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公开(公告)号：US20240065103A1
公开(公告)日：2024-02-22
申请号：US18271617
申请日：2021-12-15
发明人： Ryota OISHI , Koji KADONO , Shinji IMAIZUMI
IPC分类号： H10N10/17 , H10N10/01 , H10N10/855
CPC分类号： H10N10/17 , H10N10/01 , H10N10/855
摘要： A thermoelectric conversion element 10 includes: a substrate 11; a first electrode 12 on a high temperature side which is disposed on a front surface of the substrate 11; a second electrode 13 on a low temperature side which is disposed on a front surface of the substrate 11; a thermal conductor 14 which connects the first electrode 12 and the second electrode 13 to each other and contains a nanostructure; and an absorption film 15 which is formed on a front surface of the first electrode 12 and absorbs incident light. The thermal conductor 14 is provided at a position separated from the substrate 11. In the thermoelectric conversion element 10, the absorption film 15 may be an infrared absorption film, and the incident light may have a wavelength in a range of 4 μm to 12 μm.
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公开(公告)号：US20240040929A1
公开(公告)日：2024-02-01
申请号：US18028016
申请日：2021-07-20
申请人： LG INNOTEK CO., LTD.
发明人： Man Hue CHOI , Jong Min LEE , Se Woon LEE , Yong Sang CHO
IPC分类号： H10N10/17
CPC分类号： H10N10/17
摘要： A thermoelectric device according to an embodiment of the present invention comprises: a first substrate; an insulating layer disposed on the first substrate; a first electrode unit disposed on the insulating layer; a first terminal electrode and a second terminal electrode disposed on the insulating layer and protruding from the first electrode unit toward the first outer side of the first substrate; a semiconductor structure disposed on the first electrode unit; a second electrode unit disposed on the semiconductor structure; and a second substrate unit disposed on the second electrode unit. The second substrate unit comprises a plurality of second substrates disposed away from one another. The first electrode unit comprises: a plurality of electrode groups respectively overlapping the plurality of second substrates vertically; and a first connection electrode connecting two different electrode groups among the plurality of electrode groups. The long side of the first connection electrode is longer than the long side of the first electrode included in the plurality of electrode groups. At least a part of the first connection electrode does not overlap the plurality of second substrates vertically.
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公开(公告)号：US11857004B2
公开(公告)日：2024-01-02
申请号：US17344184
申请日：2021-06-10
发明人： Charles J. Cauchy
IPC分类号： F25B21/00 , A41D13/005 , B60N2/56 , F25B21/04 , A47C7/74 , H10N10/13 , H10N10/10 , H10N10/17
CPC分类号： A41D13/005 , A47C7/744 , B60N2/5635 , B60N2/5678 , F25B21/04 , H10N10/13 , H10N10/10 , H10N10/17
摘要： A heating and cooling device is disclosed comprising at least one integral low voltage heating and cooling source and an efficient flexible heat distribution means having a thermal conductivity of from 375 to 4000 W/mK for distributing the heat and cool across a surface. Further aspects include thermal interface compounds to provide full thermal contact as well as the use of a phase change material to provide a long lasting heating and/or cooling effect without the use of external electrical input. Preferred applications include automotive and furniture seating heating and cooling, along with outdoor garments having distributed heating and cooling effects.
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公开(公告)号：US11856855B2
公开(公告)日：2023-12-26
申请号：US16997953
申请日：2020-08-20
发明人： In-Shiang Chiu , Kuang-Chu Chen , Peng-Chan Hsiao , Han-Ying Liu
摘要： Provided are a thermal sensor and a manufacturing method thereof. The thermal sensor includes a transistor and a thermal sensing device. The thermal sensing device is disposed in a recess in a substrate and electrically connected to the transistor. The thermal sensing device includes a first dielectric layer, a metal silicide reflective layer, a second dielectric layer, and a thermal absorbing layer. The first dielectric layer is disposed on sidewalls and a bottom of the recess. The metal silicide reflective layer is disposed on the first dielectric layer located on the bottom of the recess. The second dielectric layer is disposed at a top of the recess. The thermal absorbing layer is disposed on the second dielectric layer.
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公开(公告)号：US11844278B2
公开(公告)日：2023-12-12
申请号：US17424574
申请日：2020-01-23
申请人： LG INNOTEK CO., LTD.
发明人： Seung Hwan Lee , Se Woon Lee , In Seok Kang , Sung Chul Kim
IPC分类号： H10N10/817 , H10N10/17 , H10N10/854 , H10N10/856
CPC分类号： H10N10/817 , H10N10/17 , H10N10/854 , H10N10/856
摘要： A thermoelectric element of the present invention comprises a first metal substrate, a first resin layer, a plurality of first electrodes, a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs, a plurality of second electrodes, a second resin layer, and a second metal substrate, wherein the first metal substrate is a low-temperature portion, the second metal substrate is a high-temperature portion, the second resin layer comprises a first layer and a second layer arranged on the first layer, the first and second layers include a silicon (Si)-based resin, and the bonding strength of the first resin layer is higher than the bonding strength of the second resin layer.
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公开(公告)号：US11839157B2
公开(公告)日：2023-12-05
申请号：US17341344
申请日：2021-06-07
发明人： Seung Hwan Ko , Jin Woo Lee , Hea Youn Sul
摘要： Disclosed is a stretchable and flexible thermoelectric module including: a thermoelectric material; a pair of elastic composites having stretchability and flexibility; and a first electrode and a second electrode, which are deformable and electrically connected to both sides of the thermoelectric material, respectively, and whose one surfaces face each other. Thus, since the thermoelectric module has excellent stretchability, flexibility and thermal conductivity, the thermoelectric module is suitably applied to a wearable device that exhibits excellent efficiency during cooling or heating and is in contact with a human body.
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公开(公告)号：US11837524B2
公开(公告)日：2023-12-05
申请号：US17352612
申请日：2021-06-21
申请人： Raytheon Company
摘要： A cooling device for integrated circuits. The device includes: a plurality TEC cooling cells arranged in an array, wherein each of the cells includes a controller coupled to at least one TEC device; and a single power connector that provides power to all the cells in the array. The controller of each cell in the array is operable to control the at least one TEC it is coupled to with power received from the single power connector.
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公开(公告)号：US11830787B2
公开(公告)日：2023-11-28
申请号：US16532956
申请日：2019-08-06
申请人： Intel Corporation
IPC分类号： H01L23/38 , H01L25/18 , H01L23/00 , H03H9/205 , H01L23/14 , H01L23/538 , H01L23/66 , H01L23/31 , H01L23/427 , H03H9/05 , H03H9/02 , H01L23/498 , H10N10/17 , H10N30/88 , H10N39/00 , H01L23/552
CPC分类号： H01L23/38 , H01L23/145 , H01L23/3128 , H01L23/427 , H01L23/49816 , H01L23/5384 , H01L23/5386 , H01L23/66 , H01L24/16 , H01L25/18 , H03H9/02102 , H03H9/0514 , H03H9/205 , H10N10/17 , H10N30/883 , H10N39/00 , H01L23/552 , H01L24/32 , H01L24/33 , H01L24/73 , H01L2223/6644 , H01L2224/16227 , H01L2224/32225 , H01L2224/33181 , H01L2224/73204 , H01L2224/73253 , H01L2924/3025 , H01L2924/30111
摘要： Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.
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公开(公告)号：US11815444B2
公开(公告)日：2023-11-14
申请号：US17501661
申请日：2021-10-14
摘要： A method and a system for monitoring a mechanical device for internal corrosion are provided. An exemplary method includes placing a sampling thermoelectric polymer sheet (TEPS) on an external surface of the mechanical device to be monitored for internal corrosion, and placing a reference TEPS on an external surface of the mechanical device not susceptible to internal corrosion. A current from the sampling TEPS is measured, and a current from the reference TEPS is measured. Potential internal corrosion is identified from changes between the current from the sampling TEPS and the current from the reference TEPS.
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公开(公告)号：US20230329113A1
公开(公告)日：2023-10-12
申请号：US18144406
申请日：2023-05-08
申请人： LG INNOTEK CO., LTD.
发明人： Un Hak LEE , Jong Hyun KANG
IPC分类号： H10N10/17 , H10N10/13 , H10N10/852
CPC分类号： H10N10/13 , H10N10/17 , H10N10/852
摘要： A heat conversion device may comprise: a frame, and a first cooling water inflow tube and a first cooling water discharge tube; and multiple second cooling water discharge tubes connected to the first cooling water discharge tube and arranged on the other side of the multiple unit modules along the second direction. Each unit module comprises a cooling water passage chamber, a first thermoelectric module, and a second thermoelectric module. A cooling water inflow port is formed on a third surface between the first and second surfaces of the cooling water passage chamber. A cooling water discharge port is formed on a fourth surface between the first and second surface of the cooling water passage chamber. The cooling water inflow port is connected to the second cooling water inflow tubes, and the cooling water discharge port is connected to the second cooling water discharge tubes.
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