公开(公告)号：US5928390A

公开(公告)日：1999-07-27

申请号：US787862

申请日：1997-01-23

申请人： Hidetami Yaegashi ,  Takayuki Toshima ,  Masami Akimoto ,  Eiji Yamaguchi ,  Junichi Kitano ,  Takayuki Katano ,  Hiroshi Shinya ,  Naruaki Iida

发明人： Hidetami Yaegashi ,  Takayuki Toshima ,  Masami Akimoto ,  Eiji Yamaguchi ,  Junichi Kitano ,  Takayuki Katano ,  Hiroshi Shinya ,  Naruaki Iida

IPC分类号： H01L21/00 ,  H01L21/68 ,  B23P21/00 ,  B65G49/07 ,  H01L21/027

CPC分类号： H01L21/67178 ,  H01L21/67196 ,  H01L21/67225 ,  H01L21/67742 ,  Y10T29/41

摘要： A processing apparatus comprises a plurality of process unit groups each including a plurality of process units for subjecting an object to a series of processes, the process units being arranged vertically in multiple stages, an object transfer space being defined among the process unit groups, and a transfer mechanism for transferring the object, the transfer mechanism having a transfer member vertically movable in the object transfer space, the transfer member being capable of transferring the object to each of the process units. The processing apparatus further comprises a mechanism for forming a downward air flow in the object transfer space, a mechanism for controlling the quantity of the downward air flow, and a mechanism for controlling the pressure in the object transfer space. Thus, a variation in condition of the object transfer space is reduced.

摘要翻译： 处理装置包括多个处理单元组，每个处理单元组包括用于对象进行一系列处理的多个处理单元，处理单元以多级垂直排列，在处理单元组之间定义对象传送空间，以及 用于传送物体的传送机构，传送机构具有可在物体传送空间中垂直移动的传送部件，传送部件能够将物体传送到每个处理单元。 处理装置还包括用于在物体传送空间中形成向下的空气流的机构，用于控制向下的空气流量的机构，以及用于控制物体传送空间中的压力的​​机构。 因此，物体传送空间的状态的变化减小。

公开(公告)号：US5725664A

公开(公告)日：1998-03-10

申请号：US692436

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05C5/00

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： An apparatus for subjecting a plurality of wafers to coating and heating treatments, including a coating section for subjecting the wafers to a coating treatment one by one, a heating section for subjecting wafers which have undergone the coating treatment to a heating treatment all together, and an interface section arranged between the coating section and the heating section. The wafers are heat-treated in the heat treatment section while the wafers are stacked at intervals in a vertical direction in a boat. The wafers which have undergone the coating treatment are loaded into the boat by a conveying member in the interface section. The conveying member and the boat are surrounded by a surrounding space formed by a casing at the interface section. A circulation line is combined with an air supply and exhaust system, for circulating air in the surrounding space. A dehumidifier is arranged on the circulation line for dehumidifying air in the circulation line to provide localized dehumidification of the surrounding space formed by the casing.

摘要翻译： 一种用于对多个晶片进行涂覆和加热处理的设备，包括用于对晶片进行一次涂覆处理的涂布部分，将经过涂覆处理的晶片全部进行加热处理的加热部分一起进行加热处理;以及 布置在涂覆部分和加热部分之间的界面部分。 在热处理部分中对晶片进行热处理，同时晶片在船上沿垂直方向间隔堆叠。 已经经过涂覆处理的晶片通过接口部分中的传送部件装载到船中。 输送构件和舟皿由在界面部分处由壳体形成的周围空间包围。 循环管线与供气和排气系统结合，用于在周围空间循环空气。 在循环管线上设置除湿器，用于对循环管线中的空气进行除湿，以提供由壳体形成的周围空间的局部除湿。

公开(公告)号：US5364222A

公开(公告)日：1994-11-15

申请号：US14161

申请日：1993-02-05

申请人： Masami Akimoto ,  Kazutoshi Yoshioka ,  Naruaki Iida

发明人： Masami Akimoto ,  Kazutoshi Yoshioka ,  Naruaki Iida

IPC分类号： B65G1/00 ,  B65G1/07 ,  B65G49/07 ,  H01L21/677 ,  H01L21/683

CPC分类号： H01L21/67781 ,  H01L21/6838 ,  Y10S414/137 ,  Y10S414/141

摘要： An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the processing section. The robot comprises a plate-shaped arm for transferring wafers between the carriers and the transfer tables, and two horseshoe-shaped forks for transferring wafers between the processing units and transfer tables. The robot is movable along a transfer path so as to make the arm and forks face the carriers, processing units and transfer tables.

摘要翻译： 一种用于在晶片上涂覆和显影抗蚀剂的设备包括：载体站，设置有用于接收晶片和转印台的多个载体，具有多个处理单元的处理部分和设置在载体站和处理之间的传送机器人 部分。 机器人包括用于在载体和转印台之间传送晶片的板状臂，以及用于在处理单元和转印台之间转印晶片的两个马蹄形叉。 机器人可以沿传送路径移动，以使臂和叉面向载体，处理单元和传送台。

公开(公告)号：US08755935B2

公开(公告)日：2014-06-17

申请号：US13405918

申请日：2012-02-27

申请人： Yuichi Douki ,  Tokutarou Hayashi ,  Naruaki Iida ,  Suguru Enokida

发明人： Yuichi Douki ,  Tokutarou Hayashi ,  Naruaki Iida ,  Suguru Enokida

IPC分类号： B25J9/06 ,  H01L21/67 ,  B25J9/04 ,  B25J9/02

CPC分类号： H01L21/68 ,  H01L21/6715 ,  H01L21/67748 ,  H01L21/681 ,  H01L21/68707 ,  H01L22/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： A substrate holder positioning method, capable of positioning a substrate holder without using any positioning jig, includes: measuring a first position of a substrate held on a substrate holder included in a substrate carrying mechanism; carrying the substrate held on the substrate holder to a substrate rotating unit for holding and rotating the substrate; turning the substrate held by the substrate rotating unit through a predetermined angle by the substrate rotating unit; transferring the substrate turned by the substrate rotating unit from the substrate rotating unit to the substrate holder; measuring a second position of the substrate transferred from the substrate rotating unit to the substrate holder; determining the position of the center of rotation of the substrate rotating unit on the basis of the first and the second position; and positioning the substrate holder on the basis of the position of the center of rotation.

摘要翻译： 一种能够在不使用任何定位夹具的情况下定位基板支架的基板支架定位方法，包括：测量保持在基板承载机构中的基板保持器上的基板的第一位置; 将保持在所述基板保持器上的所述基板承载到用于保持和旋转所述基板的基板旋转单元; 通过基板旋转单元将由基板旋转单元保持的基板转动预定角度; 将由基板旋转单元转动的基板从基板旋转单元传送到基板保持器; 测量从所述基板旋转单元转移到所述基板保持器的所述基板的第二位置; 基于第一位置和第二位置确定基板旋转单元的旋转中心的位置; 并且基于旋转中心的位置来定位衬底保持器。

公开(公告)号：US08441618B2

公开(公告)日：2013-05-14

申请号：US12820417

申请日：2010-06-22

申请人： Masahiro Nakaharada ,  Naruaki Iida ,  Katsuhiro Morikawa ,  Suguru Enokida

发明人： Masahiro Nakaharada ,  Naruaki Iida ,  Katsuhiro Morikawa ,  Suguru Enokida

IPC分类号： B65H1/00 ,  G03B27/32 ,  G03B27/42 ,  G03B27/58

CPC分类号： H01L21/67742 ,  G03B27/52 ,  H01L21/67748 ,  H01L21/67754

摘要： A substrate transfer apparatus, for transferring a substrate from a first module to a second module, includes a moving base having a Y-motion axis for moving the moving base in Y-direction, and a substrate holding member mounted to the moving base via X-motion axis so as to move relative to the moving base to be in an advanced position and a retracted position relative to the moving base. The X-motion axis operates when the Y-motion axis is operating, if the X-motion axis must be parallel to the Y-motion axis when transferring the substrate from the substrate holding member to the second module.

摘要翻译： 一种用于将基板从第一模块传送到第二模块的基板传送装置，包括：具有用于沿Y方向移动移动基座的Y运动轴的移动基座，以及经由X安装到移动基座的基板保持构件 运动轴线相对于移动基座移动到相对于移动基座处于提前位置和缩回位置。 如果X轴运动轴在从衬底保持构件转移到第二模块时必须平行于Y运动轴，X运动轴运行。

公开(公告)号：US08292549B2

公开(公告)日：2012-10-23

申请号：US13181867

申请日：2011-07-13

申请人： Naruaki Iida

发明人： Naruaki Iida

IPC分类号： B65G53/00

CPC分类号： B65G49/065 ,  B65G2249/02 ,  B65G2249/04 ,  H01L21/67784

摘要： The substrate carrying device includes a carrying passage forming member forming a carrying passage along which a substrate is carried, exhaust grooves extending parallel to the carrying passage in the upper surface of the carrying passage forming member, a plurality of pairs each of right and left carrying gas flow grooves formed in the upper surface of the carrying passage forming member, inclined to a substrate carrying direction so as to approach the exhaust grooves from the right-hand side and the left-hand side of the exhaust grooves, respectively, and having inner ends joined to the exhaust grooves, respectively, and gas spouting pores formed near outer ends of the carrying gas flow grooves to spout a gas for causing the substrate to float and for creating substrate carrying gas flows flowing from the outer ends of the carrying gas flow grooves toward the inner ends of the carrying gas flow grooves.

摘要翻译： 基板承载装置包括：承载通道形成构件，其形成承载基板的承载通道，在承载通道形成构件的上表面中平行于输送通道延伸的排出槽，多个左右的承载通道 形成在输送通道形成部件的上表面中的气体流动槽分别倾斜到基板输送方向，以便从排气槽的右侧和左侧接近排气槽，并且具有内部 分别连接到排气槽的端部和在承载气体流动槽的外端附近形成的气体喷出孔，以喷出用于使基板浮起的气体，以及用于产生从承载气体流的外端流动的衬底承载气体流 凹槽朝向承载气流槽的内端。

公开(公告)号：US07208066B2

公开(公告)日：2007-04-24

申请号：US10649780

申请日：2003-08-28

申请人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

发明人： Junichi Kitano ,  Yuji Matsuyama ,  Takahiro Kitano ,  Takayuki Katano ,  Hidefumi Matsui ,  Yo Suzuki ,  Masami Yamashita ,  Toru Aoyama ,  Hiroyuki Iwaki ,  Satoru Shimura ,  Masatoshi Deguchi ,  Kousuke Yoshihara ,  Naruaki Iida

IPC分类号： C23F1/00 ,  H01L21/306 ,  B05C11/00

CPC分类号： H01L21/67178 ,  G03F7/70991 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67778 ,  Y10T29/41

摘要： On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

摘要翻译： 在涂覆和显影处理系统中由分隔板，即盒式磁带站，加工站和界面部分划分的各个区域之上，提供用于向各个区域供应惰性气体的气体供应部分。 在各个区域的底部设置用于各区域的排气的排气管。 通过将不含杂质的惰性气体（例如氧气和细颗粒）从各个气体供应区域供应到各个区域中并且从排气管排出各个区域中的气氛，将各个区域中的气氛保持在清洁状态。

公开(公告)号：US06672779B2

公开(公告)日：2004-01-06

申请号：US10244755

申请日：2002-09-17

申请人： Issei Ueda ,  Shinichi Hayashi ,  Naruaki Iida ,  Yuji Matsuyama ,  Yoichi Deguchi

发明人： Issei Ueda ,  Shinichi Hayashi ,  Naruaki Iida ,  Yuji Matsuyama ,  Yoichi Deguchi

IPC分类号： G03D500

CPC分类号： H01L21/67161 ,  G07C9/00103 ,  G07C9/00111 ,  G08G3/00 ,  H01L21/67017 ,  H01L21/6715 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/67754 ,  Y10S134/902 ,  Y10S414/14

摘要： Thermal processing unit sections each with ten tiers and coating processing unit sections each with five tiers are disposed around a first main wafer transfer section and a second main wafer transfer section, and in the thermal processing unit section, the influence of the time required for substrate temperature regulation processing on a drop in throughput can be reduced greatly by transferring the wafer W while the temperature of the wafer W is being regulated by a temperature regulation and transfer device.

摘要翻译： 在第一主晶片传送部和第二主晶片传送部的周围配置具有10层的热处理单元部和各层的涂布处理单元部，并且在热处理单元部中，对基板所需的时间的影响 通过在晶片W的温度由温度调节和转移装置调节的同时转移晶片W可以大大降低生产率下降的温度调节处理。

公开(公告)号：US06168669A

公开(公告)日：2001-01-02

申请号：US09250394

申请日：1999-02-16

申请人： Kenji Yasuda ,  Naruaki Iida

发明人： Kenji Yasuda ,  Naruaki Iida

IPC分类号： C23C1600

CPC分类号： H01L21/68707

摘要： Supporting members are provided at three places, for example, on a frame section of a pair of tweezers. Each supporting member has a tapered face as an inclined guide for allowing a rim portion of a substrate to slide down to be guided to a predetermined position. A vertical wall which is formed continuing from the tapered face and being nearly perpendicular to a supported face of a wafer is provided at an upper end of the tapered face. Even when the rim portion of the wafer rises along the tapered face with the movement of the tweezers, the rim portion stops by hitting against the vertical wall, thereby preventing the wafer from falling from the tweezers.

摘要翻译： 支撑构件设置在三个位置，例如，在一对镊子的框架部分上。 每个支撑构件具有锥形面作为倾斜引导件，用于允许基板的边缘部分向下滑动以被引导到预定位置。 在锥面的上端设置有从锥形表面连续并且几乎垂直于晶片的支撑面的垂直壁。 即使当晶片的边缘部分随着镊子的移动而沿着锥形表面上升时，边缘部分通过撞击垂直壁而停止，从而防止晶片从镊子落下。

公开(公告)号：US6054181A

公开(公告)日：2000-04-25

申请号：US692286

申请日：1996-08-05

申请人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

发明人： Mitsuhiro Nanbu ,  Naruaki Iida ,  Hideaki Gotou ,  Masanori Tateyama ,  Yuji Yoshimoto ,  Tomoko Ishimoto ,  Hidetami Yaegashi ,  Yasunori Kawakami ,  Takahide Fukuda ,  Akihiro Fujimoto ,  Takashi Takekuma ,  Hiroyuki Matsukawa

IPC分类号： H01L21/00 ,  H01L21/677 ,  B05D3/12

CPC分类号： H01L21/67265 ,  H01L21/67173 ,  H01L21/67766 ,  H01L21/67778 ,  Y10S134/902 ,  Y10S414/135 ,  Y10S414/136 ,  Y10S414/137 ,  Y10S414/141

摘要： A method of subjecting a plurality of wafers to coating and beating treatments where a first boat is placed on a stage arranged in an interface section. The first boat is capable of containing the wafers stacked at intervals in a vertical direction. The stage is capable of moving in a horizontal direction, and has a plurality of positions for respectively placing a plurality of boats. The wafers are conveyed from a supply section to a coating section, and are subjected to a coating treatment one by one. The wafers, which have undergone the coating treatment, are conveyed to the interface section. The wafers, which have undergone the coating treatment, are loaded into the first boat placed on the stage, in the interface section. The first boat containing the wafers, which have undergone the coating treatment, is located at a transfer position by moving the stage. The first boat, located at a transfer position by moving the stage. The first boat, located at the transfer position, is conveyed from the stage into a heating section, and the wafers, which have undergone the coating treatment, are subjected to a heating treatment simultaneously and all together.

摘要翻译： 一种将多个晶片进行涂覆和打浆处理的方法，其中第一个船被放置在布置在界面部分中的台上。 第一艘船能够容纳沿垂直方向间隔堆叠的晶片。 舞台能够沿水平方向移动，并且具有用于分别放置多个船的多个位置。 将晶片从供给部输送到涂布部，并逐个进行涂布处理。 已经经过涂覆处理的晶片被输送到界面部分。 已经进行了涂覆处理的晶片被装载到接口部分中放置在载物台上的第一个舟皿中。 包含经过涂覆处理的晶片的第一艘船通过移动台架位于转移位置。 第一艘船，通过移动舞台位于转移位置。 位于转移位置的第一个船从载物台输送到加热部分，并且经过涂覆处理的晶片同时进行加热处理。