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公开(公告)号:US2296990A
公开(公告)日:1942-09-29
申请号:US31146839
申请日:1939-12-29
申请人: FOWLER BERT F
发明人: FOWLER BERT F
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公开(公告)号:US1288908A
公开(公告)日:1918-12-24
申请号:US16384617
申请日:1917-04-23
申请人: PB YATES MACHINE CO
发明人: JOHNSON GUSTAVE T
CPC分类号: B24B21/08
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公开(公告)号:US981159A
公开(公告)日:1911-01-10
申请号:US1910541678
申请日:1910-02-03
申请人: BEIN EMILE J
发明人: BEIN EMILE J
CPC分类号: B24B21/08
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公开(公告)号:US953031A
公开(公告)日:1910-03-29
申请号:US1907376591
申请日:1907-05-31
申请人: ATHA TOOL COMPANY
发明人: HAUSMAN JOHN , BLEVNEY JOHN C
CPC分类号: B24B21/08
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公开(公告)号:US910634A
公开(公告)日:1909-01-26
申请号:US1908439281
申请日:1908-06-19
申请人: ALLEN OSCAR
发明人: ALLEN OSCAR
CPC分类号: B24B21/08
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公开(公告)号:US20190232455A1
公开(公告)日:2019-08-01
申请号:US16322469
申请日:2017-08-02
发明人: Thomas BETTERMANN
摘要: The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic or such like. The present invention further relates to a sanding method and to a sanding machine comprising: a carrier element (11), a plurality of pressure segments (12a, 12b, 12c) which can be actuated, in particular electromagnetically actuated, and which are disposed along the carrier element (11) and are each designed to press a sanding element, especially a sanding belt (21), against a workpiece (1), and at least one sensor (13a, 13b, 13c) for sensing a compressive force applied to a workpiece by one of the pressure segments.
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公开(公告)号:US20170216989A1
公开(公告)日:2017-08-03
申请号:US15485446
申请日:2017-04-12
申请人: EBARA CORPORATION
发明人: Kazuaki MAEDA , Tamami TAKAHASHI , Masaya SEKI , Hiroaki KUSA
CPC分类号: B24B21/002 , B24B9/065 , B24B21/004 , B24B21/06 , B24B21/08 , B24B37/04 , B24B41/06
摘要: A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.
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公开(公告)号:US09321141B2
公开(公告)日:2016-04-26
申请号:US14292194
申请日:2014-05-30
摘要: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.
摘要翻译: 本发明涉及一种用于将预定印模打磨成工件的装置。 该装置具有定位在由砂带形成的区域内的图案带。 衬垫位于由图案带形成的区域内。 在图案带的外表面上形成凸起图案。 在使用中,垫接触图案带,促使图案带的凸起图案接触砂带。 由图案带接触的砂带的部分被推向工件,使得预定的印模被砂磨入工件。
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公开(公告)号:US20160052107A1
公开(公告)日:2016-02-25
申请号:US14823967
申请日:2015-08-11
申请人: EBARA CORPORATION
发明人: Yu ISHII , Hiroyuki KAWASAKI , Masayuki NAKANISHI , Kenya ITO , Kenji KODERA , Michiyoshi YAMASHITA
IPC分类号: B24D11/00
CPC分类号: B24D11/001 , B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/08 , B24B21/18 , B24B27/0076 , B24B49/12 , H01L21/304 , H01L21/3105
摘要: There is disclosed a method of polishing a peripheral portion of a wafer having a hard film with use of an abrasive film while preventing damage to the abrasive film. The polishing method uses an abrasive film including a base film made of polyimide, a binder made of polyimide, and abrasive grains held by the binder. The polishing method includes: rotating a silicon substrate having a surface on which a silicon carbide film is formed; and removing the silicon carbide film from a peripheral portion of the silicon substrate by pressing the abrasive film at a low force against the silicon carbide film on the peripheral portion of the silicon substrate.
摘要翻译: 公开了一种利用磨料膜研磨具有硬质膜的晶片的周边部分的方法,同时防止对研磨膜的损伤。 抛光方法使用包括由聚酰亚胺制成的基膜,由聚酰亚胺制成的粘合剂和由粘合剂保持的磨粒的研磨膜。 抛光方法包括:旋转具有形成有碳化硅膜的表面的硅衬底; 并且通过以低的力将研磨膜压在硅衬底的周边部分上的碳化硅膜上,从硅衬底的周边部分去除碳化硅膜。
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