公开(公告)号：US10993635B1

公开(公告)日：2021-05-04

申请号：US15077278

申请日：2016-03-22

Applicant: Flextronics AP, LLC

Inventor： William Uy ,  Weifeng Liu ,  Dason Cheung ,  Jie Lian ,  Christian Biederman ,  Anwar Mohammed ,  Murad Kurwa

IPC: A61B5/0416 ,  A61B5/00

Abstract: An electronic sensor device has one or more sensor electrodes and one or more electrical conductors printed on a substrate. Textile layers are attached on either side of the substrate with access to the electrical conductors provided by a conductive snap assembly. The substrate can be a TPU (thermoplastic polyurethane) film. The sensor can be a biosensor, and the biosensor is attached to a compression textile, such as a compression shirt, and electrically interconnected using printed conductive ink interconnects to a conductive snap button.

公开(公告)号：US09894820B1

公开(公告)日：2018-02-13

申请号：US14609139

申请日：2015-01-29

Applicant: Flextronics AP, LLC

Inventor： Virgilio Encabo Bautista, Sr. ,  William Uy

IPC: H05K13/04 ,  B23K1/018

CPC classification number: H05K13/0486 ,  B23K1/018

Abstract: Methods of and devices for removing SMT DDR DIMM connectors are provided. The devices are configured to remove long SMT DDR DIMM connectors softly and automatically, including DDR 3 and DDR 4 DIMM connectors. In the event when any solder is not melted, the device comprises a release mechanism to automatically release the connectors, such that damages to the connector can be avoided.