公开(公告)号：US10902579B1

公开(公告)日：2021-01-26

申请号：US16188674

申请日：2018-11-13

Applicant: KLA-Tencor Corporation

Inventor： Erfan Soltanmohammadi ,  Martin Plihal ,  Tai-Kam Ng ,  Sang Hyun Lee

IPC: G06T7/00 ,  G06N3/08 ,  G06N3/04 ,  G06K9/62

Abstract: Defects of interest can be captured by a classifier. Images of a semiconductor wafer can be received at a deep learning classification module. These images can be sorted into soft decisions with the deep learning classification module. A class of the defect of interest for an image can be determined from the soft decisions. The deep learning classification module can be in electronic communication with an optical inspection system or other types of semiconductor inspection systems.