公开(公告)号：US12070797B1

公开(公告)日：2024-08-27

申请号：US17447790

申请日：2021-09-15

Applicant: Apple Inc.

Inventor： Anthony D. Prescenzi ,  Abhijeet Misra ,  Adam T. Clavelle ,  Eric W. Hamann ,  Isabel Yang ,  Brian M. Gable ,  James A. Yurko

IPC: B33Y80/00 ,  B22F10/25 ,  B22F10/66 ,  B32B15/01 ,  B33Y10/00 ,  B33Y40/20

CPC classification number: B22F10/25 ,  B22F10/66 ,  B32B15/01 ,  B33Y10/00 ,  B33Y40/20 ,  B33Y80/00

Abstract: A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.

公开(公告)号：US20240284624A1

公开(公告)日：2024-08-22

申请号：US18650720

申请日：2024-04-30

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  A45C11/00 ,  G06F1/16 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/04 ,  A45C11/00 ,  G06F1/1626 ,  H04M1/0283 ,  H05K5/0004 ,  H05K5/0213 ,  H05K5/03 ,  A45C2011/002 ,  G06F2200/1633

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US20220062998A1

公开(公告)日：2022-03-03

申请号：US17444586

申请日：2021-08-06

Applicant: Apple Inc.

Inventor： Robert W. Hyers ,  James A. Yurko ,  Eric W. Hamann ,  Brian M. Gable

IPC: B22F12/49 ,  B33Y10/00 ,  B33Y30/00 ,  B28B1/00 ,  B22F10/28 ,  B22F12/41 ,  B22F12/45

Abstract: A method of forming a part can include selectively activating one or more lasers of a laser array comprising at least 100 lasers based at least partially on a geometry of the part being formed. The method can further include scanning laser spots over a powder bed, the laser sports generated by the activated lasers, and selectively sintering a powder contained in the powder bed with the laser spots to form the part.

公开(公告)号：US20210159477A1

公开(公告)日：2021-05-27

申请号：US16953656

申请日：2020-11-20

Applicant: Apple Inc.

Inventor： Hoishun Li ,  Herng-Jeng Jou ,  James A. Yurko ,  Wai Man Raymund Kwok ,  Zechariah D. Feinberg ,  Daniel C. Wagman ,  Eric S. Jol ,  Hani Esmaeili

IPC: H01M2/26 ,  H01M10/0525 ,  C22C5/06 ,  C22C9/00

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include at least one of copper or silver.

公开(公告)号：US20200245487A1

公开(公告)日：2020-07-30

申请号：US16449061

申请日：2019-06-21

Applicant: Apple Inc.

Inventor： William A. Counts ,  Andrew W. Meschke ,  Lei Gao ,  Abhijeet Misra ,  Alexander W. Williams ,  Hoishun Li ,  Lee E. Hooton ,  Michael B. Wittenberg ,  James A. Yurko

IPC: H05K5/04 ,  H04M1/02 ,  G06F1/16 ,  A45C11/00 ,  H05K5/03 ,  H05K5/00 ,  H05K5/02

Abstract: A composite housing of an electronic device can include a metal shell including a first material having a first set of material properties and a surface at least partially defining an exterior surface of the electronic device. The composite housing can also include an interior portion including a second material having a second set of material properties independent of the first set of material properties and at least partially defining a feature. The interior portion can be bonded to the shell and disposed interior to the surface of the shell.

公开(公告)号：US20200048744A1

公开(公告)日：2020-02-13

申请号：US16530830

申请日：2019-08-02

Applicant: Apple Inc.

Inventor： Brian M. Gable ,  Herng-Jeng Jou ,  Weiming Huang ,  Graeme W. Paul ,  William A. Counts ,  Eric W. Hamann ,  Katie L. Sassaman ,  Abhijeet Misra ,  Zechariah D. Feinberg ,  James A. Yurko ,  Brian P. Demers ,  Rafael Yu ,  Anuj Datta Roy ,  Susannah P. Calvin

IPC: C22C21/00 ,  C22F1/04 ,  C22C1/02

Abstract: The disclosure provides an aluminum alloy may include iron (Fe) of at least 0.10 wt %, silicon (Si) of at least 0.35 wt %, and magnesium (Mg) of at least 0.45 wt %, manganese (Mn) in amount of at least 0.005 wt %, and additional elements, the remaining wt % being Al and incidental impurities.

公开(公告)号：US10280494B2

公开(公告)日：2019-05-07

申请号：US14813862

申请日：2015-07-30

Applicant: Apple Inc.

Inventor： James A. Yurko ,  Edgar E. Vidal ,  Nicholas W. Hutchinson ,  Jeffrey L. Mattlin ,  Theodore A. Waniuk

IPC: C22C1/00 ,  C22C45/10

Abstract: The disclosure is directed to Zr and Hf bearing alloys that are capable of forming a metallic glass, and more particularly metallic glass rods with diameters at least 1 mm and as large as 5 mm or larger. The disclosure is further directed to Zr and Hf bearing alloys that demonstrate a favorable combination of glass forming ability, strength, toughness, bending ductility, and/or corrosion resistance.