公开(公告)号：US20200011612A1

公开(公告)日：2020-01-09

申请号：US16547950

申请日：2019-08-22

申请人： Westinghouse Electric Company LLC

发明人： Cory A. Stansbury ,  Edward C. Renaud

IPC分类号： F28D20/00 ,  F28F21/06 ,  F28F21/04

摘要： An energy storage device includes a plurality of plates, each having a first and second surface, with at least one of the surfaces having a plurality of grooves formed therein. The device further includes inlet and outlet plenums for providing or receiving a heat transfer medium to or from the grooves. At least one of the first surface and the second surface having the plurality of grooves formed therein of a first plate is disposed in direct contact with the other one of the at least first surface and second surface of an adjacent second plate. Heat from the transfer medium is transferred to the plates in a charging mode of operation or transferred from the plates to the transfer medium in a discharging mode of operation when the heat transfer medium is passed along the grooves.

公开(公告)号：US20190271510A1

公开(公告)日：2019-09-05

申请号：US16403598

申请日：2019-05-05

申请人： ASIA VITAL COMPONENTS CO., LTD.

发明人： Hsiu-Wei Yang

IPC分类号： F28D15/02 ,  F28F21/04 ,  F28F21/08

摘要： A vapor chamber structure includes a main body formed of a metal plate and a ceramic plate. The metal plate and the ceramic plate are closed to each other to define a chamber therebetween; and the chamber is internally provided with a wick structure, a support structure, and a working fluid. The metal plate and the ceramic plate are connected to each other via welding or a direct bonding copper process, and the support structure is connected to between the metal plate and the ceramic plate also via welding or the direct bonding copper process. By contacting the ceramic plate of the vapor chamber with a heat source packaged in a ceramic material to transfer heat, the problem of crack at an interface between the vapor chamber and the heat source due to thermal fatigue can be overcome. A manufacturing method of the above-described vapor chamber is also disclosed.

公开(公告)号：US10401099B2

公开(公告)日：2019-09-03

申请号：US15285867

申请日：2016-10-05

申请人： Raytheon Company

发明人： Christopher R. Koontz ,  David Filgas

IPC分类号： F28F21/00 ,  F28F21/02 ,  F28F21/04 ,  F28F21/08 ,  F28F3/02 ,  H01S3/04 ,  G02B7/18 ,  H01S5/024 ,  G02B7/00 ,  H01S3/23

摘要： In one aspect, a transparent heat exchanger includes a first transparent substrate optically attached to a heat source, one or more fins to transfer heat from the heat source, the one or more fins comprising transparent material and further comprising one of a manifold coupled to the first transparent substrate or a facesheet coupled to the first transparent material.

公开(公告)号：US10234209B2

公开(公告)日：2019-03-19

申请号：US14856640

申请日：2015-09-17

申请人： NGK Insulators, Ltd.

发明人： Masahiro Tokuda ,  Tatsuo Kawaguchi ,  Makoto Miyazaki

IPC分类号： F28D7/00 ,  F28F21/04 ,  F28F7/02 ,  F28D7/10 ,  F28D21/00 ,  F01N3/04 ,  F01N3/10 ,  F01N3/28 ,  F01N3/02 ,  F28F1/06 ,  F28F1/08

摘要： To provide a heat exchanger that can control temperatures of fluids to be heat-exchanged. A heat exchanger 30 includes a honeycomb structure 1, a second fluid flow through portion 26 located at an outer periphery side of the honeycomb structure 1 serving as a flow passage for a second fluid, and a third fluid flow through portion 27 located at an outer periphery side of the second fluid flow through portion 26 serving as a flow passage for a third fluid. Cells 3 of the honeycomb structure 1 serve as a first fluid flow through portion 25 through which the first fluid passes. With the heat exchanger 30, the first fluid, the second fluid, and the third fluid can be heat-exchanged without being mixed with one another. Constituting the fluid flow passage with three flow passages allows controlling temperatures of two fluids to be heat-exchanged by the residual fluid.

公开(公告)号：US10221498B2

公开(公告)日：2019-03-05

申请号：US14823194

申请日：2015-08-11

申请人： LAWRENCE LIVERMORE NATIONAL SECURITY, LLC

发明人： Andrew J. Pascall ,  Hannah Grace Coe ,  Julie A. Jackson ,  Susant K. Patra

IPC分类号： C25D13/02 ,  B33Y10/00 ,  B23P15/26 ,  C25D1/00 ,  C25D13/12 ,  C25D15/00 ,  C25D15/02 ,  F28F21/04 ,  F28F3/12 ,  B33Y80/00 ,  F28F21/02 ,  F28F21/08 ,  F28D21/00

摘要： A method of producing a complex product includes designing a three dimensional preform of the complex product, creating a three dimensional preform of the complex product using the model, depositing a material on the preform, and removing the preform to complete the complex product. In one embodiment the system provides a complex heat sink that can be used in heat dissipation in power electronics, light emitting diodes, and microchips.

公开(公告)号：US10103047B2

公开(公告)日：2018-10-16

申请号：US14389254

申请日：2013-03-28

申请人： KYOCERA Corporation

发明人： Keiichi Sekiguchi ,  Kazuhiko Fujio ,  Yuusaku Ishimine

IPC分类号： F28F7/00 ,  F28F13/00 ,  H01L21/683 ,  F28F21/04 ,  H01L21/67 ,  F28F3/12 ,  F28F13/18 ,  F28D7/04

摘要： A flow path member includes a flow path which has an inlet and an outlet in a base made of ceramics, and a low resistance portion whose surface resistance is less than 1×107 Ω/sq in at least a part of the flow path.

公开(公告)号：US20180290224A1

公开(公告)日：2018-10-11

申请号：US15945519

申请日：2018-04-04

申请人： Mahle International GmbH

发明人： Stefan Schmidgall ,  Matthias Tuerpe

IPC分类号： B23K1/00 ,  B23K35/30 ,  F28F21/08 ,  F28F21/04 ,  F28F13/12 ,  H05K7/20

摘要： A method for producing a cooling device for cooling a power electronics may include an application step, a preparatory step, and a joining step. The application step may include applying a thin copper layer at least area by area onto a joining side of at least one ceramic plate. The preparatory step may include arranging the at least one ceramic plate with the thin copper layer on at least one of a first upper side of a substantially flat aluminum body and a second upper side of the aluminum body disposed opposite the first upper side. The joining step may include forming a substance-to-sub stance bond between the joining side of the at least one ceramic plate and the aluminum body via supplying heat.

公开(公告)号：US20180209749A1

公开(公告)日：2018-07-26

申请号：US15926337

申请日：2018-03-20

申请人： Solid State Cooling Systems

发明人： Lloyd Wright ,  Leo A. Chin

IPC分类号： F28F3/02 ,  F28F21/04 ,  F28F21/06 ,  F28F3/12

CPC分类号： F28F3/02 ,  F28F3/12 ,  F28F21/04 ,  F28F21/065

摘要： The present invention provides a high efficiency thermal transfer plate for providing thermal transfer to and from a fluid. More specifically the present invention provides a thermal transfer plate including a skived fin plate for improved thermal transfer between a fluid within the thermal transfer plate and the thermal transfer plate.

公开(公告)号：US10034364B2

公开(公告)日：2018-07-24

申请号：US15134526

申请日：2016-04-21

申请人： Kitagawa Industries Co., Ltd. ,  TYK Corporation

发明人： Yasuhiro Kawaguchi ,  Masataka Kubo

IPC分类号： H01L23/373 ,  H05K1/02 ,  F28F13/00 ,  F28F21/04

摘要： An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 1010 Ohm·cm or more and a porosity of 15-50 vol %.

公开(公告)号：US20180184544A1

公开(公告)日：2018-06-28

申请号：US15724349

申请日：2017-10-04

申请人： Eaton Corporation

发明人： James Gerard Maloney ,  James Lee Gehlbach

IPC分类号： H05K7/20 ,  H02B1/21 ,  H02B1/06 ,  H02G3/14 ,  F28F21/08 ,  H02B1/056 ,  F28F21/04

CPC分类号： H05K7/2039 ,  F28F21/04 ,  F28F21/084 ,  F28F21/085 ,  H02B1/056 ,  H02B1/06 ,  H02B1/21 ,  H02B1/56 ,  H02G3/14 ,  H05K2201/10272

摘要： Thermally conductive assemblies that provide a heat conduction path include at least one thermally conductive wedge block that can be held in a receptacle with a wall having sufficient flexibility to be able to expand outward in response to an outward force applied by the at least one thermally conductive wedge block. The wedge block can also be electrically resistive.