公开(公告)号：US20200227277A1

公开(公告)日：2020-07-16

申请号：US16716883

申请日：2019-12-17

Applicant: CORNING INCORPORATED

Inventor： Philip Simon Brown ,  Yunfeng Gu ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L21/48 ,  H01L23/15 ,  H01L23/498

Abstract: A method of forming an article, comprising: forming an adhesion layer comprising MnOx on a glass, glass-ceramic or ceramic wafer; calcining the adhesion layer such that a first portion of the MnOx of the adhesion layer is chemically bonded to the wafer; depositing a metal layer on the adhesion layer; and processing the metal layer and the adhesion layer such that a portion of the MnOx of the adhesion layer is chemically bonded to the metal layer.

公开(公告)号：US20190327840A1

公开(公告)日：2019-10-24

申请号：US16386639

申请日：2019-04-17

Applicant: Corning Incorporated

Inventor： Dana Craig Bookbinder ,  Yunfeng Gu ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H05K3/38 ,  H05K3/18 ,  H05K3/00 ,  H05K3/42 ,  H05K1/03 ,  H05K1/11 ,  H05K1/09

Abstract: In some embodiments, a method comprises leaching a surface of a glass or glass ceramic substrate to form a leached layer. The glass or glass ceramic substrate comprises a multi-component material. The material has a bulk composition, in mol % on an oxide basis: 51% to 90% SiO2; 10% to 49% total of minority components ROx. Leaching comprises selectively removing components ROx of the glass or glass ceramic substrate preferentially to removal of SiO2. In the leached layer, the ROx concentration is 50% or less than the ROx concentration of the bulk composition.

公开(公告)号：US20190313524A1

公开(公告)日：2019-10-10

申请号：US16376467

申请日：2019-04-05

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Mandakini Kanungo ,  Ekaterina Kuksenkova ,  Prantik Mazumder ,  Chad Byron Moore ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H05K1/02 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/11 ,  H05K1/03

Abstract: An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.

公开(公告)号：US12013619B2

公开(公告)日：2024-06-18

申请号：US17040073

申请日：2019-03-26

Applicant: CORNING INCORPORATED

Inventor： Ming-Huang Huang ,  Robert Bumju Lee ,  Rajesh Vaddi ,  Bin Zhu

IPC: G02F1/1368 ,  H01L29/786

CPC classification number: G02F1/1368 ,  H01L29/78681 ,  G02F1/13685

Abstract: A thin film transistor (TFT) liquid crystal display (LCD) comprises a plurality of image pixels demarcated between an overlying liquid crystal display layer and an underlying glass substrate. Each image pixel comprises a dedicated top-gate TFT disposed over the glass substrate. Each top-gate thin film transistor comprises a process sensitive semiconductor layer disposed over the glass substrate, and a source electrode and a drain electrode disposed over the process sensitive semiconductor layer. The process sensitive semiconductor layer forms a process sensitive semiconductor active layer between the source electrode and the drain electrode and an active layer protection film is disposed over the process sensitive semiconductor active layer. A gate dielectric layer is disposed over the active layer protection film between the source electrode and the drain electrode and a gate electrode is disposed over the gate dielectric layer.

公开(公告)号：US11777067B2

公开(公告)日：2023-10-03

申请号：US17697196

申请日：2022-03-17

Applicant: CORNING INCORPORATED

Inventor： Jiangwei Feng ,  Sean Matthew Garner ,  Jen-Chieh Lin ,  Robert George Manley ,  Timothy James Orsley ,  Richard Curwood Peterson ,  Michael Lesley Sorensen ,  Pei-Lien Tseng ,  Rajesh Vaddi ,  Lu Zhang

IPC: H01L33/62 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L2933/0066

Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

公开(公告)号：US20220399242A1

公开(公告)日：2022-12-15

申请号：US17846320

申请日：2022-06-22

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  C23C26/00 ,  H01L21/48 ,  H01L23/498

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

公开(公告)号：US11456225B2

公开(公告)日：2022-09-27

申请号：US17217027

申请日：2021-03-30

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Philip Simon Brown ,  Mandakini Kanungo ,  Prantik Mazumder ,  Rajesh Vaddi

IPC: H01L23/15 ,  C23C26/00 ,  H01L21/48 ,  H01L23/498

Abstract: A method of manufacturing a glass article comprises: (A) forming a first layer of catalyst metal on a glass substrate; (B) heating the glass substrate; (C) forming a second layer of an alloy of a first metal and a second metal on the first layer; (D) heating the glass substrate, thereby forming a glass article comprising: (i) the glass substrate; (ii) an oxide of the first metal covalently bonded thereto; and (iii) a metallic region bonded to the oxide, the metallic region comprising the catalyst, first, and second metals. In embodiments, the method further comprises (E) forming a third layer of a primary metal on the metallic region; and (F) heating the glass article thereby forming the glass article comprising: (i) the oxide of the first metal covalently bonded the glass substrate; and (ii) a new metallic region bonded to the oxide comprising the catalyst, first, second, and primary metals.

公开(公告)号：US11329228B2

公开(公告)日：2022-05-10

申请号：US16471446

申请日：2017-12-19

Applicant: CORNING INCORPORATED

Inventor： Robert George Manley ,  Karan Mehrotra ,  Barry James Paddock ,  Rajesh Vaddi ,  Nikolay Zhelev Zhelev ,  Bin Zhu

IPC: H01L51/00 ,  G03F7/20 ,  H01L51/05 ,  G03F7/40

Abstract: A method of fabricating microstructures of polar elastomers includes coating a substrate with a dielectric material including a polar elastomer, coating the dielectric material with a photoresist, exposing the photoresist to ultraviolet (UV) light through a photomask to define a pattern on the photoresist, developing the photoresist to form the pattern on the photoresist, etching the dielectric material to transfer the pattern from the photoresist to the dielectric material, and removing the photoresist from the patterned dielectric material.

公开(公告)号：US11201109B2

公开(公告)日：2021-12-14

申请号：US16776663

申请日：2020-01-30

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H01L23/15 ,  H01L23/48 ,  H01L23/492 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/768 ,  C03C17/06 ,  C03C3/06 ,  C03C15/00 ,  C03C23/00 ,  H05K3/38 ,  C25D7/12 ,  C03C3/076 ,  H01L21/48 ,  H01L23/00 ,  H05K3/00 ,  H05K3/42

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US11152294B2

公开(公告)日：2021-10-19

申请号：US16376467

申请日：2019-04-05

Applicant: Corning Incorporated

Inventor： Tian Huang ,  Mandakini Kanungo ,  Ekaterina Aleksandrovna Kuksenkova ,  Prantik Mazumder ,  Chad Byron Moore ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: H01L23/15 ,  H01L23/48 ,  H01L23/492 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  C03C15/00 ,  C23C18/38 ,  H01L21/768 ,  H05K3/38 ,  C23C14/18 ,  C23C28/02 ,  C03C17/06 ,  C03C3/06 ,  C03C23/00 ,  C03C17/00 ,  H05K3/42 ,  C25D7/12 ,  C03C3/076 ,  H01L21/48 ,  H01L23/00 ,  H05K3/00

Abstract: An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.