公开(公告)号：US11978679B2

公开(公告)日：2024-05-07

申请号：US17306058

申请日：2021-05-03

Applicant: KLA Corporation

Inventor： Chen Dror

IPC: H01L21/67 ,  G05B19/418 ,  H01L21/66 ,  H01L23/544

CPC classification number: H01L22/32 ,  G05B19/41885 ,  H01L21/67276 ,  H01L22/20 ,  H01L23/544 ,  G05B2219/45031 ,  H01L2223/54426

Abstract: A device used for semiconductor metrology includes a substrate and a plurality of pieces from one or more semiconductor wafers. Each piece of the plurality of pieces is bonded to the substrate at a respective position on the substrate. Each piece of the plurality of pieces includes a respective instance of a measurement test structure and an alignment mark. Each piece of the plurality of pieces has a known location from the one or more semiconductor wafers.

公开(公告)号：US11353799B1

公开(公告)日：2022-06-07

申请号：US16928468

申请日：2020-07-14

Applicant: KLA Corporation

Inventor： Roie Volkovich ,  Liran Yerushalmi ,  Anna Golotsvan ,  Rawi Dirawi ,  Chen Dror ,  Nir BenDavid ,  Amnon Manassen ,  Oren Lahav ,  Shlomit Katz

IPC: G03F7/20 ,  H01L21/66 ,  G01B11/27

Abstract: A metrology system includes a controller communicatively coupled to one or more metrology tools, the controller including one or more processors configured to execute program instructions causing the one or more processors to receive one or more metrology measurements of one or more metrology targets of a metrology sample, a metrology target of the one or more metrology targets including one or more target designs with one or more cells, the one or more target designs being generated on one or more layers of the metrology sample; determine one or more errors based on the one or more metrology measurements; and determine one or more correctables to adjust one or more sources of error corresponding to the one or more errors, the one or more correctables being configured to reduce an amount of noise in the one or more metrology measurements generated by the one or more sources of errors.

公开(公告)号：US20220155693A1

公开(公告)日：2022-05-19

申请号：US16928468

申请日：2020-07-14

Applicant: KLA Corporation

Inventor： Roie Volkovich ,  Liran Yerushalmi ,  Anna Golotsvan ,  Rawi Dirawi ,  Chen Dror ,  Nir BenDavid ,  Amnon Manassen ,  Oren Lahav ,  Shlomit Katz

IPC: G03F7/20 ,  G01B11/27 ,  H01L21/66

Abstract: A metrology system includes a controller communicatively coupled to one or more metrology tools, the controller including one or more processors configured to execute program instructions causing the one or more processors to receive one or more metrology measurements of one or more metrology targets of a metrology sample, a metrology target of the one or more metrology targets including one or more target designs with one or more cells, the one or more target designs being generated on one or more layers of the metrology sample; determine one or more errors based on the one or more metrology measurements; and determine one or more correctables to adjust one or more sources of error corresponding to the one or more errors, the one or more correctables being configured to reduce an amount of noise in the one or more metrology measurements generated by the one or more sources of errors.

公开(公告)号：US20210351089A1

公开(公告)日：2021-11-11

申请号：US17306058

申请日：2021-05-03

Applicant: KLA Corporation

Inventor： Chen Dror

IPC: H01L21/66 ,  H01L23/544 ,  H01L21/67 ,  G05B19/418

Abstract: A device used for semiconductor metrology includes a substrate and a plurality of pieces from one or more semiconductor wafers. Each piece of the plurality of pieces is bonded to the substrate at a respective position on the substrate. Each piece of the plurality of pieces includes a respective instance of a measurement test structure and an alignment mark. Each piece of the plurality of pieces has a known location from the one or more semiconductor wafers.