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公开(公告)号：US11764343B2
公开(公告)日：2023-09-19
申请号：US16982217
申请日：2019-12-19
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Yingwei Liu , Zhijun Lv , Ke Wang , Zhanfeng Cao , Hsuanwei Mai , Guangcai Yuan , Muxin Di
IPC: H01L33/62 , H01L23/00 , H01L25/075
CPC classification number: H01L33/62 , H01L24/03 , H01L24/05 , H01L25/0753 , H01L2224/0219 , H01L2224/02166 , H01L2224/02185 , H01L2224/03013 , H01L2224/03462 , H01L2224/03614 , H01L2224/03622 , H01L2224/0401 , H01L2224/05017 , H01L2224/0518 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2933/0066
Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.
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公开(公告)号：US20220199650A1
公开(公告)日：2022-06-23
申请号：US17057546
申请日：2020-03-24
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ke Wang , Muxin Di , Zhiwei Liang , Guoqiang Wang , Renquan Gu , Xiaoxin Song , Xiaoyan Zhu , Yingwei Liu , Zhanfeng Cao
IPC: H01L27/12
Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.
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公开(公告)号：US11289464B2
公开(公告)日：2022-03-29
申请号：US16632167
申请日：2019-08-06
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei Liang , Yingwei Liu , Muxin Di , Ke Wang , Zhanfeng Cao , Shibo Jiao
Abstract: A display substrate, a method for fabricating the same, and a display device are provided. The display substrate includes: a substrate 100 that includes a first via filled with a first conductive section 4011; a drive thin film transistor that is placed on a first side of the substrate and includes a first terminal 2051; and a light emitting diode chip 300 that is placed on a second side of the substrate distal to the drive thin film transistor; wherein the light emitting diode chip 300 includes a first lead 301 and a second lead 302; the first lead 301 is in electrical contact with the first terminal 2051 through the first conductive section 4011; and the second lead 302 is in electrical contact with a second electrode 402 that is placed on the second side of the substrate.
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公开(公告)号：US20210408052A1
公开(公告)日：2021-12-30
申请号：US16755652
申请日：2019-05-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Muxin Di , Ke Wang , Yingwei Liu , Xiaoyan Zhu , Zhanfeng Cao , Guangcai Yuan
Abstract: An array substrate is provided. The array substrate includes a base substrate; a first bonding pad layer including a plurality of first bonding pads on a first side of the base substrate; a second bonding pad layer including a plurality of second bonding pads on a second side of the base substrate, wherein the second side is opposite to the first side; and a plurality of signal lines on a side of the second bonding pad layer away from the base substrate. A respective one of the plurality of second bonding pads extends through the base substrate to electrically connect to a respective one of the plurality of first bonding pads. The respective one of the plurality of first bonding pads includes a protruding portion protruding away from the first side of the base substrate along a direction from the second side to the first side.
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Patent Agency Ranking
25.发明授权公开(公告)号：US11121068B2
公开(公告)日：2021-09-14
申请号：US16530605
申请日：2019-08-02
Applicant: BOE Technology Group Co., Ltd.
Inventor： Muxin Di , Zhiwei Liang , Yingwei Liu , Ke Wang , Zhanfeng Cao , Renquan Gu , Qi Yao , Jaiil Ryu
IPC: H01L23/498 , H01L21/48
Abstract: Embodiments of the present disclosure provide an array substrate, a display device, a method for manufacturing an array substrate, a method for manufacturing a display device, and a spliced display device. The array substrate includes: a base substrate in which a through hole is provided; a filling portion disposed in the through hole, including a recessed structure and made from a flexible material; an electrically conductive pattern disposed on the filling portion and at least partially located in the recessed structure; and a film layer disposed on a side of the electrically conductive pattern facing away from the base substrate.
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26.发明申请公开(公告)号：US20210217837A1
公开(公告)日：2021-07-15
申请号：US16761823
申请日：2019-03-26
Applicant: BOE Technology Group Co., Ltd.
Inventor： Renquan Gu , Qi Yao , Jaiil Ryu , Zhiwei Liang , Yingwei Liu , Wusheng Li , Muxin Di
IPC: H01L27/32
Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.
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公开(公告)号：US20200328266A1
公开(公告)日：2020-10-15
申请号：US16651551
申请日：2019-11-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yingwei Liu , Qi Yao , Ke Wang , Zhanfeng Cao , Zhiwei Liang , Muxin Di , Guangcai Yuan , Xue Jiang , Dongni Liu
Abstract: The present disclosure relates to a method of manufacturing an array substrate. The method of manufacturing an array substrate may include forming a main via hole in a substrate, filling a first conductive material in the main via hole, and forming a pixel circuit layer on a first surface of the substrate. The pixel circuit layer may include a first via hole. An orthographic projection of the first via hole on the substrate may at least partially overlap the corresponding main via hole.
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公开(公告)号：US10726237B2
公开(公告)日：2020-07-28
申请号：US16104604
申请日：2018-08-17
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Yingwei Liu , Wenqian Luo , Qingzhao Liu , Muxin Di
IPC: G06K9/00 , H01L27/12 , H01L31/0216 , H01L31/105 , H01L31/18
Abstract: A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.
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29.发明申请公开(公告)号：US20200042761A1
公开(公告)日：2020-02-06
申请号：US16104604
申请日：2018-08-17
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Yingwei Liu , Wenqian Luo , Qingzhao Liu , Muxin Di
IPC: G06K9/00 , H01L27/12 , H01L31/105 , H01L31/18 , H01L31/0216
Abstract: A fingerprint identification sensor, a method of fabricating the same, and a fingerprint identification apparatus are provided. The fingerprint identification sensor includes: a substrate; a plurality of sensor units on the substrate, each of the sensor units comprising a thin film transistor and a photosensitive device; wherein the thin film transistor comprises a source and a drain, an active layer and a gate, the source and the drain being arranged substantially in a direction perpendicular to the substrate surface.
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