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公开(公告)号：US08951835B2
公开(公告)日：2015-02-10
申请号：US14063672
申请日：2013-10-25
Applicant: Samsung Electro-Mechanics Co., Ltd. , Sungkyunkwan University Foundation for Corporate Collaboration
Inventor： Seung Wook Park , Young Do Kweon , Jang Hyun Kim , Tae Seok Park , Su Jeong Suh , Jae Gwon Jang , Nam Jung Kim , Seung Kyu Lim , Kwang Keun Lee
CPC classification number: H01L21/50 , H01L23/13 , H01L23/147 , H01L23/49827 , H01L24/13 , H01L24/16 , H01L2224/131 , H01L2224/16146 , H01L2224/16235 , H01L2924/0001 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/19015 , H01L2924/19041 , Y10T436/170769 , H01L2224/13099
Abstract: A method of fabricating a package substrate, includes forming a cavity in at least one region of an upper surface of a wafer, the cavity including a chip mounting region, forming a through-hole penetrating through the wafer and a via filling the through-hole, forming a first wiring layer and a second wiring layer spaced apart from the first wiring layer, which are extended into the cavity, and mounting a chip in the cavity to be connected to the first wiring layer and the second wiring layer.
Abstract translation: 一种制造封装基板的方法，包括在晶片的上表面的至少一个区域中形成空腔，所述空腔包括芯片安装区域，形成穿透晶片的通孔和填充通孔的通孔 形成与所述第一布线层间隔开的第一布线层和第二布线层，所述第一布线层和第二布线层延伸到所述空腔中，并将芯片安装在所述空腔中以与所述第一布线层和所述第二布线层连接。
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公开(公告)号：US09786428B2
公开(公告)日：2017-10-10
申请号：US14192471
申请日：2014-02-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jin Hyuck Yang , Young Seuck Yoo , Sung Kwon Wi , Hye Won Bang , Geon Se Chang , Young Do Kweon , Ju Hwan Yang
CPC classification number: H01F27/292 , H01F17/0013 , H01F2017/0066
Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.
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23.发明授权公开(公告)号：US09264010B2
公开(公告)日：2016-02-16
申请号：US14027835
申请日：2013-09-16
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Dong Hwan Lee , Seung Wook Park , Christian Romero , Young Do Kweon , Jin Gu Kim
CPC classification number: H03H7/17 , H05K1/0251 , H05K1/116 , H05K2201/09381
Abstract: The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided.
Abstract translation: 本发明涉及具有开口短截线的通孔结构和具有该开口短路的印刷电路板。 根据本发明的实施例，具有开口短截线的通孔结构包括：通过绝缘层的信号传输; 用于连接分别形成在绝缘层上和下面的第一和第二传输线的上和下通孔焊盘和信号传输通孔; 并且提供连接到每个通孔焊盘的外周的至少一个开放短截线以具有形成在绝缘层上和下面的每个接地图案的分流电容。 此外，提供了具有开口短路的通孔的印刷电路板。
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公开(公告)号：US09230727B2
公开(公告)日：2016-01-05
申请号：US13830884
申请日：2013-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Seuck Yoo , Kang Heon Hur , Sung Kwon Wi , Ho Jin Yun , Jong Yun Lee , Ju Hwan Yang , Jin Hyuck Yang , Young Do Kweon , Eun Ha Kim
CPC classification number: H01F27/2804 , H01F17/0013 , H01F2017/0066
Abstract: Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.
Abstract translation: 这里公开了一种共模滤波器，其包括以线圈电极形式制造的内部电极，并且具有在线圈缠绕方向上的单层中彼此重叠的两个线圈电极的同时线圈图案，其中， 形成在内部电极上的第二绝缘层的高度高于线圈之间的间隔。 因此，可以基本上阻止产生寄生电容的部分，并且可以增加自谐振频率（SRF），同时保持作为共模滤波器的滤波性能。
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25.发明授权Asymmetrical multilayer substrate, RF module, and method for manufacturing asymmetrical multilayer substrate 有权不对称多层基板，RF模块以及制造不对称多层基板的方法公开(公告)号：US09204533B2
公开(公告)日：2015-12-01
申请号：US13664358
申请日：2012-10-30
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Romero Christian , Seung Wook Park , Young Do Kweon , Mi Jin Park
CPC classification number: H05K1/0251 , H05K1/162 , H05K3/4602 , H05K2201/09336
Abstract: Disclosed herein are an asymmetrical multilayer substrate, an RF module, and a method for manufacturing the asymmetrical multilayer substrate. The asymmetrical multilayer substrate includes a core layer, a first pattern layer formed on one side of the core layer and including a first signal line pattern, a second pattern layer formed on the other side and including a second metal plate and a second routing line pattern, a first insulating layer thinner than the core layer formed on the second pattern layer and including a first via, and a third pattern layer formed on the first insulating layer and including a third signal line pattern, wherein an impedance transformation circuit including an impedance load and a parasitic capacitance load on the transmission line is formed for impedance matching in signal transmission between the signal line patterns formed in the upper and lower side directions of the core layer.
Abstract translation: 本文公开了不对称多层基板，RF模块和用于制造非对称多层基板的方法。 不对称多层基板包括芯层，形成在芯层的一侧上并包括第一信号线图案的第一图案层，形成在另一侧上的第二图案层，并且包括第二金属板和第二布线线图案 ，比形成在第二图案层上的芯层薄且包括第一通孔的第一绝缘层和形成在第一绝缘层上并包括第三信号线图案的第三图案层，其中阻抗变换电路包括阻抗负载 并且形成传输线上的寄生电容负载用于在形成在芯层的上侧和下侧方向上的信号线图案之间的信号传输中的阻抗匹配。
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Patent Agency Ranking
26.发明申请公开(公告)号：US20150145629A1
公开(公告)日：2015-05-28
申请号：US14552867
申请日：2014-11-25
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Geon Se Chang , Young Do Kweon , Jin Hyuck Yang
CPC classification number: H01F27/2804 , H01F17/0006 , H01F27/292 , H01F2027/2809
Abstract: An electronic component and a circuit board having the same mounted thereon. The electronic component includes: a base part; a coil part provided on the base part and including a coil formed by disposing conductive patterns in a spiral shape and an external terminal connected to an end portion of the coil; and a cover part including an external electrode having a first surface contacting an upper surface of the external terminal and a second surface opposing the first surface and a magnetic material part provided on the coil part, made of a magnetic material, and exposing the second surface, wherein a surface area of the first surface is larger than a surface area of the second surface.
Abstract translation: 具有安装在其上的电子部件和电路板。 电子部件包括：基部; 线圈部，其设置在所述基部上，并且包括通过设置螺旋形状的导电图案形成的线圈和与所述线圈的端部连接的外部端子; 以及包括外部电极的覆盖部分，所述外部电极具有与所述外部端子的上表面接触的第一表面和与所述第一表面相对的第二表面和由磁性材料制成的设置在所述线圈部分上的磁性材料部分，并且暴露所述第二表面 ，其中所述第一表面的表面积大于所述第二表面的表面积。
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公开(公告)号：US09009950B2
公开(公告)日：2015-04-21
申请号：US13804250
申请日：2013-03-14
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Sang Moon Lee , Young Seuck Yoo , Jong Yun Lee , Young Do Kweon , Sung Kwon Wi
CPC classification number: H01F41/02 , H01F41/041 , Y10T29/4902 , Y10T29/49048 , Y10T29/49064 , Y10T29/49124 , Y10T29/49204
Abstract: Disclosed herein is a method for manufacturing a high frequency inductor, the method including; forming a primary coil for manufacturing the high frequency inductor on a wafer; coating a primary PSV on the wafer on which the primary coil is formed; forming a secondary coil for manufacturing the high frequency inductor, after the coating of the primary PSV; coating a secondary PSV, after the forming of the secondary coil; forming a barrier layer on an electrode portion to be exposed of the high frequency inductor, after the coating of the secondary PSV; filling and curing an insulating resin on the wafer, after the forming of the barrier layer; and polishing the cured resin up to the barrier layer to expose the electrode.
Abstract translation: 本文公开了一种制造高频电感器的方法，该方法包括： 形成用于在晶片上制造高频电感器的初级线圈; 在其上形成初级线圈的晶片上涂覆初级PSV; 在主PSV的涂覆之后形成用于制造高频电感器的次级线圈; 在形成次级线圈之后涂覆次级PSV; 在第二PSV的涂覆之后，在要暴露于高频电感器的电极部分上形成阻挡层; 在形成阻挡层之后，在晶片上填充和固化绝缘树脂; 并将固化树脂抛光至阻挡层，以露出电极。
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公开(公告)号：US20140338955A1
公开(公告)日：2014-11-20
申请号：US14094349
申请日：2013-12-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Mi Jin Park , Jeong Ho Lee , Young Nam Hwang , Young Do Kweon
IPC: H05K1/02
CPC classification number: H05K1/0271 , H05K3/4644 , H05K2201/0191
Abstract: Disclosed herein is a printed circuit board. According to a preferred embodiment of the present invention, the printed circuit board, includes: a base board; an upper build-up layer which is formed on the base board and includes an upper insulating layer and an upper circuit layer having at least one layer; and a lower build-up layer which is formed beneath the base board, has a different thickness from the upper build-up layer, and includes a lower insulating layer and a lower circuit layer having at least one layer.
Abstract translation: 这里公开了一种印刷电路板。 根据本发明的优选实施例，印刷电路板包括：基板; 形成在所述基板上并包括上绝缘层和具有至少一层的上电路层的上叠层; 并且形成在基板下方的下积聚层具有与上层叠层不同的厚度，并且包括具有至少一层的下绝缘层和下电路层。
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公开(公告)号：US20140062644A1
公开(公告)日：2014-03-06
申请号：US13830884
申请日：2013-03-14
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Seuck Yoo , Kang Heon Hur , Sung Kwon Wi , Ho Jin Yun , Jong Yun Lee , Ju Hwan Yang , Jin Hyuck Yang , Young Do Kweon , Eun Ha Kim
IPC: H01F27/28
CPC classification number: H01F27/2804 , H01F17/0013 , H01F2017/0066
Abstract: Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.
Abstract translation: 这里公开了一种共模滤波器，其包括以线圈电极形式制造的内部电极，并且具有在线圈缠绕方向上的单层中彼此重叠的两个线圈电极的同时线圈图案，其中， 形成在内部电极上的第二绝缘层的高度高于线圈之间的间隔。 因此，可以基本上阻止产生寄生电容的部分，并且可以增加自谐振频率（SRF），同时保持作为共模滤波器的滤波性能。
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公开(公告)号：US20140062636A1
公开(公告)日：2014-03-06
申请号：US13794684
申请日：2013-03-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ju Hwan Yang , Sung Kwon Wi , Jin Hyuck Yang , Young Do Kweon , Sang Moon Lee
IPC: H01F17/04
CPC classification number: H01F17/04 , H01F5/00 , H01F17/0006 , H01F17/0013 , H01F27/02 , H01F27/292 , H01F2017/048
Abstract: Disclosed herein are a coil component and a manufacturing method thereof. The coil component includes: an electrode body including coil electrodes disposed therein, the coil electrodes having an insulating film deposited on a surface thereof; and external terminals formed at both side portions of the electrode body and connected to the coil electrodes, wherein the electrode body is made of an insulating material with which magnetic powders are mixed, in order to improve impedance characteristics.
Abstract translation: 这里公开了线圈部件及其制造方法。 线圈部件包括：电极体，其包括设置在其中的线圈电极，线圈电极具有沉积在其表面上的绝缘膜; 以及形成在电极体的两侧部分并连接到线圈电极的外部端子，其中电极体由混合有磁粉的绝缘材料制成，以改善阻抗特性。
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