公开(公告)号：US20040084208A1

公开(公告)日：2004-05-06

申请号：US10283560

申请日：2002-10-30

发明人： Thomas W. Ives ,  Donald J. Fasen ,  Curt N. Van Lydegraf

IPC分类号： H05K007/06

CPC分类号： H05K1/0271 ,  B81B7/0016 ,  H05K3/303 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/10083 ,  H05K2201/2045

摘要： A printed circuit assembly comprises a printed circuit board and a micro-electro-mechanical system on the printed circuit board. At least one motion damping member is positioned between the printed circuit board and the micro-electro-mechanical system.

摘要翻译： 印刷电路组件包括印刷电路板和印刷电路板上的微电子机械系统。 至少一个运动阻尼件位于印刷电路板和微机电系统之间。

公开(公告)号：US20240190698A1

公开(公告)日：2024-06-13

申请号：US18534983

申请日：2023-12-11

申请人： Murata Manufacturing Co., Ltd.

发明人： Matti LIUKKU ,  Pekka LEHTINEN

IPC分类号： B81B3/00 ,  B81B7/00

CPC分类号： B81B3/0051 ,  B81B7/0016 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/056

摘要： A microelectromechanical element is provided that includes a motion-limiting structure that prevents a main rotor body from coming into direct physical contact with a stator across a vertical rotor-stator gap. The motion-limiting structure includes a first stopper bump that is a protrusion on the stator that extends towards the rotor. The motion-limiting structure also includes a second stopper bump that is a protrusion on the rotor that extends from the main rotor body towards the stator.

公开(公告)号：US20240034618A1

公开(公告)日：2024-02-01

申请号：US18487561

申请日：2023-10-16

申请人： STMICROELECTRONICS S.r.l.

发明人： Domenico GIUSTI ,  Fabio QUAGLIA

IPC分类号： B81B7/00 ,  B81C1/00 ,  F16F15/00

CPC分类号： B81B7/0016 ,  B81C1/00825 ,  F16F15/007 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2207/03 ,  B81C2203/032 ,  F16F2226/042

摘要： A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.

公开(公告)号：US11873216B2

公开(公告)日：2024-01-16

申请号：US17421912

申请日：2020-04-09

申请人： Robert Bosch GmbH

发明人： Michael Stumber

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00825 ,  B81B7/0016 ,  B81C2203/032

摘要： A method for producing damper structures on a micromechanical wafer. The method includes: (A) providing an edge adhesive film and a molding wafer, which includes a first side having a molding structure; (B) applying the edge adhesive film to the first side of the molding wafer at a low atmospheric pressure; (C) joining the edge adhesive film to the first side of the molding wafer by increasing the atmospheric pressure; (D) filling the molding structures with an adhesive; (E) curing the adhesive to form damper structures; (F) bonding the damper structures to a second side of a micromechanical wafer.

公开(公告)号：US11807519B2

公开(公告)日：2023-11-07

申请号：US17337296

申请日：2021-06-02

申请人： STMICROELECTRONICS S.r.l.

发明人： Domenico Giusti ,  Fabio Quaglia

IPC分类号： B81B7/00 ,  B81C1/00 ,  F16F15/00

CPC分类号： B81B7/0016 ,  B81C1/00825 ,  F16F15/007 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2207/03 ,  B81C2203/032 ,  F16F2226/042

摘要： A microelectromechanical membrane transducer includes: a supporting structure; a cavity formed in the supporting structure; a membrane coupled to the supporting structure so as to cover the cavity on one side; a cantilever damper, which is fixed to the supporting structure around the perimeter of the membrane and extends towards the inside of the membrane at a distance from the membrane; and a damper piezoelectric actuator set on the cantilever damper and configured so as to bend the cantilever damper towards the membrane in response to an electrical actuation signal.

公开(公告)号：US20230303389A1

公开(公告)日：2023-09-28

申请号：US17702599

申请日：2022-03-23

申请人： Exo Imaging, Inc.

发明人： Liang WANG ,  David KREVOR ,  Naresh MANTRAVADI ,  Brian BIRCUMSHAW ,  Jason TAUSCHER

IPC分类号： B81C1/00 ,  B81B7/00

CPC分类号： B81C1/00825 ,  B81B7/0016 ,  B81B2201/0271 ,  B81B2207/012 ,  B81C2203/0792

摘要： Described herein are methods and systems useful in the fabrication of ultrasound transducer devices. Fabrication of ultrasound transducer devices can comprise manipulation of components having extremely small cross-sectional thicknesses, which can increase the risk of damage to the components. For example, inadvertent application of forces sufficient to damage such components is a significant risk during fabrication steps. As described herein, the risk of damage to an ultrasound transducer device component having a small cross-sectional thickness, such as an ultrasound microelectromechanical system (MEMS) wafer, can be reduced by partially or completely coating or filling all or a portion of the component with a stabilizing material, for example, prior to subjecting the component to forces associated with manipulation of the component during the fabrication process.

公开(公告)号：US11757378B1

公开(公告)日：2023-09-12

申请号：US17833827

申请日：2022-06-06

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Shih-Yu Liao ,  Tsai-Hao Hung

IPC分类号： H02N1/00 ,  B81B7/00 ,  B81B5/00 ,  H04N23/68

CPC分类号： H02N1/006 ,  B81B7/0016 ,  B81B2203/0136 ,  H04N23/687

摘要： A micromechanical arm array is provided. The micromechanical arm array comprises: a plurality of micromechanical arms spaced from each other in a first horizontal direction and extending in a second horizontal direction, wherein each micromechanical arm comprises a protrusion at a top of each micromechanical arm and protruding upwardly in a vertical direction; a plurality of protection films, each protection film encapsulating one of the plurality of micromechanical arms; and a metal connection structure extending in the first horizontal direction. The metal connection structure comprises: a plurality of joint portions, each joint portion corresponding to and surrounding the protrusion of one of the plurality of micromechanical arms; and a plurality of connection portions extending in the first horizontal direction and connecting two neighboring joint portions.

公开(公告)号：US11703330B2

公开(公告)日：2023-07-18

申请号：US16836387

申请日：2020-03-31

申请人： The Regents of the University of California

发明人： Andrei M. Shkel ,  Mohammad H. Asadian Ardakani ,  Yusheng Wang

IPC分类号： G01C19/5719 ,  B81C1/00 ,  H03H3/007 ,  H03H9/10 ,  B81B3/00 ,  G01C19/5691 ,  B81B7/00

CPC分类号： G01C19/5719 ,  B81C1/00182 ,  H03H3/0072 ,  H03H9/1057 ,  B81B3/0051 ,  B81B7/0016 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2203/0127 ,  B81B2203/0172 ,  B81C1/00158 ,  G01C19/5691

摘要： A dual-shell architecture and methods of fabrication of fused quartz resonators is disclosed. The architecture may include two encapsulated and concentric cavities using plasma-activated wafer bonding followed by the high-temperature glassblowing. The dual-shell architecture can provide a protective shield as well as a “fixed-fixed” anchor for the sensing element of the resonators. Structures can be instrumented to operate as a resonator, a gyroscope, or other vibratory sensor and for precision operation in a harsh environment. Methods for fabricating a dual-shell resonator structure can include pre-etching cavities on a cap wafer, pre-etching cavities on a device wafer, bonding the device wafer to a substrate wafer to form a substrate pair and aligning and bonding the cap wafer to the substrate pair to form a wafer stack with aligned cavities including a cap cavity and a device cavity. The wafer stack may be glassblown to form a dual-shell structure.

公开(公告)号：US20180266862A1

公开(公告)日：2018-09-20

申请号：US15979301

申请日：2018-05-14

申请人： Hitachi Automotive Systems, Ltd.

发明人： Ryosuke DOI ,  Hiroshi NAKANO ,  Keiji HANZAWA

IPC分类号： G01F1/692 ,  B81C1/00 ,  B81B7/00

CPC分类号： G01F1/692 ,  B81B7/0016 ,  B81C1/00825 ,  G01F1/684 ,  G01F1/6842 ,  G01F1/6845 ,  G01P5/12 ,  H01L21/565 ,  H01L28/20 ,  H01L2224/05553 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10158 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A thermal airflow sensor includes a semiconductor device, a protective film a bonding wire, and a resin. The resin covers over a part of the semiconductor device so that the bonding wire is covered with the resin and the region including a thin-wall portion is exposed. The protective film is not covered with the resin and has an outer peripheral edge located outside the thin-wall portion.

公开(公告)号：US20180231090A1

公开(公告)日：2018-08-16

申请号：US15466774

申请日：2017-03-22

申请人： Honeywell International Inc.

发明人： Markus Hans Gnerlich ,  Burgess R. Johnson ,  Kevin V. Christ

IPC分类号： F16F7/10 ,  G01C19/5726

CPC分类号： F16F7/1005 ,  B81B7/0016 ,  B81B2201/0242 ,  F16F7/104 ,  G01C19/5726 ,  G01C19/5733 ,  G01C19/574 ,  G01P15/097

摘要： Systems and methods for a tuned mass damper in mems resonators are provided. In certain implementations, a system for suppressing undesirable vibration modes comprises a micro-electrical mechanical system (MEMS) resonator, the MEMS resonator comprising two or more proof masses, comprising; and a plurality of anchors, wherein proof masses in the two or more proof masses are connected to the plurality of anchors through a plurality of flexures. The system also further comprises a substrate, wherein the MEMS resonator is mounted to the substrate through the plurality of anchors; and one or more tuned mass dampers configured to counter-act the undesirable vibration modes in the substrate and the MEMS resonator.