公开(公告)号：US11985781B2

公开(公告)日：2024-05-14

申请号：US17446432

申请日：2021-08-30

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Hoishun Li ,  James A. Yurko

IPC: H04M1/02 ,  B21D22/02 ,  H05K5/02 ,  C21D7/06 ,  C22F1/00

CPC classification number: H05K5/0286 ,  B21D22/02 ,  H04M1/026

Abstract: A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.

公开(公告)号：US20220304175A1

公开(公告)日：2022-09-22

申请号：US17805641

申请日：2022-06-06

Applicant: Apple Inc.

Inventor： Eric W. Hamann ,  Abhijeet Misra ,  Anthony D. Prescenzi ,  Brian M. Gable ,  Christopher D. Prest ,  Hoishun Li ,  James A. Yurko ,  Lee E. Hooton ,  Michael B. Wittenberg ,  Richard H. Dinh ,  Jennifer D. Schuler

IPC: H05K5/04 ,  H05K5/00 ,  H05K5/02

Abstract: A component for an electronic device can include a pre-formed substrate comprising a first metal and an additively manufactured portion bonded to the pre-formed substrate. The additively manufactured portion can include a first portion comprising a second metal and defining a volume, the first portion having a first value of a material property, and a second portion disposed in the volume, the second portion having a second value of the material property that is different from the first value.

公开(公告)号：US20220095467A1

公开(公告)日：2022-03-24

申请号：US17446432

申请日：2021-08-30

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Hoishun Li ,  James A. Yurko

IPC: H05K5/02 ,  B21D22/02

Abstract: A component for an electronic device can include a metal injection molded (MIM) metallic body that at least partially defines an exterior surface. The metallic body can have an average porosity less than 1% in a first region that extends from the external surface to a depth of at least 100 microns below the external surface, and an average porosity greater than 1% in a second region adjacent to the first region.

公开(公告)号：US20190169717A1

公开(公告)日：2019-06-06

申请号：US16212479

申请日：2018-12-06

Applicant: Apple Inc.

Inventor： Hoishun Li ,  James A. Yurko ,  Herng-Jeng Jou ,  James A. Wright

IPC: C22C21/08 ,  C22C1/02

Abstract: The disclosure provides aluminum alloys with high tensile strength and appealing cosmetics and improved tensile yield strength. The aluminum alloys include 0.5 to 3.0 wt % Mg and 0.2 to 3.0 wt % Si. The alloys have a weight ratio of Mg to Si ranging from 2 to 4.