公开(公告)号：US20230032854A1

公开(公告)日：2023-02-02

申请号：US17965491

申请日：2022-10-13

Applicant: Applied Materials, Inc.

Inventor： Charles T. Carlson ,  Jason M. Schaller ,  Luke Bonecutter ,  David Blahnik

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/687 ,  H01L21/68

Abstract: Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.

公开(公告)号：US11476135B2

公开(公告)日：2022-10-18

申请号：US16922447

申请日：2020-07-07

Applicant: Applied Materials, Inc.

Inventor： Charles T. Carlson ,  Jason M. Schaller ,  Luke Bonecutter ,  David Blahnik

IPC: H01L21/68 ,  H01L21/67 ,  B65G47/90 ,  H01L21/687

Abstract: Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.

公开(公告)号：US11315806B2

公开(公告)日：2022-04-26

申请号：US16400516

申请日：2019-05-01

Applicant: Applied Materials, Inc.

Inventor： Jason M. Schaller ,  Robert Brent Vopat ,  Paul E. Pergande ,  Benjamin B. Riordon ,  David Blahnik ,  William T. Weaver

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/673 ,  H01L21/687

Abstract: Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.

公开(公告)号：US20210343500A1

公开(公告)日：2021-11-04

申请号：US17378327

申请日：2021-07-16

Applicant: APPLIED Materials, Inc.

Inventor： Costel Biloiu ,  Michael Honan ,  Robert B. Vopat ,  David Blahnik ,  Charles T. Carlson ,  Frank Sinclair ,  Paul Murphy

IPC: H01J37/30 ,  H01J37/317 ,  H01J23/213 ,  H01J23/18 ,  H01J25/02 ,  H01J25/58 ,  H01J37/32 ,  H01P7/00 ,  H01P7/08 ,  H01P7/06

Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.

公开(公告)号：US11094504B2

公开(公告)日：2021-08-17

申请号：US16734746

申请日：2020-01-06

Applicant: APPLIED Materials, Inc.

Inventor： Costel Biloiu ,  Michael Honan ,  Robert B Vopat ,  David Blahnik ,  Charles T. Carlson ,  Frank Sinclair ,  Paul Murphy

IPC: H01J37/30 ,  H01J37/317 ,  H01J23/213 ,  H01J23/18 ,  H01J25/02 ,  H01J25/58 ,  H01J37/32 ,  H01P7/00 ,  H01P7/08 ,  H01P7/06

Abstract: Embodiments herein are directed to a resonator for an ion implanter. In some embodiments, a resonator may include a housing, and a first coil and a second coil partially disposed within the housing. Each of the first and second coils may include a first end including an opening for receiving an ion beam, and a central section extending helically about a central axis, wherein the central axis is parallel to a beamline of the ion beam, and wherein an inner side of the central section has a flattened surface.

公开(公告)号：US20210013067A1

公开(公告)日：2021-01-14

申请号：US16922447

申请日：2020-07-07

Applicant: Applied Materials, Inc.

Inventor： Charles T. Carlson ,  Jason M. Schaller ,  Luke Bonecutter ,  David Blahnik

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68 ,  H01L21/687

Abstract: Exemplary substrate processing systems may include a transfer region housing defining an internal volume. A sidewall of the transfer region housing may define a sealable access for providing and receiving substrates. The systems may include a plurality of substrate supports disposed within the transfer region. The systems may also include a transfer apparatus having a central hub including a first shaft and a second shaft concentric with and counter-rotatable to the first shaft. The transfer apparatus may include a first end effector coupled with the first shaft. The first end effector may include a plurality of first arms. The transfer apparatus may also include a second end effector coupled with the second shaft. The second end effector may include a plurality of second arms having a number of second arms equal to the number of first arms of the first end effector.

公开(公告)号：US20190019708A1

公开(公告)日：2019-01-17

申请号：US16127702

申请日：2018-09-11

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67754 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68764 ,  H01L21/68771

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.

公开(公告)号：US10103046B2

公开(公告)日：2018-10-16

申请号：US15099760

申请日：2016-04-15

Applicant: Applied Materials, Inc.

Inventor： William T. Weaver ,  Jason M. Schaller ,  Robert Brent Vopat ,  David Blahnik ,  Benjamin B. Riordon ,  Paul E. Pergande

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/687

Abstract: Buffer chamber including robots, a carousel and at least one heating module for use with a batch processing chamber are described. Robot configurations for rapid and repeatable movement of wafers into and out of the buffer chamber and cluster tools incorporating the buffer chambers and robots are described.