公开(公告)号：US11453823B2

公开(公告)日：2022-09-27

申请号：US16487104

申请日：2018-02-20

Applicant: InkTec Co., Ltd.

Inventor： Kwang-Choon Chung ,  Byung Woong Moon ,  Su Han Kim ,  Jae Rin Kim

IPC: C09K13/00 ,  C23F1/00 ,  C25D3/38 ,  C25D5/02 ,  H05K1/09 ,  H05K3/06 ,  H05K3/42 ,  H05K3/46 ,  C25D5/10

Abstract: The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.

公开(公告)号：US11160171B2

公开(公告)日：2021-10-26

申请号：US16485174

申请日：2018-02-14

Applicant: InkTec Co., Ltd.

Inventor： Kwang-Choon Chung ,  Su Han Kim ,  Jung Yoon Moon ,  Hyeon-Jun Seong ,  Byung Woong Moon

IPC: H05K3/06 ,  C09K13/06 ,  C23F1/30

Abstract: The present invention relates to an etching solution composition for selectively etching only silver, a silver alloy, or a silver compound, and to a circuit forming method using the composition. The circuit forming method according to the present invention is characterized in that, in a substrate material in which an electrically conductive seed layer and a circuit layer are formed of heterogeneous metals, only the seed layer is selectively etched to enable the implementation of fine pitches. In addition, the present invention relates to a circuit forming method and an etching solution composition, wherein only a seed layer of silver (Ag), a silver alloy, or a silver compound is selectively etched without etching a copper (Cu) plated circuit.

公开(公告)号：US10696858B2

公开(公告)日：2020-06-30

申请号：US16064167

申请日：2016-12-21

Applicant: POSCO ,  INKTEC CO., LTD.

Inventor： Ha-Na Choi ,  Kyung-Pyo Yu ,  Jin-Tae Kim ,  Chan-Hee Park ,  Jung-Hwan Lee ,  Yon-Kyun Song

IPC: C09D11/38 ,  C09D4/00 ,  C09D7/40 ,  C08F220/20 ,  C08F220/30 ,  C09D7/63 ,  C09D11/101 ,  C09D11/102

Abstract: An ink composition for a printed steel sheet, having excellent adhesion to a steel sheet, processability, solvent resistance, and the like, a method for manufacturing a printed steel sheet using the same, and a printed steel sheet manufactured thereby, are provided. The ink composition for a steel material includes 10 to 30 parts by weight of a mixture of a urethane acrylate oligomer and another type of acrylate oligomer different from the urethane acrylate oligomer, 65 to 80 parts by weight of a radiation curable monomer which is a mixture of a monofunctional radiation curable monomer and a di- or more functional radiation curable monomer, 1 to 10 parts by weight of a photoinitiator, and 0.01 to 10 parts by weight of an adhesion promoter.

公开(公告)号：US20200053881A1

公开(公告)日：2020-02-13

申请号：US16487104

申请日：2018-02-20

Applicant: InkTec Co., Ltd.

Inventor： Kwang-Choon CHUNG ,  Byung Woong MOON ,  Su Han KIM ,  Jae Rin KIM

IPC: H05K3/06 ,  H05K3/42 ,  H05K3/46 ,  H05K1/09 ,  C23F1/00 ,  C25D3/38 ,  C25D5/02 ,  C09K13/00

Abstract: The disclosure relates to a method for manufacturing a transfer film including an electrode layer, the method comprising: an electrode layer formation step of forming an electrode layer on a carrier member by using a conductive material; a placement step of placing the carrier member on at least one side of an insulating resin layer respectively; a bonding step of bonding the carrier member and the insulating resin layer together by applying pressure thereto; and a transfer step of removing the carrier member to transfer the electrode layer on the insulating resin layer.

公开(公告)号：US20190008033A1

公开(公告)日：2019-01-03

申请号：US16025641

申请日：2018-07-02

Applicant: INKTEC CO., LTD.

Inventor： KWANG-CHOON CHUNG ,  BYUNG WOONG MOON

IPC: H05K1/02 ,  H05K1/11 ,  H01B7/08 ,  H05K3/42

CPC classification number: H05K1/0219 ,  H01B7/08 ,  H01R12/79 ,  H05K1/028 ,  H05K1/115 ,  H05K1/118 ,  H05K3/422 ,  H05K3/425 ,  H05K9/0098 ,  H05K2201/0154 ,  H05K2201/0715 ,  H05K2201/093 ,  H05K2201/09609 ,  H05K2201/09681 ,  H05K2203/072

Abstract: The present disclosure relates a printed circuit board having an EMI shielding function. In an example embodiment, the printed circuit board includes a substrate, a signal unit disposed on the substrate, a ground unit disposed in parallel with the signal unit, an insulation layer disposed above the substrate and covering the signal unit and the ground unit, an EMI shielding layer disposed on the insulation layer and under the substrate, respectively, and a shielding bridge passing through the substrate and the insulation layer at opposite sides of the signal unit and electrically connecting the EMI shielding layer disposed on the insulation layer to the EMI shielding layer disposed under the substrate.

公开(公告)号：US09831487B2

公开(公告)日：2017-11-28

申请号：US14891504

申请日：2014-05-16

Applicant: INKTEC Co., Ltd.

Inventor： Kwang-Choon Chung ,  In-Sook Yi ,  Ji Hoon Yoo ,  Joonki Seong ,  Dae Sang Han

IPC: B05D5/12 ,  H01M4/04 ,  H01L31/18 ,  H01L31/0224

CPC classification number: H01M4/0414 ,  H01L31/022466 ,  H01L31/1884 ,  Y02E10/50

Abstract: Provided herein is a method for forming a transparent electrode film, the method comprising forming an electrode pattern by printing an electrode pattern on a release film using a metal ink composition; forming an insulating layer by applying a curable resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; removing the release film; and forming a conductive layer by applying a conductive material on the electrode pattern from which the release film has been removed.

公开(公告)号：US09671542B2

公开(公告)日：2017-06-06

申请号：US14895500

申请日：2014-06-03

Applicant: InkTec Co., Ltd.

Inventor： Kwang-Choon Chung ,  Insook Yi ,  MinHee Kim ,  Ji Hoon Yoo

IPC: G02B5/30 ,  G02B1/08

CPC classification number: G02B5/3058 ,  G02B1/08 ,  G02B5/3033 ,  G02B5/3041

Abstract: Provided herein is a method for producing a nano polaroid film using a one-pack type or two-pack type blackening ink so that a single layer film may replace a conventional polaroid film generally produced by superposing various types of optical films, and especially, a method for producing a nano polaroid film consisting of one film and having excellent observability by coating a transparent nano pattern substrate with a functional ink that contains a blackening material, and then removing particles formed on protruding portions using an etching solution, and refilling the functional ink into grooves.

公开(公告)号：US09524046B2

公开(公告)日：2016-12-20

申请号：US14891448

申请日：2014-05-16

Applicant: INKTEC CO., LTD.

Inventor： Kwang-Choon Chung ,  In-Sook Yi ,  Ji Hoon Yoo ,  Joonki Seong ,  Dae sang Han

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103

Abstract: Provided herein is a method for producing a hybrid transparent electrode, the method including filling grooves of a substrate with a conductive metal ink composition; filling the grooves with residue conductive metal ink composition that remains on a surface of the substrate as the grooves are being filled with the conductive metal ink composition to form an electrode pattern; and forming a conductive layer including a conductive material on the electrode pattern.

Abstract translation: 本发明提供一种混合透明电极的制造方法，该方法包括用导电金属油墨组合物填充基材的槽; 在凹槽被导电金属油墨组合物填充以形成电极图案时，用剩余的导电金属油墨组合物填充残留的导电金属油墨组合物; 以及在所述电极图案上形成包括导电材料的导电层。

公开(公告)号：US20160181592A1

公开(公告)日：2016-06-23

申请号：US14891504

申请日：2014-05-16

Applicant: INKTEC CO., LTD.

Inventor： Kwang-Choon Chung ,  In-Sook Yi ,  Ji Hoon Yoo ,  Joonki Seong ,  Dae Sang Han

IPC: H01M4/04

CPC classification number: H01M4/0414 ,  H01L31/022466 ,  H01L31/1884 ,  Y02E10/50

Abstract: Provided herein is a method for forming a transparent electrode film, the method comprising forming an electrode pattern by printing an electrode pattern on a release film using a metal ink composition; forming an insulating layer by applying a curable resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; removing the release film; and forming a conductive layer by applying a conductive material on the electrode pattern from which the release film has been removed.

Abstract translation: 本发明提供一种形成透明电极膜的方法，该方法包括通过使用金属油墨组合物在剥离膜上印刷电极图案形成电极图案; 通过在其上形成有电极图案的剥离膜上施加可固化树脂来形成绝缘层; 通过在绝缘层上层叠衬底来形成衬底层; 去除脱模膜; 以及通过在去除了剥离膜的电极图案上施加导电材料来形成导电层。

公开(公告)号：US08828352B2

公开(公告)日：2014-09-09

申请号：US13755101

申请日：2013-01-31

Applicant: Inktec Co., Ltd.

Inventor： Kwang Choon Chung ,  Hyun Nam Cho ,  Ji Hoon Yoo ,  Kee In Son

IPC: C07F1/00 ,  B82Y30/00 ,  C01G5/00

CPC classification number: C01G5/00 ,  B82Y30/00 ,  C01P2004/03 ,  C01P2004/62 ,  C01P2004/64

Abstract: A process for preparation of silver oxide with various shape and size using a silver complex compound having a special structure, includes 1) step of preparing a precursor solution including a silver complex compound obtained by reacting a silver compound with one or more mixture selected from the group consisting of an ammonium carbamate-based compound, an ammonium carbonate-based compound or an ammonium bicarbonate-based compound in the presence of a solvent; and 2) step of preparing silver oxide by reacting the precursor solution including the silver complex compound of step 1) with an oxidant. The shape and particle size of the silver oxide prepared according to the preparation process can be changed.

Abstract translation: 使用具有特殊结构的银络合物制备具有各种形状和大小的氧化银的方法包括：1）制备包含银络合物的前体溶液的步骤，所述前体溶液是通过使银化合物与一种或多种选自 在溶剂存在下由氨基甲酸铵类化合物，碳酸铵类化合物或碳酸氢铵类化合物组成的组; 和2）通过使包含步骤1）的络合物的前体溶液与氧化剂反应来制备氧化银的步骤。 根据制备方法制备的氧化银的形状和粒径可以改变。