Imaging system for buried metrology targets

    公开(公告)号:US11512948B2

    公开(公告)日:2022-11-29

    申请号:US17069177

    申请日:2020-10-13

    Abstract: A metrology system may include an imaging sub-system to image a metrology target buried in a sample, where the sample is formed from bonded first and second substrates with a metrology target at the interface. The metrology system may further include an illumination sub-system with an illumination field stop and an illumination pupil, where the illumination field stop includes an aperture to provide that a projected size of the field-stop aperture on a measurement plane corresponding to the metrology target matches a field of view of the detector at the measurement plane, and where the illumination pupil includes a central obscuration to provide oblique illumination of the metrology target with angles greater than a cutoff angle selected to prevent illumination from the illumination source from reflecting off of the bottom surface of the sample and through the field of view of the detector at the measurement plane.

    SYSTEMS AND METHODS FOR ABSOLUTE SAMPLE POSITIONING

    公开(公告)号:US20220344192A1

    公开(公告)日:2022-10-27

    申请号:US17471007

    申请日:2021-09-09

    Abstract: A sample mapping system includes a sample chuck including absolute reference marks, an imaging metrology tool to capture sets of alignment images at locations associated with sample marks on a sample on the sample chuck, and a controller. A particular set of alignment images at a particular location may include at least one alignment image associated with a particular sample mark and at least one alignment image associated with a particular portion of the absolute reference marks within a field of view of the imaging metrology tool visible through the sample. The controller may determine absolute coordinates of the sample marks based on the sets of alignment images. Determining the absolute coordinates of the particular sample mark may include determining the absolute coordinates of the particular sample mark based on a position of the particular sample mark relative to the particular portion of the absolute reference marks.

    Modulation Of Scanning Velocity During Overlay Metrology

    公开(公告)号:US20220307825A1

    公开(公告)日:2022-09-29

    申请号:US17214888

    申请日:2021-03-28

    Abstract: A method for imaging overlay targets on a wafer includes (1) using a sensor to acquire images of overlay targets on a wafer while the wafer is in motion and (2) accelerating and decelerating the wafer to move the overlay targets into alignment with the sensor between acquiring images of the overlay targets. Accelerating/decelerating the wafer may include: (1) accelerating the wafer at a maximum acceleration and then decelerating the wafer at a maximum deceleration, (2) accelerating/decelerating the wafer in a triangular waveform pattern, (3) accelerating/decelerating the wafer in a sinusoidal pattern, or (4) accelerating/decelerating the wafer in a near-sinusoidal pattern (created by combining a pure sinusoidal profile with one or more harmonic profiles). A system is also provided for implementing the above method(s).

    MULTI-FIELD SCANNING OVERLAY METROLOGY

    公开(公告)号:US20220283514A1

    公开(公告)日:2022-09-08

    申请号:US17195507

    申请日:2021-03-08

    Abstract: A metrology tool may include an illumination sub-system to illuminate sample within two or more acquisition fields with two or more illumination beams, where the two or more acquisition fields are distributed along a scan direction in a non-overlapping configuration, and where a translation stage translates a metrology target on the sample along the scan direction sequentially through the two or more acquisition fields. The metrology tool may further include an imaging sub-system to image the two or more acquisition fields while the sample is scanned along the scan direction. The imaging sub-system may include a field-repositioning optical relay to relay images of the two or more acquisition fields to a scanning detector including one or more pixel columns distributed along a column direction, where the field-repositioning optical relay positions the images of the two or more acquisition fields on the scanning detector along the column direction.

    System and method for error reduction for metrology measurements

    公开(公告)号:US11353799B1

    公开(公告)日:2022-06-07

    申请号:US16928468

    申请日:2020-07-14

    Abstract: A metrology system includes a controller communicatively coupled to one or more metrology tools, the controller including one or more processors configured to execute program instructions causing the one or more processors to receive one or more metrology measurements of one or more metrology targets of a metrology sample, a metrology target of the one or more metrology targets including one or more target designs with one or more cells, the one or more target designs being generated on one or more layers of the metrology sample; determine one or more errors based on the one or more metrology measurements; and determine one or more correctables to adjust one or more sources of error corresponding to the one or more errors, the one or more correctables being configured to reduce an amount of noise in the one or more metrology measurements generated by the one or more sources of errors.

    METHOD OF MEASURING MISREGISTRATION IN THE MANUFACTURE OF TOPOGRAPHIC SEMICONDUCTOR DEVICE WAFERS

    公开(公告)号:US20220171296A1

    公开(公告)日:2022-06-02

    申请号:US17673131

    申请日:2022-02-16

    Abstract: A method of measuring misregistration in the manufacture of semiconductor device wafers including providing a multilayered semiconductor device wafer including at least a first layer and a second layer including at least one misregistration measurement target including a first periodic structure formed together with the first layer having a first pitch and a second periodic structure formed together with the second layer having a second pitch, imaging the first layer and the second layer at a depth of focus and using light having at least one first wavelength that causes images of both the first layer and the second layer to appear in at least one plane within the depth of focus and quantifying offset in the at least one plane between the images of the first layer and the second layer, thereby to calculate misregistration of the first layer and the second layer.

    System and Method for Error Reduction for Metrology Measurements

    公开(公告)号:US20220155693A1

    公开(公告)日:2022-05-19

    申请号:US16928468

    申请日:2020-07-14

    Abstract: A metrology system includes a controller communicatively coupled to one or more metrology tools, the controller including one or more processors configured to execute program instructions causing the one or more processors to receive one or more metrology measurements of one or more metrology targets of a metrology sample, a metrology target of the one or more metrology targets including one or more target designs with one or more cells, the one or more target designs being generated on one or more layers of the metrology sample; determine one or more errors based on the one or more metrology measurements; and determine one or more correctables to adjust one or more sources of error corresponding to the one or more errors, the one or more correctables being configured to reduce an amount of noise in the one or more metrology measurements generated by the one or more sources of errors.

    Pupil-plane beam scanning for metrology

    公开(公告)号:US11300524B1

    公开(公告)日:2022-04-12

    申请号:US17142783

    申请日:2021-01-06

    Abstract: A metrology measurement apparatus may include one or more illumination sources, a beamsplitter configured to receive illumination from the one or more illumination sources from an illumination pathway and direct the illumination along a measurement pathway, and an objective lens. The objective lens may direct the illumination from the measurement pathway to a sample, collect light from the sample, and direct the collected light along the measurement pathway to the beamsplitter such that the beamsplitter may direct the collected light along a collection pathway to a detector. The apparatus may further include a pupil-plane scanner along the measurement pathway with a pupil relay and a deflector in a relayed pupil plane such that adjusting the deflector adjusts a position of the illumination spot on the sample without modifying a position of the illumination pupil distribution or a position of a distribution of the collected light along the collection pathway.

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