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    Band Adjustment for Electronic Devices
    21.
    发明申请
    Band Adjustment for Electronic Devices 有权

    公开(公告)号：US20210360100A1

    公开(公告)日：2021-11-18

    申请号：US17386316

    申请日：2021-07-27

    Applicant: Apple Inc.

    Inventor： David I. Nazzaro ,  Erik G. De Jong ,  Steven J. Martisauskas ,  Tyler S. Bushnell

    IPC: H04M1/72454 ,  H04B1/3827

    Abstract: Systems and methods for performing damping analyses on a device are disclosed. The damping analyses may be used by a device in numerous ways. For example, in some embodiments, damping analyses are used to determine whether a device is being worn or held by a user. In some embodiments, damping analyses are used to determine which user of multiple users is wearing a device. In some embodiments, damping analyses are used to determine the body composition of a user who is holding or wearing the device. In some embodiments, damping analyses are used to determine how much force a user is applying to a device via a touch input. In some embodiments, damping analyses are used to determine whether and to what extent a sensor is in contact with a body of a user.

    Co-molded ceramic and polymer structure
    22.
    发明授权
    Co-molded ceramic and polymer structure 有权

    公开(公告)号：US10463125B2

    公开(公告)日：2019-11-05

    申请号：US15694948

    申请日：2017-09-04

    Applicant: Apple Inc.

    Inventor： David I. Nazzaro ,  Joseph C. Poole ,  Kevin M. Kenney ,  Naoto Matsuyuki

    IPC: B65D41/28 ,  A45C11/00 ,  B29C45/14 ,  B29K709/02 ,  B29K101/12 ,  B29L31/34 ,  B29K101/10

    Abstract: A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

    Interlocking ceramic and optical members
    24.
    发明授权
    Interlocking ceramic and optical members 有权

    公开(公告)号：US10200516B2

    公开(公告)日：2019-02-05

    申请号：US14472230

    申请日：2014-08-28

    Applicant: Apple Inc.

    Inventor： David I. Nazzaro ,  Naoto Matsuyuki ,  Raul A. Molina ,  Fletcher R. Rothkopf ,  Chin San Han

    IPC: H04M1/26 ,  H05K5/02 ,  H01L27/146 ,  H04M1/02

    Abstract: Interlocking first member and optical members and methods of their manufacture. A component formed from an interlocking first member and optical member, where the first member includes a recess formed within a surface and the optical member is disposed in the recess. The recess of the first member may include a recess geometry and the optical member may include a member geometry that may correspond to the recess geometry. Additionally, the interlocking component formed from the first member and optical member may be formed by a coupling process. The coupling process may include sintering the first member and the optical member, bonding the optical member to the first member or providing a compression-load or fit between the first member and the optical member.

    ELECTRONIC DEVICE WITH HIDDEN CONNECTOR
    27.
    发明申请
    ELECTRONIC DEVICE WITH HIDDEN CONNECTOR 有权
    具有隐形连接器的电子设备

    公开(公告)号：US20150357741A1

    公开(公告)日：2015-12-10

    申请号：US14299921

    申请日：2014-06-09

    Applicant: APPLE INC.

    Inventor： David I. Nazzaro ,  Tyler S. Bushnell ,  Ibuki Kamei

    IPC: H01R13/44 ,  H01R13/46

    CPC classification number: H01R13/5216 ,  H01R13/44 ,  H01R13/453 ,  H01R13/46 ,  H01R13/52 ,  H01R24/58

    Abstract: An electronic device has a self-healing elastomer applied over one or more external electronic connectors. The self-healing elastomer may obscure the electronic connectors from the user as well as provide environmental protection for the connector and the electronic device. Electronic probes may temporarily penetrate the self-healing elastomer to mate with the electronic connector. After removal of the probes the self-healing elastomer may elastically reform and self-heal.

    Abstract translation: 电子设备具有应用于一个或多个外部电子连接器上的自愈弹性体。 自愈弹性体可能使用户的电子连接器变得模糊，并且为连接器和电子设备提供环境保护。 电子探针可以临时穿透自愈弹性体以与电子连接器配合。 在去除探针之后，自愈弹性体可以弹性改造并自愈。

    Co-finishing surfaces
    30.
    发明授权
    Co-finishing surfaces 有权

    公开(公告)号：US10207387B2

    公开(公告)日：2019-02-19

    申请号：US14714876

    申请日：2015-05-18

    Applicant: Apple Inc.

    Inventor： Naoto Matsuyuki ,  Bin Yi ,  Dezheng Qu ,  Jairam Manjunathaiah ,  Scott M. Nathanson ,  Trevor J. Ness ,  David I. Nazzaro ,  Raul A. Molina

    IPC: B24B37/04 ,  B29C70/74 ,  C03C25/005 ,  B29C70/88 ,  B24B37/025 ,  B24B37/02

    Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.

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