公开(公告)号：US20170290197A1

公开(公告)日：2017-10-05

申请号：US15507597

申请日：2014-08-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Lei Zhong ,  Linfang Jin ,  Jie Zou ,  Nanbo Kang

IPC: H05K7/20 ,  H01H23/16 ,  H05K1/18 ,  H01C7/00 ,  H05K7/14 ,  H05K5/02

CPC classification number: H05K7/20172 ,  H01C7/008 ,  H01H15/005 ,  H01H23/164 ,  H05K1/181 ,  H05K5/0213 ,  H05K7/1427 ,  H05K7/20181 ,  H05K7/20209 ,  H05K2201/10053 ,  H05K2201/10196

Abstract: An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run.

公开(公告)号：US20170102745A1

公开(公告)日：2017-04-13

申请号：US15311927

申请日：2014-06-04

Applicant: Huawei Technologies Co., Ltd.

Inventor： Linfang Jin ,  Xiaowei Hui ,  Xiangyang Yang ,  Shaoxin Zhou

IPC: G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/0275 ,  G06F1/203 ,  H05K7/20336 ,  H05K7/2039

Abstract: An electronic device is provided. The electronic device includes a heat emitting element, and the heat emitting element is disposed on a circuit board PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1° C./W.