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公开(公告)号：US10976562B2
公开(公告)日：2021-04-13
申请号：US16138092
申请日：2018-09-21
Applicant: KLA-Tencor Corporation
Inventor： Dmitry Gorelik , Andrew V. Hill , Ohad Bachar , Amnon Manassen , Daria Negri
Abstract: A beamsplitter includes a substrate formed from a material transparent to wavelengths of light at least above a selected cutoff wavelength and reflective structures distributed across a surface of the substrate. The reflective structures split incident light having wavelengths above the selected cutoff wavelength into a reflected beam formed from portions of the incident light reflected from the reflective structures and a transmitted beam formed from portions of the incident light transmitted through the substrate. A splitting ratio of a power of the reflected beam to a power of the transmitted beam is based on a ratio of surface area of the reflective surfaces to an area of the incident light on the substrate. Separation distances between neighboring reflective structures are smaller than the cutoff wavelength such that diffracted power of the incident light having wavelengths above the selected cutoff wavelength is maintained below a selected tolerance.
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32.发明授权公开(公告)号：US10964013B2
公开(公告)日：2021-03-30
申请号：US15863753
申请日：2018-01-05
Applicant: KLA-Tencor Corporation
Inventor： Martin Plihal , Ankit Jain
Abstract: A system, method, and non-transitory computer readable medium are provided for training and applying defect classifiers in wafers having deeply stacked layers. In use, a plurality of images generated by an inspection system for a location of a defect detected on a wafer by the inspection system are acquired. The location on the wafer is comprised of a plurality of stacked layers, and each image of the plurality of images is generated by the inspection system at the location using a different focus setting. Further, a classification of the defect is determined, utilizing the plurality of images.
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33.发明申请公开(公告)号：US20210088768A1
公开(公告)日：2021-03-25
申请号：US17109528
申请日：2020-12-02
Applicant: KLA-Tencor Corporation
Inventor： James Jianguo Xu , Ken Kinsun Lee , Rusmin Kudinar , Ronny Soetarman , Hung Phi Nguyen , Zhen Hou
Abstract: A three-dimensional (3D) microscope includes various insertable components that facilitate multiple imaging and measurement capabilities. These capabilities include Nomarski imaging, polarized light imaging, quantitative differential interference contrast (q-DIC) imaging, motorized polarized light imaging, phase-shifting interferometry (PSI), and vertical-scanning interferometry (VSI).
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公开(公告)号：US10930597B2
公开(公告)日：2021-02-23
申请号：US16439465
申请日：2019-06-12
Applicant: KLA-TENCOR CORPORATION
Inventor： Alex Teng Song Lim , Ganesh Meenakshisundaram
IPC: G06K9/00 , H01L23/544 , H01L21/67 , G06T7/00 , G01N21/95
Abstract: Embodiments herein include methods, systems, and apparatuses for die screening using inline defect information. Such embodiments may include receiving a plurality of defects, receiving wafersort electrical data for a plurality of dies, classifying each of the defects as a defect-of-interest or nuisance, determining a defect-of-interest confidence for each of the defects-of-interest, determining a die return index for each of the dies containing at least one of the defects-of-interest, determining a die return index cutline, and generating an inking map. Each of the defects may be associated with a die in the plurality of dies. Each of the dies may be tagged as passing a wafersort electrical test or failing the wafersort electrical test. Classifying each of the defects as a defect-of-interest or nuisance may be accomplished using a defect classification model, which may include machine learning. The inking map may be electronically communicated to an inking system.
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公开(公告)号：US10923526B2
公开(公告)日：2021-02-16
申请号：US16355265
申请日：2019-03-15
Applicant: KLA-Tencor Corporation
Inventor： Tzi-Cheng Lai , Jehn-Huar Chem , Stephen Biellak
IPC: H01L27/148 , H01L27/146 , H04B3/32 , H04N5/357 , G06F1/10 , H03L7/081 , H04N5/376
Abstract: First and second images of a semiconductor die or portion thereof are generated. Generating each image includes performing a respective instance of time-domain integration (TDI) along a plurality of pixel columns in an imaging sensor, while illuminating the imaging sensor with light scattered from the semiconductor die or portion thereof. The plurality of pixel columns comprises pairs of pixel columns in which the pixel columns are separated by respective channel stops. While performing a first instance of TDI to generate the first image, a first bias is applied to electrically conductive contacts of the channel stops. While performing a second instance of TDI to generate the second image, a second bias is applied to the electrically conductive contacts of the channel stops. Defects in the semiconductor die or portion thereof are identified using the first and second images.
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Patent Agency Ranking
公开(公告)号：US10921488B2
公开(公告)日：2021-02-16
申请号：US16005333
申请日：2018-06-11
Applicant: KLA-Tencor Corporation
Inventor： Ivan Maleev , Donald Pettibone
Abstract: A polarization control device includes a first wave plate having a first surface profile and a second wave plate having a second surface profile complementary to the first surface profile. The optical axis of the first wave plate is orthogonal to the optical axis of the second wave plate. The first wave plate and the second wave plate are positioned to align the first surface profile with the second surface profile and maintain a constant thickness across the polarization control device. The first wave plate and the second wave plate may control polarization rotation as a continuous function of transverse position across a pupil plane of an optical system. The first wave plate and the second wave plate are separated by a sufficiently small distance so as to limit wave front distortion below a selected level.
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公开(公告)号：US10903258B2
公开(公告)日：2021-01-26
申请号：US16153495
申请日：2018-10-05
Applicant: KLA-Tencor Corporation
Inventor： Tzi-Cheng Lai , Jehn-Huar Chern , Stephen Biellak
IPC: H01L27/146 , H01L27/148
Abstract: A back-illuminated image sensor includes a first pixel, a second pixel, and a channel stop situated between the first pixel and the second pixel to isolate the first pixel from the second pixel. The channel stop includes a LOCOS structure and a region of doped silicon beneath the LOCOS structure. The back-illuminated image sensor also includes a first electrically conductive contact that extends through the LOCOS structure and forms an ohmic contact with the region of doped silicon. The first electrically conductive contact may be grounded, negatively biased, or positively biased, depending on the application.
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公开(公告)号：US10902579B1
公开(公告)日：2021-01-26
申请号：US16188674
申请日：2018-11-13
Applicant: KLA-Tencor Corporation
Inventor： Erfan Soltanmohammadi , Martin Plihal , Tai-Kam Ng , Sang Hyun Lee
Abstract: Defects of interest can be captured by a classifier. Images of a semiconductor wafer can be received at a deep learning classification module. These images can be sorted into soft decisions with the deep learning classification module. A class of the defect of interest for an image can be determined from the soft decisions. The deep learning classification module can be in electronic communication with an optical inspection system or other types of semiconductor inspection systems.
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公开(公告)号：US10901325B2
公开(公告)日：2021-01-26
申请号：US15763662
申请日：2018-02-27
Applicant: KLA-TENCOR CORPORATION
Inventor： Evgeni Gurevich , Michael E. Adel , Roel Gronheid , Yoel Feler , Vladimir Levinski , Dana Klein , Sharon Aharon
Abstract: Methods are provided for designing metrology targets and estimating the uncertainty error of metrology metric values with respect to stochastic noise such as line properties (e.g., line edge roughness, LER). Minimal required dimensions of target elements may be derived from analysis of the line properties and uncertainty error of metrology measurements, by either CDSEM (critical dimension scanning electron microscopy) or optical systems, with corresponding targets. The importance of this analysis is emphasized in view of the finding that stochastic noise may have increased importance with when using more localized models such as CPE (correctables per exposure). The uncertainty error estimation may be used for target design, enhancement of overlay estimation and evaluation of measurement reliability in multiple contexts.
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公开(公告)号：US10900843B2
公开(公告)日：2021-01-26
申请号：US16037445
申请日：2018-07-17
Applicant: KLA-Tencor Corporation
Inventor： Earl Jensen
Abstract: A sensor for detecting a temperature distribution imparted on a substrate in an environment is disclosed. The sensor includes a sensor substrate with one or more temperature sensing elements formed on the sensor substrate. In embodiments, a temperature sensing element includes at least one cavity with a thermally expandable material disposed within the cavity and a channel extending from the cavity with a slug disposed within the channel. In embodiments, the cavity has a fixed volume and is enclosed by a cover layer disposed or formed over the cavity. The thermally expandable material is configured to extend from the cavity into the channel to actuate the slug from a first position within the channel to at least a second position within the channel, where the position of the slug is indicative of a temperature of a respective portion of the sensor substrate.
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