公开(公告)号：US10966352B2

公开(公告)日：2021-03-30

申请号：US16139377

申请日：2018-09-24

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Jorge Padilla

IPC: H05K7/20 ,  H01L23/427 ,  H01L23/473

Abstract: This disclosure describes a cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.

公开(公告)号：US20200373222A1

公开(公告)日：2020-11-26

申请号：US16441998

申请日：2019-06-14

Applicant: Google LLC

Inventor： Madhusudan Krishnan Iyengar ,  Norman Paul Jouppi ,  Jorge Padilla ,  Christopher Gregory Malone

IPC: H01L23/473

Abstract: Methods, systems, and apparatus, including an integrated circuit (IC) with a ring-shaped hot spot area. In one aspect, an IC includes a first area along an outside perimeter of a surface of the IC. The first area defines a first inner perimeter. The IC includes a second area that includes a center of the IC and that includes a first set of components. The second area defines a first outer. The IC includes a ring-shaped hot spot area between the first area and the second area. The ring-shaped hot spot area defines a ring outer perimeter that is juxtaposed with the first inner perimeter. The ring-shaped hot spot area defines a ring inner perimeter that is juxtaposed with the first outer perimeter. The ring-shaped hot spot area includes a second set of components that produce more heat than the first set of components.

公开(公告)号：US10468359B2

公开(公告)日：2019-11-05

申请号：US16110133

申请日：2018-08-23

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  TeckGyu Kang

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/00 ,  H05K5/02 ,  H01L23/50 ,  H05K5/00

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

公开(公告)号：US20190237411A1

公开(公告)日：2019-08-01

申请号：US16110133

申请日：2018-08-23

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woonseong Kwon ,  TeckGyu Kang

IPC: H01L23/00 ,  H05K5/02 ,  H05K5/00 ,  H01L23/50

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/50 ,  H05K5/0026 ,  H05K5/0217

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

公开(公告)号：US10083920B1

公开(公告)日：2018-09-25

申请号：US15886246

申请日：2018-02-01

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woon Seong Kwon ,  TeckGyu Kang

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/00 ,  H05K5/00 ,  H01L23/50 ,  H05K5/02

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/50 ,  H05K5/0026 ,  H05K5/0217

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.