  Yacine Azmi ,  Scott P. Porter ,  Jonathan S. Aase

    IPC: H04R25/00 ,  H04R1/20 ,  H04R1/10 ,  H04R1/28

    CPC classification number: H04R1/2823 ,  H04R1/023 ,  H04R1/10 ,  H04R1/1016 ,  H04R1/20 ,  H04R1/2807 ,  H04R1/2811

    Abstract: An earphone comprising an earphone housing having a body portion, the body portion having an acoustic output opening to output sound from a driver positioned therein into an ear of a user. An acoustic tuning member is positioned within the body portion. The acoustic tuning member defines a back volume chamber of the driver and includes an acoustic output port for outputting sound from the back volume chamber of the driver to improve an acoustic performance of the earphone.

    Abstract translation: 一种耳机，包括具有主体部分的耳机壳体，所述主体部分具有声输出开口，以将来自位于其中的驾驶员的声音输出到用户的耳朵中。 声学调谐构件定位在主体部分内。 声学调谐构件限定了驾驶员的后部体积腔室，并且包括用于从驾驶员的后部体积腔室输出声音以改善耳机的声学性能的声学输出端口。

    SEAMLESS EARBUD STRUCTURES AND METHODS FOR MAKING THE SAME
    37.
    发明申请
    SEAMLESS EARBUD STRUCTURES AND METHODS FOR MAKING THE SAME 审中-公开
    无缝耳机结构及其制造方法

    公开(公告)号：US20150163582A1

    公开(公告)日：2015-06-11

    申请号：US14626727

    申请日：2015-02-19

    Applicant: Apple Inc.

    Inventor： Jonathan S. Aase

    IPC: H04R1/10

    CPC classification number: H04R1/1016 ,  H04R1/1058 ,  H04R1/1066 ,  H04R1/1075 ,  H04R2201/105 ,  H04R2460/09 ,  H04R2460/11 ,  Y10T29/49176

    Abstract: Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.

    Abstract translation: 公开了无缝耳塞结构及其制造方法。 无缝耳塞结构可以使用嵌入式成型施工方法来构造，该方法在两个配合在一起的子壳体上包覆模塑化妆品材料。 两个子外壳形成可以包括驱动器组件（例如低音扬声器和高音单元），导体束并提供一个或多个声学体积的壳体。 壳体具有非阻塞构件和颈部构件，并且具有无缝或几乎无缝结构。 化妆品材料被嵌入模制在壳体周围以提供围绕壳体的周边布置的平滑且无缝的表面。

    MOLDED CABLE STRUCTURES AND SYSTEMS AND METHODS FOR MAKING THE SAME
    39.
    发明申请
    MOLDED CABLE STRUCTURES AND SYSTEMS AND METHODS FOR MAKING THE SAME 审中-公开
    模制电缆结构和系统及其制造方法

    公开(公告)号：US20140110882A1

    公开(公告)日：2014-04-24

    申请号：US14059238

    申请日：2013-10-21

    Applicant: Apple Inc.

    Inventor： Jonathan S. Aase ,  Cameron P. Frazier ,  John E. Thomas

    IPC: B29C45/14

    CPC classification number: H02G15/18 ,  B29C33/10 ,  B29C39/42 ,  B29C43/18 ,  B29C43/203 ,  B29C43/36 ,  B29C45/14073 ,  B29C2043/3605 ,  B29C2043/3621 ,  B29C2043/3665 ,  B29C2045/1409 ,  B29C2045/14131 ,  B29K2105/256 ,  B29K2705/00 ,  B29L2031/3462

    Abstract: A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. A movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. Gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.

    Abstract translation: 耳机可以包括连接诸如插孔和耳机之类的非电缆组件的电缆结构。 电缆结构可以使用成型工艺构造。 可以使用不同的方法来确保在模制过程中延伸穿过电缆结构的导体束在电缆结构内保持居中。 可移动管可以放置在模具中，使得导体束保持在管内。 当材料被注入到模具中并到达管时，管可以移动并逐渐从模具中移除。 或者，可移动管可以构造成使得管可以与注入的材料组合以形成电缆结构的外壳。 可以定位和控制在模具中提供材料的浇口，以便于在保持导体束的中心位置的同时在模具中注入材料。

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