发明授权
- 专利标题: Substrate holding apparatus and substrate process system
- 专利标题(中): 基板保持装置和基板处理系统
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申请号: US09250394申请日: 1999-02-16
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公开(公告)号: US06168669A公开(公告)日: 2001-01-02
- 发明人: Kenji Yasuda , Naruaki Iida
- 申请人: Kenji Yasuda , Naruaki Iida
- 优先权: JP10-060478 19980224
- 主分类号: C23C1600
- IPC分类号: C23C1600
摘要:
Supporting members are provided at three places, for example, on a frame section of a pair of tweezers. Each supporting member has a tapered face as an inclined guide for allowing a rim portion of a substrate to slide down to be guided to a predetermined position. A vertical wall which is formed continuing from the tapered face and being nearly perpendicular to a supported face of a wafer is provided at an upper end of the tapered face. Even when the rim portion of the wafer rises along the tapered face with the movement of the tweezers, the rim portion stops by hitting against the vertical wall, thereby preventing the wafer from falling from the tweezers.
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