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公开(公告)号：US09839125B1
公开(公告)日：2017-12-05
申请号：US14266723
申请日：2014-04-30
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes multiple electronic components coupled to a fabric. Each of the multiple electronic components includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. One of the electrically conductive wire braids interconnects two electronic components, thereby providing an electrical connection between the two electronic components. The electrically conductive wire braid can be attached to the fabric by an adhesive, a stitched thread, which can be either electrically insulated or electrically conductive, or both adhesive and stitched thread. The fabric can be a wearable fabric, such as a shirt or pants, or other form to be worn by a user, such as an armband, waistband, hat or shoes.
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22.发明授权公开(公告)号：US09398714B1
公开(公告)日：2016-07-19
申请号：US14229671
申请日：2014-03-28
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more metal foils, each metal foil electrically coupled at one end to an electrical connection point of the electrical module and at another end to an electrically conductive wire. The electrically conductive wire is stitched to the metal foil and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board. The metal foils can be formed from interconnects on the printed circuit board or the metal foils can be separate elements coupled to the printed circuit board.
Abstract translation: 可穿戴电子组件包括耦合到可穿戴电子织物的一个或多个电子模块。 所述一个或多个电子模块中的每一个包括一个或多个金属箔，每个金属箔在一端电连接到电气模块的电连接点，另一端电连接到导电线。 导电线被缝合到金属箔和连接到电子模块的织物上。 电子模块可以包括耦合到印刷电路板的一个或多个电子部件。 金属箔可以由印刷电路板上的互连形成，或者金属箔可以是与印刷电路板耦合的分离元件。
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23.发明申请INTEGRATED SYSTEM OF AN ELECTRONIC MODULE AND CONDUCTIVE FABRIC AND METHOD OF MAKING THE SAME 审中-公开电子模块和导电织物的集成系统及其制造方法公开(公告)号：US20160183367A1
公开(公告)日：2016-06-23
申请号：US14574944
申请日：2014-12-18
Applicant: FLEXTRONICS AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Murad Kurwa
CPC classification number: H05K1/038 , H05K1/0283 , H05K1/0366 , H05K1/0373 , H05K1/09 , H05K1/113 , H05K1/115 , H05K1/181 , H05K3/10 , H05K3/32 , H05K3/42 , H05K9/009 , H05K2201/05 , H05K2201/0959 , H05K2201/10242 , H05K2201/10295 , H05K2201/10303
Abstract: An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.
Abstract translation: 提供了一种将电子模块组装到导电织物上的电子模块组件和方法。 电子模块组件包括非导电织物和覆盖非导电织物的第一侧的至少一部分的导电织物。 电子模块设置在导电织物上，电子模块的一部分包括限定通孔的壁。 穿过通孔并穿过导电织物的紧固件构造成将电子模块电连接到导电织物上。
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24.发明申请公开(公告)号：US20160157363A1
公开(公告)日：2016-06-02
申请号：US14558357
申请日：2014-12-02
Applicant: FLEXTRONICS AP, LLC
Inventor： Anwar Mohammed , Weifeng Liu , Murad Kurwa
CPC classification number: H05K1/0283 , B29C65/72 , B29L2031/3425 , H05K1/028 , H05K1/0284 , H05K1/0296 , H05K1/092 , H05K3/0058 , H05K3/125 , H05K3/20 , H05K2201/0133 , H05K2201/0323
Abstract: A method and apparatus for forming a conductor on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface is described. An amount of conductive material needed to form a conductor between two points on a surface of an object is determined. The determined amount of conductive material is deposited on a substrate. The substrate with the deposited conductive material is applied to the object to form a conductor between the two points on the surface of the object. The conductive material and substrate may be stretchable. The conductive material may be deposited by an inkjet printer or an embedded 3-D printer. The substrate with the deposited conductive material may be applied to the object by laminating the substrate with the deposited conductive material to the object.
Abstract translation: 描述了在不均匀的二维（2-D）或三维（3-D）表面上形成导体的方法和装置。 确定在物体表面上的两个点之间形成导体所需的导电材料的量。 将确定量的导电材料沉积在基底上。 将具有沉积的导电材料的基板施加到物体上以在物体的表面上的两个点之间形成导体。 导电材料和基底可以是可拉伸的。 导电材料可以由喷墨打印机或嵌入式三维打印机进行沉积。 具有沉积的导电材料的衬底可以通过将衬底与沉积的导电材料层压到物体上而被施加到物体。
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公开(公告)号：US11051401B2
公开(公告)日：2021-06-29
申请号：US16201116
申请日：2018-11-27
Applicant: FLEXTRONICS AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Murad Kurwa
IPC: H05K1/03 , H05K1/11 , H01L23/48 , D03D1/00 , H05K1/09 , H05K1/18 , H05K3/10 , H05K3/32 , H05K9/00 , H05K1/02 , H05K3/42
Abstract: An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.
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Patent Agency Ranking
公开(公告)号：US10993635B1
公开(公告)日：2021-05-04
申请号：US15077278
申请日：2016-03-22
Applicant: Flextronics AP, LLC
Inventor： William Uy , Weifeng Liu , Dason Cheung , Jie Lian , Christian Biederman , Anwar Mohammed , Murad Kurwa
IPC: A61B5/0416 , A61B5/00
Abstract: An electronic sensor device has one or more sensor electrodes and one or more electrical conductors printed on a substrate. Textile layers are attached on either side of the substrate with access to the electrical conductors provided by a conductive snap assembly. The substrate can be a TPU (thermoplastic polyurethane) film. The sensor can be a biosensor, and the biosensor is attached to a compression textile, such as a compression shirt, and electrically interconnected using printed conductive ink interconnects to a conductive snap button.
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公开(公告)号：US09763326B1
公开(公告)日：2017-09-12
申请号：US14304029
申请日：2014-06-13
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.
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公开(公告)号：US09699902B1
公开(公告)日：2017-07-04
申请号：US14340432
申请日：2014-07-24
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , David Geiger , Anwar Mohammed
CPC classification number: H05K1/144 , H05K1/0271 , H05K1/09 , H05K1/097 , H05K1/115 , H05K1/116 , H05K3/36 , H05K3/42 , H05K3/4623 , H05K2201/035 , H05K2201/0394 , H05K2201/044 , H05K2201/096 , H05K2203/0545 , H05K2203/061 , H05K2203/1131
Abstract: A printed circuit board is formed from a plurality of thinner PCBs stacked on top of each other with an intermediate metal interconnect material selectively positioned between adjacent PCBs. The metal interconnect material is selectively positioned on surface contact points of correspondingly aligned plated through holes on the adjacent printed circuit boards. The stacked printed circuit boards and intermediate metal interconnect material are laminated, thereby sintering the metal interconnect material and the surface contact points of the plated through holes to form electrical interconnects between plated through holes on adjacent printed circuit boards. The metal interconnect material is preferably the same as the plating material used to plate the through holes, such as copper.
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公开(公告)号：US09674952B1
公开(公告)日：2017-06-06
申请号：US14482977
申请日：2014-09-10
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Zhen Feng
CPC classification number: H05K1/092 , H05K3/125 , H05K3/247 , H05K3/4007
Abstract: An electrical interconnect includes a copper pillar and solder cap. The copper pillar and solder cap are formed onto a contact pad or an under bump metallurgy (UBM). In some applications, the contact pad or UBM is part of an electronic component, such as a semiconductor chip. In other cases, the contact pad is part of laminated substrate, such as a printed circuit board (PCB), or a ceramic substrate. The copper pillar and the solder cap are printed using an ink printer, such as an aerosol ink jet printer. A post heat treatment solidifies the interconnection between the contact pad or UBM, the copper pillar and the solder cap.
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公开(公告)号：US09554465B1
公开(公告)日：2017-01-24
申请号：US14593849
申请日：2015-01-09
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Dick Pang , Murad Kurwa
CPC classification number: H05K1/092 , H05K1/0283 , H05K1/03 , H05K1/0393 , H05K1/147 , H05K1/183 , H05K3/285 , H05K2201/0133 , H05K2201/0162 , H05K2201/09218 , H05K2201/09227 , H05K2201/09263 , H05K2201/09281
Abstract: A stretchable interconnect includes a plurality of electrically conductive traces formed as a complex pattern on an elastic substrate. The form of the electrically conductive traces is such that when the elastic substrate is in a relaxed, or non-stretched, state each of the electrically conductive traces forms a tortuous path, such as a waveform, along the elastic substrate. The tortuous path of the electrically conductive traces provides slack such that as the elastic substrate is stretched the slack is taken up. Once released, the elastic substrate moves from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the electrically conductive traces in the form of the original tortuous path.
Abstract translation: 可拉伸互连件包括在弹性基底上形成为复合图案的多个导电迹线。 导电迹线的形式使得当弹性基底处于松弛或非拉伸状态时，每个导电迹线沿着弹性基底形成诸如波形的曲折路径。 导电迹线的弯曲路径提供松弛，使得当弹性基底被拉伸时松弛松弛。 一旦释放，弹性基板从拉伸位置移动到松弛的非拉伸位置，并且以原始曲折路径的形式将松弛重新引入导电迹线。
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