MACHINING DEVICE AND MACHINING METHOD
    27.
    发明申请

    公开(公告)号:US20190232455A1

    公开(公告)日:2019-08-01

    申请号:US16322469

    申请日:2017-08-02

    发明人: Thomas BETTERMANN

    IPC分类号: B24B21/08 B24B49/16

    CPC分类号: B24B21/08 B24B49/16

    摘要: The present invention relates to a device for sanding surfaces of a workpiece, preferably at least portions of which are made of wood, a manufactured wood product, plastic or such like. The present invention further relates to a sanding method and to a sanding machine comprising: a carrier element (11), a plurality of pressure segments (12a, 12b, 12c) which can be actuated, in particular electromagnetically actuated, and which are disposed along the carrier element (11) and are each designed to press a sanding element, especially a sanding belt (21), against a workpiece (1), and at least one sensor (13a, 13b, 13c) for sensing a compressive force applied to a workpiece by one of the pressure segments.

    Pattern sander device, system and method
    29.
    发明授权
    Pattern sander device, system and method 有权
    图案砂光机,系统及方法

    公开(公告)号:US09321141B2

    公开(公告)日:2016-04-26

    申请号:US14292194

    申请日:2014-05-30

    摘要: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

    摘要翻译: 本发明涉及一种用于将预定印模打磨成工件的装置。 该装置具有定位在由砂带形成的区域内的图案带。 衬垫位于由图案带形成的区域内。 在图案带的外表面上形成凸起图案。 在使用中,垫接触图案带,促使图案带的凸起图案接触砂带。 由图案带接触的砂带的部分被推向工件,使得预定的印模被砂磨入工件。

    POLISHING METHOD
    30.
    发明申请
    POLISHING METHOD 有权
    抛光方法

    公开(公告)号:US20160052107A1

    公开(公告)日:2016-02-25

    申请号:US14823967

    申请日:2015-08-11

    申请人: EBARA CORPORATION

    IPC分类号: B24D11/00

    摘要: There is disclosed a method of polishing a peripheral portion of a wafer having a hard film with use of an abrasive film while preventing damage to the abrasive film. The polishing method uses an abrasive film including a base film made of polyimide, a binder made of polyimide, and abrasive grains held by the binder. The polishing method includes: rotating a silicon substrate having a surface on which a silicon carbide film is formed; and removing the silicon carbide film from a peripheral portion of the silicon substrate by pressing the abrasive film at a low force against the silicon carbide film on the peripheral portion of the silicon substrate.

    摘要翻译: 公开了一种利用磨料膜研磨具有硬质膜的晶片的周边部分的方法,同时防止对研磨膜的损伤。 抛光方法使用包括由聚酰亚胺制成的基膜,由聚酰亚胺制成的粘合剂和由粘合剂保持的磨粒的研磨膜。 抛光方法包括:旋转具有形成有碳化硅膜的表面的硅衬底; 并且通过以低的力将研磨膜压在硅衬底的周边部分上的碳化硅膜上,从硅衬底的周边部分去除碳化硅膜。